Invention Application
- Patent Title: Via array monitor and method of monitoring induced electrical charging
- Patent Title (中): 通过阵列监视器和监控感应充电的方法
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Application No.: US10634005Application Date: 2003-08-04
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Publication No.: US20050032253A1Publication Date: 2005-02-10
- Inventor: Yung-Lung Hsu , James Wu
- Applicant: Yung-Lung Hsu , James Wu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Main IPC: H01L21/66
- IPC: H01L21/66 ; H01L23/544 ; H01L21/4763 ; H01L23/58

Abstract:
An electrical monitor comprising a via array and method for determining and reducing an electrically charged state of a semiconductor process wafer the method including providing a metal filled via array including a plurality of interspersed electrically isolated dummy metal portions to form a via array monitor; exposing the semiconductor process wafer including the via array monitor to an electrical charge altering process including to produce an electrically charged state over at least a portion of the semiconductor wafer; carrying out electrical measurements of the via array monitor to determine a level of the electrically charged state; and, carrying out an electrically charge neutralizing process to reduce a level of the electrically charged state to a predetermined acceptable level prior to carrying out a subsequent process.
Public/Granted literature
- US06939726B2 Via array monitor and method of monitoring induced electrical charging Public/Granted day:2005-09-06
Information query
IPC分类: