公开(公告)号：US20230369025A1

公开(公告)日：2023-11-16

申请号：US17912990

申请日：2020-03-23

Applicant: LAM RESEARCH CORPORATION

Inventor： Hui Ling HAN ,  Seetharaman RAMACHANDRAN ,  Marc ESTOQUE

IPC: H01J37/32 ,  H01L21/68

CPC classification number: H01J37/32642 ,  H01L21/681 ,  H01J2237/24578 ,  H01J2237/024

Abstract: An edge ring centering system for a plasma processing system includes a processing chamber including a substrate support and R edge ring lift pins, where R is an integer greater than or equal to 3. An edge ring includes P grooves located on a bottom surface thereof, where P is an integer greater than or equal to R. A robot arm includes an end effector. A controller is configured to cause the optical sensor to sense a first position of the edge ring on the end effector; cause the robot arm to deliver the edge ring to a first center location on the edge ring lift pins; retrieve the edge ring from the edge ring lift pins; and cause the optical sensor to sense a second position of the edge ring on the end effector.