公开(公告)号：US20230162953A1

公开(公告)日：2023-05-25

申请号：US17913008

申请日：2020-03-23

Applicant: LAM RESEARCH CORPORATION

Inventor： Hui Ling HAN ,  Seetharaman RAMACHANDRAN

IPC: H01J37/32 ,  H01L21/687

CPC classification number: H01J37/32642 ,  H01J37/32082 ,  H01L21/68735 ,  H01J2237/24585 ,  H01J2237/024 ,  H01J2237/24578 ,  H01J2237/334

Abstract: A substrate processing system includes a substrate support assembly to support a semiconductor substrate during processing of the semiconductor substrate in the substrate processing system. A first edge ring is arranged around the substrate support assembly. The first edge ring is movable relative to the substrate support assembly. A second edge ring is arranged around the substrate support assembly and under the first edge ring. A controller is configured to compensate a height of the first edge ring based on erosion of the first and second edge rings.

公开(公告)号：US20230369025A1

公开(公告)日：2023-11-16

申请号：US17912990

申请日：2020-03-23

Applicant: LAM RESEARCH CORPORATION

Inventor： Hui Ling HAN ,  Seetharaman RAMACHANDRAN ,  Marc ESTOQUE

IPC: H01J37/32 ,  H01L21/68

CPC classification number: H01J37/32642 ,  H01L21/681 ,  H01J2237/24578 ,  H01J2237/024

Abstract: An edge ring centering system for a plasma processing system includes a processing chamber including a substrate support and R edge ring lift pins, where R is an integer greater than or equal to 3. An edge ring includes P grooves located on a bottom surface thereof, where P is an integer greater than or equal to R. A robot arm includes an end effector. A controller is configured to cause the optical sensor to sense a first position of the edge ring on the end effector; cause the robot arm to deliver the edge ring to a first center location on the edge ring lift pins; retrieve the edge ring from the edge ring lift pins; and cause the optical sensor to sense a second position of the edge ring on the end effector.

公开(公告)号：US20230122167A1

公开(公告)日：2023-04-20

申请号：US17911596

申请日：2021-03-10

Applicant: Lam Research Corporation

Inventor： Neil Marshall WILSON ,  Niklas ROSCHEWSKY ,  Seetharaman RAMACHANDRAN

IPC: H01J37/32

Abstract: A method for processing one or more substrates in a plasma processing chamber is provided. A plurality of cycles is provided, wherein each cycle comprises providing a pre-coat process, processing at least one substrate within the plasma processing chamber, and cleaning the plasma processing chamber. The providing the pre-coat process comprises one or more cycles of depositing a silicon containing pre-coat layer and depositing a carbon containing pre-coat layer.

公开(公告)号：US20220285136A1

公开(公告)日：2022-09-08

申请号：US17631984

申请日：2020-07-30

Applicant: LAM RESEARCH CORPORATION

Inventor： Hui Ling HAN ,  Xinwei HUANG ,  Alexander Miller PATERSON ,  Saravanapriyan SRIRAMAN ,  Ann ERICKSON ,  Joanna WU ,  Seetharaman RAMACHANDRAN ,  Christopher KIMBALL ,  Aris PEREZ

IPC: H01J37/32 ,  H01L21/687

Abstract: An edge ring system for a substrate processing system includes a top edge ring including an annular body having an inner diameter and an outer diameter. The outer diameter of the top edge ring is smaller than a horizontal opening of a substrate port of the substrate processing system. A first edge ring is arranged below the top edge ring including an annular body having an inner diameter and an outer diameter. The outer diameter of the first edge ring is larger than the substrate port of the substrate processing system. The inner diameter of the first edge ring is smaller than the inner diameter of the top edge ring.