Low Power, High Speed Multi-Channel Chip-to-Chip Interface using Dielectric Waveguide
    5.
    发明申请
    Low Power, High Speed Multi-Channel Chip-to-Chip Interface using Dielectric Waveguide 有权
    使用介质波导的低功耗,高速多通道芯片到芯片接口

    公开(公告)号:US20140184351A1

    公开(公告)日:2014-07-03

    申请号:US14103005

    申请日:2013-12-11

    CPC classification number: H01P3/122 H01P3/16 H01P5/087 H01P5/107

    Abstract: An exemplary embodiment of the present invention provides an improved dielectric waveguide named electrical fiber. The electrical fiber with a metal cladding may isolate the interference of the signals in other wireless channels and adjacent electrical fibers, which typically causes band-limitation problem, for a smaller radiation loss and better signal guiding to lower the total transceiver power consumption as the transmit distance increases. Also, the electrical fiber may have frequency independent attenuation characteristics to enable high data rate transfer with little or even without any additional receiver-side compensation due to vertical coupling of the electrical fiber and an interconnection device.

    Abstract translation: 本发明的示例性实施例提供了一种改进的电介质波导,称为电光纤。 具有金属覆层的电光纤可以隔离其它无线信道和相邻电缆中的信号的干扰,这通常导致带限问题,以减小辐射损耗,并且更好的信号导向以降低总的收发机功率消耗,因为传输 距离增加。 此外,电光纤可以具有频率独立的衰减特性,以便由于电光纤和互连设备的垂直耦合而很少或甚至没有任何额外的接收器侧补偿来实现高数据速率传输。

    CONNECTOR FOR COUPLING WAVEGUIDE WITH BOARD

    公开(公告)号:US20210013577A1

    公开(公告)日:2021-01-14

    申请号:US17036743

    申请日:2020-09-29

    Abstract: According to one aspect of the invention, there is provided a connector for connecting a waveguide and a board, comprising: a first opening part formed in a direction perpendicular to one side of a board and coupled to the one side of the board; a second opening part formed in a direction parallel to a longitudinal direction of a waveguide for signal transmission, wherein the waveguide is capable of being coupled to the second opening part; and a signal guide part connecting the first and second opening parts and including a hollowness surrounded by a conductive layer therein.

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