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公开(公告)号：US08124953B2
公开(公告)日：2012-02-28
申请号：US12402912
申请日：2009-03-12
申请人： Klaus Elian , Georg Meyer-Berg , Horst Theuss
发明人： Klaus Elian , Georg Meyer-Berg , Horst Theuss
IPC分类号： H01L29/04 , H01L47/00 , H01L29/417 , H01L29/74 , H01L31/111 , H01L31/0203
CPC分类号： H01L21/563 , G01L9/0054 , G01L19/0627 , G01L19/141 , G01L19/147 , G01L19/148 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2924/1461 , H01L2924/16151 , H01L2924/16152 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A sensor device and method. One embodiment provides a first semiconductor chip having a sensing region. A porous structure element is attached to the first semiconductor chip. A first region of the porous structure element faces the sensing region of the first semiconductor chip. An encapsulation material partially encapsulates the first semiconductor chip and the porous structure element.
摘要翻译： 传感器装置及方法。 一个实施例提供了具有感测区域的第一半导体芯片。 多孔结构元件附接到第一半导体芯片。 多孔结构元件的第一区域面向第一半导体芯片的感测区域。 封装材料部分地封装第一半导体芯片和多孔结构元件。
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公开(公告)号：US20110298088A1
公开(公告)日：2011-12-08
申请号：US12795230
申请日：2010-06-07
申请人： Klaus Elian , Horst Theuss , Georg Meyer-Berg
发明人： Klaus Elian , Horst Theuss , Georg Meyer-Berg
CPC分类号： H01F17/0006 , H01F17/04 , H01F2017/0073 , H01F2017/048 , H01L21/568 , H01L24/96 , H01L24/97 , H01L2224/04105 , H01L2224/12105
摘要： A semiconductor package includes a semiconductor chip. An inductor is applied to the semiconductor chip. The inductor has at least one winding. An encapsulation body is formed of an encapsulation material. The encapsulation material contains a magnetic component and fills a space within the winding to form a magnetic winding core.
摘要翻译： 半导体封装包括半导体芯片。 电感器被施加到半导体芯片。 电感器具有至少一个绕组。 封装体由封装材料形成。 封装材料包含磁性部件并填充绕组内的空间以形成磁性绕组芯。
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公开(公告)号：US08513771B2
公开(公告)日：2013-08-20
申请号：US12795230
申请日：2010-06-07
申请人： Klaus Elian , Horst Theuss , Georg Meyer-Berg
发明人： Klaus Elian , Horst Theuss , Georg Meyer-Berg
CPC分类号： H01F17/0006 , H01F17/04 , H01F2017/0073 , H01F2017/048 , H01L21/568 , H01L24/96 , H01L24/97 , H01L2224/04105 , H01L2224/12105
摘要： A semiconductor package includes a semiconductor chip. An inductor is applied to the semiconductor chip. The inductor has at least one winding. An encapsulation body is formed of an encapsulation material. The encapsulation material contains a magnetic component and fills a space within the winding to form a magnetic winding core.
摘要翻译： 半导体封装包括半导体芯片。 电感器被施加到半导体芯片。 电感器具有至少一个绕组。 封装体由封装材料形成。 封装材料包含磁性部件并填充绕组内的空间以形成磁性绕组芯。
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公开(公告)号：US08373240B2
公开(公告)日：2013-02-12
申请号：US13359195
申请日：2012-01-26
申请人： Klaus Elian , Georg Meyer-Berg , Horst Theuss
发明人： Klaus Elian , Georg Meyer-Berg , Horst Theuss
IPC分类号： H01L29/84 , H01L31/0203 , B81B3/00 , G01L9/00 , H04R23/00
CPC分类号： H01L21/563 , G01L9/0054 , G01L19/0627 , G01L19/141 , G01L19/147 , G01L19/148 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2924/1461 , H01L2924/16151 , H01L2924/16152 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A sensor device and method. One embodiment provides a first semiconductor chip having a sensing region. A porous structure element is attached to the first semiconductor chip. A first region of the porous structure element faces the sensing region of the first semiconductor chip. An encapsulation material partially encapsulates the first semiconductor chip and the porous structure element.
摘要翻译： 传感器装置及方法。 一个实施例提供了具有感测区域的第一半导体芯片。 多孔结构元件附接到第一半导体芯片。 多孔结构元件的第一区域面向第一半导体芯片的感测区域。 封装材料部分地封装第一半导体芯片和多孔结构元件。
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公开(公告)号：US20120126344A1
公开(公告)日：2012-05-24
申请号：US13359195
申请日：2012-01-26
申请人： Klaus Elian , Georg Meyer-Berg , Horst Theuss
发明人： Klaus Elian , Georg Meyer-Berg , Horst Theuss
CPC分类号： H01L21/563 , G01L9/0054 , G01L19/0627 , G01L19/141 , G01L19/147 , G01L19/148 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2924/1461 , H01L2924/16151 , H01L2924/16152 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A sensor device and method. One embodiment provides a first semiconductor chip having a sensing region. A porous structure element is attached to the first semiconductor chip. A first region of the porous structure element faces the sensing region of the first semiconductor chip. An encapsulation material partially encapsulates the first semiconductor chip and the porous structure element.
摘要翻译： 传感器装置及方法。 一个实施例提供了具有感测区域的第一半导体芯片。 多孔结构元件附接到第一半导体芯片。 多孔结构元件的第一区域面向第一半导体芯片的感测区域。 封装材料部分地封装第一半导体芯片和多孔结构元件。
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公开(公告)号：US20100230766A1
公开(公告)日：2010-09-16
申请号：US12402912
申请日：2009-03-12
申请人： Klaus Elian , Georg Meyer-Berg , Horst Theuss
发明人： Klaus Elian , Georg Meyer-Berg , Horst Theuss
CPC分类号： H01L21/563 , G01L9/0054 , G01L19/0627 , G01L19/141 , G01L19/147 , G01L19/148 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2924/1461 , H01L2924/16151 , H01L2924/16152 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A sensor device and method. One embodiment provides a first semiconductor chip having a sensing region. A porous structure element is attached to the first semiconductor chip. A first region of the porous structure element faces the sensing region of the first semiconductor chip. An encapsulation material partially encapsulates the first semiconductor chip and the porous structure element.
摘要翻译： 传感器装置及方法。 一个实施例提供了具有感测区域的第一半导体芯片。 多孔结构元件附接到第一半导体芯片。 多孔结构元件的第一区域面向第一半导体芯片的感测区域。 封装材料部分地封装第一半导体芯片和多孔结构元件。
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公开(公告)号：US20130187201A1
公开(公告)日：2013-07-25
申请号：US13358316
申请日：2012-01-25
申请人： Klaus Elian , Franz-Peter Kalz , Horst Theuss
发明人： Klaus Elian , Franz-Peter Kalz , Horst Theuss
CPC分类号： H01L29/84 , B81B2201/0235 , B81B2201/025 , B81B2201/0292 , B81B2203/0361 , B81C1/00246 , G01L1/20 , G01P15/124
摘要： A sensor device includes a semiconductor chip. The semiconductor chip has a sensing region sensitive to mechanical loading. A pillar is mechanically coupled to the sensing region.
摘要翻译： 传感器装置包括半导体芯片。 半导体芯片具有对机械负载敏感的感测区域。 支柱机械耦合到感测区域。
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公开(公告)号：US20120038352A1
公开(公告)日：2012-02-16
申请号：US12857242
申请日：2010-08-16
申请人： Klaus Elian , Horst Theuss , Guenther Ruhl
发明人： Klaus Elian , Horst Theuss , Guenther Ruhl
CPC分类号： G01R33/072 , G01N27/72 , H01L2224/48091 , H01L2224/48247 , H01L2924/181 , H01L2924/1815 , Y10T29/49002 , H01L2924/00012
摘要： A sensor package and a method for manufacturing a sensor package are disclosed. An embodiment comprises a sensor and a conductive line, wherein the sensor is arranged proximate to the conductive line. The sensor and the conductive line are isolated and at least partially encapsulated. A soft magnet is arranged in, on and/or around the encapsulation, wherein the soft magnet comprises a composition of an insulating material and a material having soft magnetic properties.
摘要翻译： 公开了传感器封装和制造传感器封装的方法。 实施例包括传感器和导线，其中传感器布置成靠近导电线。 传感器和导线被隔离并至少部分封装。 软磁体布置在封装的内部和/或周围，其中软磁体包括绝缘材料的组合物和具有软磁性质的材料。
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公开(公告)号：US20100276769A1
公开(公告)日：2010-11-04
申请号：US12433531
申请日：2009-04-30
申请人： Horst Theuss , Klaus Elian
发明人： Horst Theuss , Klaus Elian
IPC分类号： H01L29/82 , H01L21/56 , H01L23/538
CPC分类号： H01L27/22 , B82Y25/00 , G01R33/093 , H01L21/561 , H01L21/568 , H01L23/3135 , H01L24/19 , H01L24/20 , H01L24/96 , H01L24/97 , H01L2224/04105 , H01L2224/21 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01075 , H01L2924/12044 , H01L2924/14 , H01L2924/1461 , H01L2924/181 , H01L2924/00
摘要： A semiconductor device includes a magnetic sensor chip, an electrically conducting layer wafer-level patterned in contact with the magnetic sensor chip, encapsulation material disposed on the magnetic sensor chip, and an array of external contact elements electrically coupled with the magnetic sensor chip through the electrically conducting layer.
摘要翻译： 一种半导体器件包括磁传感器芯片，与磁传感器芯片接触图案化的导电层晶片级，设置在磁传感器芯片上的封装材料以及通过该磁传感器芯片与磁传感器芯片电耦合的外部接触元件阵列 导电层。
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公开(公告)号：US10107875B2
公开(公告)日：2018-10-23
申请号：US12627848
申请日：2009-11-30
申请人： Klaus Elian , Martin Petz , Uwe Schindler , Horst Theuss , Adolf Koller
发明人： Klaus Elian , Martin Petz , Uwe Schindler , Horst Theuss , Adolf Koller
摘要： An integrated circuit includes a leadframe, and a die having a top surface, a bottom surface, and a plurality of perimeter sides and including at least one magnetic field sensor element disposed proximate to the top surface, wherein the bottom surface is bonded to the leadframe. A molded magnetic material encapsulates the die and at least a portion of the leadframe, and provides a magnetic field substantially perpendicular to the top surface of the die. A non-magnetic material is disposed between the die and the molded magnetic material at least along perimeter sides of the die intersecting a lateral magnetic field component which is parallel to the top surface of the die.
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