THERMOPLASTIC MOULDING COMPOUNDS
    2.
    发明申请
    THERMOPLASTIC MOULDING COMPOUNDS 审中-公开
    热塑性塑料化合物

    公开(公告)号:US20150105506A1

    公开(公告)日:2015-04-16

    申请号:US14513664

    申请日:2014-10-14

    IPC分类号: C08K13/02

    摘要: The present invention relates to mixtures for thermoplastic moulding compositions based on polyamides with the mineral filler triclinic pinacoidal aluminium silicate and with at least one heat stabilizer, and also at least one additional substance, to the production of these, and also to electrically insulating, thermally conductive products to be produced therefrom, in particular mouldings and semifinished products.

    摘要翻译: 本发明涉及用于热塑性模塑组合物的混合物,其基于具有矿物填料三斜晶硅酸铝硅酸盐和至少一种热稳定剂的聚酰胺,以及至少一种另外的物质,用于制备这些物质,并且还用于电绝缘 导电产品由其制造,特别是模制品和半成品。