Abstract:
A method for increasing the surface area, and thus the capacitance of a DRAM, stacked capacitor structure, has been developed. A storage node electrode, incorporating branches of polysilicon, is created via use of multiple polysilicon and insulator depositions, as well as via the use of dry anisotropic, and wet isotropic, etching procedures. The use of polysilicon spacers, created on the sides of silicon oxide mesas, adds a vertical component to the polysilicon branches. Removal of a portion of insulator layer from between polysilicon branches, results in exposure of the increased storage node electrode surface area. Unetched portions of the insulator layers, between polysilicon branches, supply structural support for the storage node electrode, comprised of polysilicon branches.
Abstract:
Targeted coagulation factors comprising a coagulation factor linked with at least one domain that specifically binds to a membrane protein on a blood cell is provided. The disclosed targeted coagulation factors increase the efficiency of coagulation factors and prolong their duration of action and thus, are an improvement for the treatment of hematological diseases such as hemophilia A.
Abstract:
A Co-based alloy, a tubular wire with a Co-based sheath, and a method for forming a saw tip involving an alloy comprising, by approximate weight %, C (0.3-2.4), B (0.1-1.0), Cr (25-35), Mo (4-20), Si (0.1-1.57), Co (Balance), wherein the total concentration of boron and carbon is between about 1.2 wt % and about 2.5 wt % and the Si has a concentration no greater than about (1.8−(0.12[Mo])+(0.1*([B]+[C]))).
Abstract:
An electrical monitor comprising a via array and method for determining and reducing an electrically charged state of a semiconductor process wafer the method including providing a metal filled via array including a plurality of interspersed electrically isolated dummy metal portions to form a via array monitor; exposing the semiconductor process wafer including the via array monitor to an electrical charge altering process including to produce an electrically charged state over at least a portion of the semiconductor wafer; carrying out electrical measurements of the via array monitor to determine a level of the electrically charged state; and, carrying out an electrically charge neutralizing process to reduce a level of the electrically charged state to a predetermined acceptable level prior to carrying out a subsequent process.