公开(公告)号：US20180326553A1

公开(公告)日：2018-11-15

申请号：US15883656

申请日：2018-01-30

Applicant: Kinik Company Ltd.

Inventor： Jui-Lin Chou ,  Chin-Chung Chou ,  Chung-Yi Cheng ,  Hsin-Chun Wang ,  Yu-Chau Hung

IPC: B24B53/017

Abstract: The present invention provides a CMP abrasive pad conditioner, comprising a bottom substrate; an intermediate layer located on the bottom substrate, the intermediate layer including a hollow portion and an annular portion surrounding the hollow portion, the annular portion being provided with a plurality of bumps; and a diamond film located on the intermediate layer, and forming a plurality of abrasive projections corresponding to the bumps of the intermediate layer; in this case, a top surface of the abrasive projections is formed with a patterned configuration and the top surface is provided with a center line average roughness (Ra) between 2 and 20.

公开(公告)号：US20220111488A1

公开(公告)日：2022-04-14

申请号：US17363489

申请日：2021-06-30

Applicant: KINIK COMPANY

Inventor： Jui-Lin Chou ,  Min-Hung Wu ,  Chin-Chung Chou ,  Pin-Hsien Wang ,  Chun-Kai Tang

IPC: B24B53/017 ,  B24B53/00 ,  B24B37/24 ,  B24B37/22 ,  B24D3/00

Abstract: The present invention relates to a polishing pad conditioner and a manufacturing method thereof. The polishing pad conditioner includes a substrate, an abrasive layer and a protective layer. The abrasive layer covers the surface of the substrate. The abrasive layer includes a bonding layer and a plurality of abrasive particles embedded in the bonding layer. Each of the abrasive particles has a protrusion exposed out of the bonding layer, and the protrusion is insulated. The protective layer covers the surface of the bonding layer, and the protrusion is exposed out of the protective layer. The polishing pad conditioner of the present invention can protect the bonding layer from being damaged by abrasion and hold the abrasive particles, avoid the abrasive particles from falling off or out of position, and maintain the polishing effect and service life of the polishing pad conditioner.

公开(公告)号：US11053419B2

公开(公告)日：2021-07-06

申请号：US15980302

申请日：2018-05-15

Applicant: Kinik Company

Inventor： Jui-Lin Chou ,  Chia-Feng Chiu ,  Chin-Chung Chou ,  Hsin-Chun Wang

IPC: C09K3/14 ,  B24B37/24 ,  C04B41/91 ,  C04B41/00 ,  B23K26/38 ,  B24D7/06 ,  B23K31/10 ,  B24D18/00 ,  B23K26/402 ,  B23K101/20 ,  B23K103/00

Abstract: A grinding tool includes a substrate, and at least an abrasive particle affixed to the substrate. The abrasive particle has a base, and four tips adjacent to one another protruding from the base, the base having a cavity of a generally cross shape extending between the four tips, the cavity including a material discharge surface disposed between two adjacent ones of the four tips, the material discharge surface being located at an end of the cavity and adjacent to a side surface of the base, an inner material angle between the material discharge surface and the side surface being between about 120 degrees and about 160 degrees. Moreover, embodiments described herein include a method of manufacturing the grinding tool.

公开(公告)号：US10525567B2

公开(公告)日：2020-01-07

申请号：US15883656

申请日：2018-01-30

Applicant: Kinik Company Ltd.

Inventor： Jui-Lin Chou ,  Chin-Chung Chou ,  Chung-Yi Cheng ,  Hsin-Chun Wang ,  Yu-Chau Hung

IPC: B24B53/017 ,  B24B53/00 ,  B24D18/00 ,  C08K3/22 ,  C08K3/02 ,  C30B29/36

Abstract: The present invention provides a CMP abrasive pad conditioner, comprising a bottom substrate; an intermediate layer located on the bottom substrate, the intermediate layer including a hollow portion and an annular portion surrounding the hollow portion, the annular portion being provided with a plurality of bumps; and a diamond film located on the intermediate layer, and forming a plurality of abrasive projections corresponding to the bumps of the intermediate layer; in this case, a top surface of the abrasive projections is formed with a patterned configuration and the top surface is provided with a center line average roughness (Ra) between 2 and 20.