公开(公告)号：US11993695B2

公开(公告)日：2024-05-28

申请号：US17261250

申请日：2019-11-14

Applicant: LG CHEM, LTD.

Inventor： Gi Dae Choi ,  Youngjoo Kim ,  Eon Seok Lee ,  Changhun Yun ,  Minsu Kim

IPC: C08K3/04 ,  B29C48/00 ,  B29C48/40 ,  B29C48/92 ,  C08K3/08 ,  C08K7/06 ,  C08L101/00 ,  H05K9/00 ,  B29K301/12

CPC classification number: C08K3/046 ,  B29C48/0022 ,  B29C48/40 ,  B29C48/92 ,  C08K3/08 ,  C08K7/06 ,  C08L101/00 ,  H05K9/009 ,  B29C2948/92704 ,  B29C2948/92885 ,  B29K2301/12 ,  B29K2995/0011 ,  C08K2003/0843 ,  C08K2003/0856 ,  C08K2003/0862 ,  C08K2201/001 ,  C08K2201/003 ,  C08K2201/006 ,  C08K2201/01 ,  C08K2201/011

Abstract: Provided is a thermoplastic resin composition, including (a) 100 parts by weight of a thermoplastic resin including 80-100% by weight of a base resin and 0-20% by weight of a reinforcing resin; (b) 2-60 parts by weight of linear carbon fibers having an average diameter of 1-15 μm; (c) 1-5 parts by weight of carbon nanofibrils having a BET specific surface area of 200-400 m2/g; (d) 1-15 parts by weight of carbon nanoplates; and (e) 1-25 parts by weight of metal powder, a method of preparing the thermoplastic resin composition, and an injection-molded article manufactured using the thermoplastic resin composition. The thermoplastic resin composition has excellent mechanical properties, e.g., impact strength, and also excellent conductivity, heat resistance, and electromagnetic wave shielding capacity, particularly high shielding efficiency against high-frequency electromagnetic waves, and thus can be used as automobile, electric, and electronic parts, and as a substitute for aluminum alloys and magnesium alloys.

公开(公告)号：US11912868B2

公开(公告)日：2024-02-27

申请号：US16957555

申请日：2019-11-08

Applicant: LG CHEM, LTD.

Inventor： Gi Dae Choi ,  Minsu Kim ,  Eon Seok Lee

IPC: C08L77/02 ,  C08L23/06 ,  C08L23/12 ,  C08L23/16 ,  C08L25/10 ,  C08K3/04

CPC classification number: C08L77/02 ,  C08L23/06 ,  C08L23/12 ,  C08L23/16 ,  C08L25/10 ,  C08K3/046 ,  C08K2201/006

Abstract: The present invention relates to a conductive concentrated resin composition including (a) 100 parts by weight of a base resin including 50 to 95% by weight of a polyamide resin, 2.5 to 20% by weight of a polar polymer, and 2.5 to 30% by weight of a non-polar polymer, (b) 10 to parts by weight of a carbon nanofibril, (c) 0.5 to 5 parts by weight of a carbon nanoplate, and (d) 0.5 to 4 parts by weight of nanoclay; a conductive polyamide resin composition including the conductive concentrated resin composition; a method of preparing the conductive concentrated resin composition; and a molded article including the conductive polyamide resin composition.
When a polyamide alloy resin composition is prepared using the conductive concentrated resin composition of the present invention, compatibility between compositions and dispersion stability may be improved, thereby significantly increasing moisture stability while maintaining mechanical strength, conductivity, heat resistance, and appearance properties equal or superior to those of a conventional conductive polyamide alloy resin composition.

公开(公告)号：US10065860B2

公开(公告)日：2018-09-04

申请号：US15505535

申请日：2015-09-17

Applicant: LG CHEM, LTD.

Inventor： Kwon Il Choi ,  Myong Jo Ham ,  Eon Seok Lee ,  Cheol-Hee Park ,  Han Nah Jeong ,  Jae Hyun Kim ,  Shin Hee Jun ,  Eun Kyu Seong

IPC: C08F2/40 ,  C08F2/00 ,  C08G61/04 ,  C01B15/16 ,  C01G3/00 ,  C01G55/00 ,  C08L55/02 ,  C08G75/0209 ,  C08G65/38

Abstract: The present invention relates to a composition for forming conductive patterns and a resin structure having a conductive pattern, capable of forming a conductive micropattern on various polymer resin products or resin layers using a simplified process and exhibiting excellent heat dissipation characteristics. The composition for forming conductive patterns comprises: a polymer resin; a non-conductive metal compound represented by a specific chemical formula; and a heat-dissipating material, wherein a metal nucleus is formed from the non-conductive metal compound by the irradiation of electromagnetic waves.

公开(公告)号：US11623988B2

公开(公告)日：2023-04-11

申请号：US16957969

申请日：2019-11-14

Applicant: LG CHEM, LTD.

Inventor： Hyun Jin Lee ,  Myong Jo Ham ,  Soongin Kim ,  Eon Seok Lee

IPC: C08L81/02 ,  C08K3/22 ,  B29C45/14 ,  C08G75/0204 ,  C08K3/40 ,  C08K5/53 ,  C08K5/5415 ,  C08K7/14 ,  C08K9/06

Abstract: A polyphenylene sulfide resin composition including (a) 25% to 75% by weight of a base resin; (b) 0.1% to 10% by weight of a laser direct structuring (LDS) additive; (c) 0.1% to 5% by weight of a plating seed generation promoter; (d) 10% to 60% by weight of a glass fiber; and (e) 0% to 40% by weight of a mineral filler, based on a total weight of the polyphenylene sulfide resin composition. The base resin includes 95% by weight or more of a polyphenylene sulfide resin based on a total weight of the base resin. A method of preparing the polyphenylene sulfide resin composition, and an injection-molded article manufactured using the polyphenylene sulfide resin composition.

公开(公告)号：US20200332119A1

公开(公告)日：2020-10-22

申请号：US16957555

申请日：2019-11-08

Applicant: LG CHEM, LTD.

Inventor： Gi Dae Choi ,  Minsu Kim ,  Eon Seok Lee

IPC: C08L77/02 ,  C08L23/16 ,  C08L23/06 ,  C08L23/12 ,  C08L25/10

Abstract: Described are a conductive concentrated resin composition including (a) 100 parts by weight of a base resin including 50% to 95% by weight of a polyamide resin, 2.5% to 20% by weight of a polar polymer, and 2.5% to 30% by weight of a non-polar polymer, (b) 10 parts to 40 parts by weight of a carbon nanofibril, (c) 0.5 parts to 5 parts by weight of a carbon nanoplate, and (d) 0.5 parts to 4 parts by weight of nanoclay; a conductive polyamide resin composition including the conductive concentrated resin composition; a method of preparing the conductive concentrated resin composition; and a molded article including the conductive polyamide resin composition.