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1.发明申请公开(公告)号：US20140124189A1
公开(公告)日：2014-05-08
申请号：US13671913
申请日：2012-11-08
发明人： Levi A. CAMPBELL , Richard C. CHU , Milnes P. DAVID , Michael J. ELLSWORTH, JR. , Madhusudan K. IYENGAR , Roger R. SCHMIDT , Robert E. SIMONS
IPC分类号： F28F27/02
CPC分类号： H05K7/20281 , F28F27/02 , H05K7/20781 , H05K7/20836
摘要： A coolant-conditioning unit is provided which includes a facility coolant path, having a facility coolant flow control valve, and a system coolant path accommodating a system coolant, and having a bypass line with a system coolant bypass valve. A heat exchanger is coupled to the facility and system coolant paths to facilitate transfer of heat from the system coolant to facility coolant in the facility coolant path, and the bypass line is disposed in the system coolant path in parallel with the heat exchanger. A controller automatically controls a regulation position of the coolant bypass valve and a regulation position of the facility coolant flow control valve based on a temperature of the system coolant, and automatically adjusts the regulation position of the system coolant bypass valve to facilitate maintaining the facility coolant flow control valve at or above a specified, partially open, minimum regulation position.
摘要翻译： 提供了一种冷却剂调节单元，其包括设备冷却剂路径，具有设备冷却剂流量控制阀，以及容纳系统冷却剂的系统冷却剂通道，并具有与系统冷却剂旁通阀的旁路管路。 热交换器被耦合到设备和系统冷却剂路径，以便于将热量从系统冷却剂传送到设备冷却剂路径中的设备冷却剂，并且旁路管线与热交换器平行地设置在系统冷却剂路径中。 控制器基于系统冷却液的温度自动控制冷却剂旁通阀的调节位置和设备冷却剂流量控制阀的调节位置，并且自动调节系统冷却剂旁通阀的调节位置以便于维持设备冷却剂 流量控制阀处于或高于指定的，部分打开的最小调节位置。
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2.发明申请IMMERSION-COOLING OF SELECTED ELECTRONIC COMPONENT(S) MOUNTED TO PRINTED CIRCUIT BOARD 有权选择的电子元件（印刷电路板）的安装冷却公开(公告)号：US20140085823A1
公开(公告)日：2014-03-27
申请号：US13627216
申请日：2012-09-26
发明人： Levi A. CAMPBELL , Richard C. CHU , Milnes P. DAVID , Michael J. ELLSWORTH, JR. , Madhusudan K. IYENGAR , Roger R. SCHMIDT , Robert E. SIMONS
CPC分类号： H05K7/20 , H05K7/20236 , H05K7/20772 , Y10T29/49117
摘要： Cooling apparatuses and methods are provided for pumped immersion-cooling of selected electronic components of an electronic system, such as a node or book of a multi-node rack. The cooling apparatus includes a housing assembly defining a compartment about the component(s) to be cooled, which is coupled to a first side of a printed circuit board. The assembly includes a first frame with an opening sized to accommodate the component(s), and a second frame. The first and second frames are sealed to opposite sides of the board via a first adhesive layer and a second adhesive layer, respectively. The printed circuit board is at least partially porous to a coolant to flow through the compartment, and the first frame, second frame, and first and second adhesive layers are non-porous with respect to the coolant, and provide a coolant-tight seal to the first and second sides of the printed circuit board.
摘要翻译： 提供了冷却装置和方法，用于对诸如多节架架的节点或书的电子系统的所选择的电子部件进行抽吸浸没冷却。 冷却装置包括围绕要冷却的部件限定隔室的壳体组件，该组件联接到印刷电路板的第一侧。 组件包括具有开口尺寸以容纳部件的第一框架和第二框架。 第一和第二框架分别经由第一粘合剂层和第二粘合剂层密封到板的相对侧。 印刷电路板至少部分地多孔于冷却剂流过隔间，并且第一框架，第二框架和第一和第二粘合剂层相对于冷却剂是无孔的，并且提供冷却剂密封到 印刷电路板的第一和第二面。
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公开(公告)号：US20140146468A1
公开(公告)日：2014-05-29
申请号：US13758166
申请日：2013-02-04
发明人： Levi A. CAMPBELL , Richard C. CHU , Milnes P. DAVID , Michael J. ELLSWORTH, JR. , Madhusudan K. IYENGAR , Roger R. SCHMIDT , Robert E. SIMONS
IPC分类号： H05K7/20
CPC分类号： H05K7/20236 , G06F1/20 , H05K7/203 , H05K7/20318 , H05K7/20336 , H05K7/2079 , H05K7/20809
摘要： A method of facilitating cooling of an electronics board having a plurality of electronic components mounted to the board by providing an apparatus which includes an immersion-cooled electronic component section and a conduction-cooled electronic component section. The immersion-cooled section includes an enclosure at least partially surrounding and forming a compartment about multiple electronic components of the electronic components mounted to the electronics board, and a fluid disposed within the compartment. The multiple electronic components are, at least in part, immersed within the fluid to facilitate immersion-cooling of those components. The conduction-cooled electronic component section includes at least one electronic component of the electronic components mounted to the electronics board, and the at least one electronic component is indirectly liquid-cooled, at least in part, via conduction of heat from the at least one electronic component.
摘要翻译： 一种通过提供一种包括浸没冷却电子部件部分和传导冷却电子部件部分的装置，有助于冷却具有安装到板上的多个电子部件的电子板的方法。 浸没冷却部分包括至少部分地围绕和形成围绕安装到电子板的电子部件的多个电子部件的隔室以及设置在隔间内的流体的外壳。 多个电子部件至少部分地浸入流体中以便于这些部件的浸入冷却。 传导冷却的电子部件部分包括安装到电子板的电子部件的至少一个电子部件，并且至少一个电子部件至少部分地通过从至少一个 电子元件
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公开(公告)号：US20200011209A1
公开(公告)日：2020-01-09
申请号：US16576930
申请日：2019-09-20
摘要： Systems and methods are provided for data center cooling by vaporizing fuel using data center waste heat. The systems include, for instance, an electricity-generating assembly, a liquid fuel storage, and a heat transfer system. The electricity-generating assembly generates electricity from a fuel vapor for supply to the data center. The liquid fuel storage is coupled to supply the fuel vapor, and the heat transfer system is associated with the data center and the liquid fuel storage. In an operational mode, the heat transfer system transfers the data center waste heat to the liquid fuel storage to facilitate vaporization of liquid fuel to produce the fuel vapor for supply to the electricity-generating assembly. The system may be implemented with the liquid fuel storage and heat transfer system being the primary fuel vapor source, or a back-up fuel vapor source.
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公开(公告)号：US20190157186A1
公开(公告)日：2019-05-23
申请号：US16251177
申请日：2019-01-18
发明人： Levi A. CAMPBELL , Milnes P. DAVID , Dustin W. DEMETRIOU , Michael J. ELLSWORTH, JR. , Roger R. SCHMIDT , Robert E. SIMONS
IPC分类号： H01L23/473 , B29C43/20 , H01L23/427 , H05K7/20 , B29C70/84 , B29C70/88 , B29C43/18
CPC分类号： H01L23/473 , B29C43/18 , B29C43/203 , B29C70/84 , B29C70/88 , B29K2101/12 , B29K2705/00 , B29L2009/00 , B29L2031/3406 , H01L23/3672 , H01L23/4006 , H01L23/427 , H01L2924/00 , H01L2924/0002 , H05K7/20254 , H05K7/20436 , H05K7/20509 , H05K7/20772
摘要： Composite heat sink structures and methods of fabrication are provided, with the composite heat sink structures including: a thermally conductive base having a main heat transfer surface to couple to, for instance, at least one electronic component to be cooled; a compressible, continuous sealing member; and a sealing member retainer compressing the compressible, continuous sealing member against the thermally conductive base; and an in situ molded member. The in situ molded member is molded over and affixed to the thermally conductive base, and is molded over and secures in place the sealing member retainer. A coolant-carrying compartment resides between the thermally conductive base and the in situ molded member, and a coolant inlet and outlet are provided in fluid communication with the coolant-carrying compartment to facilitate liquid coolant flow through the compartment.
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公开(公告)号：US20170127565A1
公开(公告)日：2017-05-04
申请号：US14926035
申请日：2015-10-29
发明人： Levi A. CAMPBELL , Milnes P. DAVID , Dustin W. DEMETRIOU , Michael J. ELLSWORTH, JR. , Roger R. SCHMIDT , Robert E. SIMONS
IPC分类号： H05K7/20
CPC分类号： H05K7/20781 , H05K7/20127 , H05K7/20236 , H05K7/203 , H05K7/20318 , H05K7/2039 , H05K7/20772 , H05K7/20809
摘要： Cooling apparatuses and methods of fabrication are provided which facilitate immersion-cooling of an electronic component(s). The cooling apparatus includes a drawer-level enclosure sized to reside within an electronics rack. The drawer-level enclosure includes a compartment which accommodates one or more electronic components to be cooled. A dielectric fluid is disposed within the compartment. The dielectric fluid includes a liquid dielectric which at least partially immerses the electronic component(s) within the compartment(s). A hinged, liquid-cooled heat sink is also disposed within the compartment of the enclosure. The heat sink operatively facilitates cooling the one or more electronic components via the dielectric fluid within the compartment, and is rotatable between an operational position overlying the electronic component(s), and a service position which allows access to the electronic component(s).
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公开(公告)号：US20160363352A1
公开(公告)日：2016-12-15
申请号：US15249703
申请日：2016-08-29
CPC分类号： F01K25/08 , F01K5/00 , F25B15/00 , F25B19/00 , F25B27/02 , F25B49/00 , H02P9/04 , H05K7/20709 , H05K7/20818 , H05K7/20836
摘要： Systems and methods are provided for data center cooling by vaporizing fuel using data center waste heat. The systems include, for instance, an electricity-generating assembly, a liquid fuel storage, and a heat transfer system. The electricity-generating assembly generates electricity from a fuel vapor for supply to the data center. The liquid fuel storage is coupled to supply the fuel vapor, and the heat transfer system is associated with the data center and the liquid fuel storage. In an operational mode, the heat transfer system transfers the data center waste heat to the liquid fuel storage to facilitate vaporization of liquid fuel to produce the fuel vapor for supply to the electricity-generating assembly. The system may be implemented with the liquid fuel storage and heat transfer system being the primary fuel vapor source, or a back-up fuel vapor source.
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公开(公告)号：US20160143189A1
公开(公告)日：2016-05-19
申请号：US14546136
申请日：2014-11-18
发明人： Levi A. CAMPBELL , Milnes P. DAVID , Dustin W. DEMETRIOU , Michael J. ELLSWORTH, Jr. , Roger R. SCHMIDT , Robert E. SIMONS
CPC分类号： H01L23/473 , B29C43/18 , B29C43/203 , B29C70/84 , B29C70/88 , B29K2101/12 , B29K2705/00 , B29L2009/00 , B29L2031/3406 , H01L23/3672 , H01L23/4006 , H01L23/427 , H01L2924/00 , H01L2924/0002 , H05K7/20254 , H05K7/20436 , H05K7/20509 , H05K7/20772
摘要： Composite heat sink structures and methods of fabrication are provided, with the composite heat sink structures including: a thermally conductive base having a main heat transfer surface to couple to, for instance, at least one electronic component to be cooled; a compressible, continuous sealing member; and a sealing member retainer compressing the compressible, continuous sealing member against the thermally conductive base; and an in situ molded member. The in situ molded member is molded over and affixed to the thermally conductive base, and is molded over and secures in place the sealing member retainer. A coolant-carrying compartment resides between the thermally conductive base and the in situ molded member, and a coolant inlet and outlet are provided in fluid communication with the coolant-carrying compartment to facilitate liquid coolant flow through the compartment.
摘要翻译： 提供了复合散热器结构和制造方法，其中复合散热器结构包括：导热基底，其具有主要传热表面以耦合到例如要冷却的至少一个电子部件; 可压缩，连续的密封构件; 以及密封构件保持器，压缩可压缩连续的密封构件抵靠导热基座; 和原位模制件。 将原位模制构件模制在导热基底上并固定到导热基底上，并将其模制并固定到密封构件保持器的适当位置。 在导热基座和原位模制构件之间设有冷却剂携带室，并且冷却剂入口和出口设置成与冷却剂携带室流体连通，以便液体冷却剂流过室。
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公开(公告)号：US20160095258A1
公开(公告)日：2016-03-31
申请号：US14499402
申请日：2014-09-29
发明人： Levi A. CAMPBELL , Christopher R. CIRAULO , Milnes P. DAVID , Dustin W. DEMETRIOU , Robert K. MULLADY , Roger R. SCHMIDT
IPC分类号： H05K7/20
CPC分类号： H05K7/20727 , H05K7/20181
摘要： Apparatuses and methods are provided for blocking removal of an air-moving assembly from a chassis when in operational state. The apparatus includes a protective louver assembly having a louver(s) and an interlock element(s). The louver(s) is disposed at an air inlet or an air outlet of the air-moving assembly, and pivots between an operational and a quiesced orientation, dependent on presence or absence, respectively, of airflow through the air-moving assembly. The interlock element(s) is associated with the louver(s) to pivot with the louver(s) between the operational orientation and the quiesced orientation. In the operational orientation, the interlock element(s) blocks, at least in part, access to at least one fastener securing the air-moving assembly within the chassis, and thereby prevents removal of the air-moving assembly from the chassis when in the operational state.
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公开(公告)号：US20160095257A1
公开(公告)日：2016-03-31
申请号：US14499387
申请日：2014-09-29
发明人： Levi A. CAMPBELL , Christopher R. CIRAULO , Milnes P. DAVID , Dustin W. DEMETRIOU , Robert K. MULLADY , Roger R. SCHMIDT
IPC分类号： H05K7/20
CPC分类号： H05K7/20727 , F04D25/14 , H05K7/20181 , H05K7/2019
摘要： Apparatuses and methods are provided for locking an air-moving assembly within a chassis when in operational state. The apparatus includes a locking louver assembly having a louver(s) and locking mechanism. The louver(s) is disposed at an air inlet or outlet of the air-moving assembly, and pivots between operational and quiesced orientations, dependent on presence or absence, respectively, of airflow through the air-moving assembly. The locking mechanism includes a keying element(s) affixed to the louver(s) to pivot therewith, which includes an elongated key(s) oriented in a first direction when the louver(s) is in operational orientation, and a second direction when in quiesced orientation. A key-receiving element(s) is associated with the chassis and includes a key opening(s) which receives and accommodates movement of the elongated key(s) between the first and second directions, and prevents removal of the air-moving assembly from the chassis with the key(s) oriented in the first direction.
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