公开(公告)号：US20110253345A1

公开(公告)日：2011-10-20

申请号：US13141121

申请日：2009-12-11

申请人： Hiroyuki Ryoson ,  Takashi Yajima ,  Kazunao Oniki ,  Hiroto Kasai ,  Koji Hirata ,  Mitsuo Hashimoto

发明人： Hiroyuki Ryoson ,  Takashi Yajima ,  Kazunao Oniki ,  Hiroto Kasai ,  Koji Hirata ,  Mitsuo Hashimoto

IPC分类号： F28D15/04

CPC分类号： F28D15/046 ,  B23K20/02 ,  B23K20/16 ,  B23K2101/14 ,  F28D15/0233 ,  F28D15/0283 ,  H01L2924/0002 ,  Y10T29/49393 ,  H01L2924/00

摘要： [Object] To provide a low-cost production method for a heat transportation device with which efficient production with a small number of steps is possible.[Solving Means] A capillary member (5) having a larger thickness than a frame member (2) is mounted on an inner surface (11) of a lower plate member (1). Subsequently, the frame member (2) is mounted on the inner surface (11) of the lower plate member (1), and an upper plate member (3) is mounted on the capillary member (5). Due to a difference between the thickness of the capillary member (5) and the thickness of the frame member (2), a squashing amount (G) is provided between the frame member (2) and the upper plate member (3). Then, the lower plate member (1) and the upper plate member (3) are diffusion-bonded with the frame member (2). At this time, the capillary member (5) is compressed by an amount corresponding to the squashing amount (G). Since the capillary member (5) has elasticity, a pressure (P) is partially absorbed, and a pressure (P′) smaller than the pressure (P) is applied to the lower plate member (1) from the capillary member (5). By the pressure (P′), the inner surface (11) of the lower plate member (1) and the capillary member (5) are diffusion-bonded.

摘要翻译： 本发明提供一种低成本的用于具有少量步骤的有效生产的热运输装置的生产方法。 [解决方案]具有比框架构件（2）更大的厚度的毛细管构件（5）安装在下板构件（1）的内表面（11）上。 随后，将框架构件（2）安装在下板构件（1）的内表面（11）上，并将上板构件（3）安装在毛细管构件（5）上。 由于毛细构件（5）的厚度和框架构件（2）的厚度之间的差异，在框架构件（2）和上板构件（3）之间设置有挤压量（G）。 然后，下板构件（1）和上板构件（3）与框架构件（2）扩散接合。 此时，毛细管构件（5）被压缩相当于挤压量（G）的量。 由于毛细管构件（5）具有弹性，部分地吸收压力（P），并且从毛细管构件（5）向下板构件（1）施加小于压力（P）的压力（P'）， 。 通过压力（P'），下板构件（1）的内表面（11）和毛细管构件（5）是扩散粘合的。

公开(公告)号：US20110088877A1

公开(公告)日：2011-04-21

申请号：US12896464

申请日：2010-10-01

申请人： Kazunao Oniki ,  Hiroyuki Ryoson ,  Koji Hirata

发明人： Kazunao Oniki ,  Hiroyuki Ryoson ,  Koji Hirata

IPC分类号： F28D15/04 ,  B21D53/02

CPC分类号： H01L23/427 ,  F28D15/0233 ,  F28D15/046 ,  H01L2924/0002 ,  Y10T29/49353 ,  H01L2924/00

摘要： A heat transport device includes a working fluid, a capillary member, and a container. The working fluid transports heat by performing a phase change. The capillary member applies a capillary force to the working fluid. The capillary member includes a first mesh member having a mesh of a first size and a second mesh member having a mesh of a second size different from the first size. The second mesh member is folded so that the first mesh member is sandwiched. The container contains the working fluid and the capillary member.

摘要翻译： 热传输装置包括工作流体，毛细管构件和容器。 工作流体通过进行相变来传递热量。 毛细管构件向工作流体施加毛细管力。 毛细管构件包括具有第一尺寸的网的第一网孔构件和具有不同于第一尺寸的第二尺寸的网的第二网孔构件。 折叠第二网状构件，使得第一网状构件被夹持。 容器包含工作流体和毛细管构件。

公开(公告)号：US20100307722A1

公开(公告)日：2010-12-09

申请号：US12792347

申请日：2010-06-02

申请人： Hiroyuki Ryoson ,  Hiroto Kasai ,  Koji Hirata

发明人： Hiroyuki Ryoson ,  Hiroto Kasai ,  Koji Hirata

IPC分类号： F28D15/00 ,  B23K31/02

CPC分类号： F28D15/046 ,  F28D15/0233

摘要： A method of manufacturing a heat transport device including the steps of stacking a first plate, a capillary member, and a second plate by interposing the capillary member between the first plate and the second plate, the first plate and the second plate constituting a container of a heat transport device configured to transport heat using phase change in a working fluid; and diffusion-bonding the first plate and the second plate while deforming the second plate to create an internal space in the container for storing the capillary member.

摘要翻译： 一种制造热输送装置的方法，包括以下步骤：通过将毛细管构件插入第一板和第二板之间来堆叠第一板，毛细管构件和第二板，第一板和第二板构成容器 配置为使用工作流体中的相变来运送热量的热传输装置; 以及在使所述第二板变形的同时扩散接合所述第一板和所述第二板，以在所述容器中形成用于存储所述毛细管构件的内部空间。

公开(公告)号：US20110005724A1

公开(公告)日：2011-01-13

申请号：US12867967

申请日：2009-12-11

申请人： Hiroto Kasai ,  Hiroyuki Ryoson ,  Takashi Yajima ,  Koji Hirata

发明人： Hiroto Kasai ,  Hiroyuki Ryoson ,  Takashi Yajima ,  Koji Hirata

IPC分类号： F28D15/02 ,  B32B37/02

CPC分类号： F28D15/0233 ,  B23K20/02 ,  B23K20/16 ,  F28D15/046 ,  H01L21/4882 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

摘要： [Object] To provide a heat transport device manufacturing method and a heat transport device that has a high hermeticity and is manufactured without increasing a load applied at a time of performing diffusion bonding.[Solving Means] A bonding surface (1a) of an upper member (1) that is subjected to diffusion bonding to a bonding surface (21) of a frame member (2) is formed into a convex shape, which can make a contact area of the bonding surface (1a) and the bonding surface (21) small. Therefore, a pressure (load per unit area) applied to the bonding surfaces (1a and 21) is increased, and thus the diffusion bonding of the bonding surfaces (1a and 21) is performed by a high pressure. Similarly, a bonding surface (3a) of a lower member (3) and a bonding surface (23) of the frame member (2) are also subjected to the diffusion bonding by a high pressure. As a result, a heat transport device (100) having a high hermeticity can be manufactured without increasing an entire load (F) applied at the time of the diffusion bonding.

摘要翻译： 本发明提供一种具有高气密性并且在不增加在进行扩散接合时施加的负荷的情况下制造的传热装置的制造方法和传热装置。 [解决方案]将与框架构件（2）的接合面（21）进行扩散接合的上部构件（1）的接合面（1a）形成为凸状，能够形成接触面积 的接合面（1a）和接合面（21）较小。 因此，施加到接合面（1a，21）的压力（单位面积的负荷）增加，因此，通过高压进行接合面（1a，21）的扩散接合。 类似地，下部构件（3）的接合表面（3a）和框架构件（2）的接合表面（23）也经受高压扩散接合。 结果，可以在不增加在扩散接合时施加的整体负载（F）的情况下制造具有高密封性的热传输装置（100）。

公开(公告)号：US20090086416A1

公开(公告)日：2009-04-02

申请号：US11911179

申请日：2006-02-27

申请人： Hiroichi Ishikawa ,  Norikazu Nakayama ,  Takuya Makino ,  Tomoharu Mukasa ,  Hiroyuki Ryoson

发明人： Hiroichi Ishikawa ,  Norikazu Nakayama ,  Takuya Makino ,  Tomoharu Mukasa ,  Hiroyuki Ryoson

IPC分类号： H05K7/20 ,  F28F7/00 ,  B23P17/04 ,  F04B17/03 ,  F28F13/12

CPC分类号： G06F1/203 ,  F04F7/00 ,  H01L2924/0002 ,  H05K7/20172 ,  Y10T29/49002 ,  H01L2924/00

摘要： Provided is a vibrating device which can generate efficient vibrations in a vibrating member and efficiently apply vibrations to a gas, a jet flow generating device in which the vibrating device has been implemented, and an electronic device in which the jet flow generating device has been implemented. A jet flow generating device 10 has a vibrating device 15 including a frame 4, and actuator 5 mounted on the frame 4, and a vibrating member 3 supported on the frame 4 by an elastic supporting member 6. The vibrating member 3 has a side plate 3b formed on the perimeter portion of a disc-shaped vibrating plate 3a, for example. Vibration of the vibrating member 3 applies vibrations to air within chambers 11a and 11b, whereby gas can alternatingly be blown from nozzles 2a and 2b.

摘要翻译： 提供一种能够在振动部件中产生有效的振动并且有效地对气体施加振动的振动装置，已经实现了振动装置的喷流产生装置以及已经实现了喷射流产生装置的电子装置 。 喷射流产生装置10具有包括框架4的振动装置15和安装在框架4上的致动器5以及通过弹性支撑构件6支撑在框架4上的振动构件3.振动构件3具有侧板 3b形成在盘状振动板3a的周边部分上。 振动构件3的振动对室11a和11b内的空气施加振动，从而可以从喷嘴2a和2b交替地吹送气体。

公开(公告)号：US20070227704A1

公开(公告)日：2007-10-04

申请号：US11685561

申请日：2007-03-13

申请人： Hiroyuki Nagai ,  Hiroyuki Ryoson

发明人： Hiroyuki Nagai ,  Hiroyuki Ryoson

IPC分类号： H05K7/20

CPC分类号： F28D15/06 ,  F28D15/0233 ,  F28D15/046 ,  F28F3/048 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/12044 ,  H01L2924/00

摘要： A plate-type heat transport device and electronic instrument are provided. The plate-type heat transport device includes a heat absorbing plane absorbing heat because of the evaporation of a working fluid, a heat emission plane opposing the heat absorbing plane and emitting heat because of the condensation of the working fluid, and a flow path two-dimensionally arranged between the heat absorbing plane and the heat emission plane to align with the heat absorbing plane and the heat emission plane, the flow path allowing the working fluid to flow therethrough for changing the phase of the working fluid, and the flow path being capable of two-dimensionally diffusing the working fluid by generating a capillary force in the condensed working fluid.

摘要翻译： 提供板式热输送装置和电子仪器。 板式热传输装置包括由于工作流体的蒸发而吸收热量的吸热平面，与吸热面相对的发热面，由于工作流体的冷凝而发热， 三维排列在吸热面和发热面之间，以与吸热面和发热面对准，流路允许工作流体流过其中，以改变工作流体的相位，流路能够 通过在冷凝的工作流体中产生毛细管力二维扩散工作流体。

公开(公告)号：US08391007B2

公开(公告)日：2013-03-05

申请号：US12536996

申请日：2009-08-06

申请人： Mitsuo Hashimoto ,  Kazuaki Yazawa ,  Yuichi Ishida ,  Hiroyuki Ryoson

发明人： Mitsuo Hashimoto ,  Kazuaki Yazawa ,  Yuichi Ishida ,  Hiroyuki Ryoson

IPC分类号： H05K7/20 ,  F28D15/02

CPC分类号： H05K7/208 ,  F28D15/0233 ,  F28F2245/02 ,  F28F2245/04 ,  H01L2924/0002 ,  Y10T29/4935 ,  H01L2924/00

摘要： According to an embodiment, there is provided a heat spreader including an evaporation portion, a first condenser portion, a working fluid, and a first flow path. The evaporation portion is arranged in a first position. The first condenser portion is arranged in a second position, the second position being arranged apart from and higher than the first position. The working fluid evaporates from a liquid phase to a gas phase in the evaporation portion, and condenses from the gas phase to the liquid phase in the first condenser portion. The first flow path is made of a nanomaterial, has hydrophobicity on a surface, and causes the working fluid condensed to the liquid phase in the first condenser portion to flow to the evaporation portion by a gravitational force.

摘要翻译： 根据一个实施例，提供了一种散热器，其包括蒸发部分，第一冷凝器部分，工作流体和第一流动路径。 蒸发部分布置在第一位置。 第一冷凝器部分布置在第二位置，第二位置被布置成与第一位置分开并高于第一位置。 工作流体在蒸发部分中从液相蒸发到气相，并在第一冷凝器部分中从气相冷凝成液相。 第一流路由纳米材料制成，在表面上具有疏水性，并使第一冷凝器部分中冷凝到液相的工作流体通过重力流向蒸发部分。

公开(公告)号：US08256501B2

公开(公告)日：2012-09-04

申请号：US11685561

申请日：2007-03-13

申请人： Hiroyuki Nagai ,  Hiroyuki Ryoson

发明人： Hiroyuki Nagai ,  Hiroyuki Ryoson

IPC分类号： F28D15/00 ,  H05K7/20

CPC分类号： F28D15/06 ,  F28D15/0233 ,  F28D15/046 ,  F28F3/048 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/12044 ,  H01L2924/00

摘要： A plate-type heat transport device and electronic instrument are provided. The plate-type heat transport device includes a heat absorbing plane absorbing heat because of the evaporation of a working fluid, a heat emission plane opposing the heat absorbing plane and emitting heat because of the condensation of the working fluid, and a flow path two-dimensionally arranged between the heat absorbing plane and the heat emission plane to align with the heat absorbing plane and the heat emission plane, the flow path allowing the working fluid to flow therethrough for changing the phase of the working fluid, and the flow path being capable of two-dimensionally diffusing the working fluid by generating a capillary force in the condensed working fluid.

摘要翻译： 提供板式热输送装置和电子仪器。 板式热传输装置包括由于工作流体的蒸发而吸收热量的吸热平面，与吸热面相对的发热面，由于工作流体的冷凝而发热， 三维排列在吸热面和发热面之间，以与吸热面和发热面对准，流路允许工作流体流过其中，以改变工作流体的相位，流路能够 通过在冷凝的工作流体中产生毛细管力二维扩散工作流体。

公开(公告)号：US20100326632A1

公开(公告)日：2010-12-30

申请号：US12733567

申请日：2008-08-08

申请人： Hiroyuki Nagai ,  Hiroyuki Ryoson ,  Takashi Yajima ,  Mitsuo Hashimoto

发明人： Hiroyuki Nagai ,  Hiroyuki Ryoson ,  Takashi Yajima ,  Mitsuo Hashimoto

IPC分类号： F28D15/04 ,  F28D15/00 ,  B21D53/02

CPC分类号： H01L23/427 ,  F28D15/0233 ,  F28D15/046 ,  F28F3/086 ,  H01L2924/0002 ,  Y10T29/4935 ,  H01L2924/00

摘要： [Object] To provide a phase-change-type heat spreader, a flow-path structure, an electronic apparatus including the phase-change-type heat spreader, a flow-path structure used therein, and the like that are capable of improving a thermal efficiency by a phase change and lowering a thermal resistance.[Solving Means] Capillary boards (401 to 404) in which a plurality of openings (408) penetrating the capillary boards are formed on a wall surface constituting grooves (405) in a longitudinal direction of the grooves (405), are laminated while each being rotated 90 degrees to be deviated within an X-Y plane so that the grooves (405) of those layers extend in mutually-orthogonal directions, and the plurality of openings (408) function as a part of a vapor-phase flow path through which a vapor refrigerant evaporated by heat received by a heat-receiving plate circulates.

摘要翻译： 本发明提供一种相变型散热器，流路结构，包括相变型散热器的电子设备，其中使用的流路结构等，其能够改善 通过相变的热效率和降低热阻。 [解决方案]在构成槽（405）的沿槽（405）的长度方向的壁面上形成贯穿毛细管的多个开口（408）的毛细管板（401〜404） 旋转90度以在XY平面内偏离，使得那些层的凹槽（405）在相互正交的方向上延伸，并且多个开口（408）用作气相流动路径的一部分，通过该气相流路 由受热板接受的热量蒸发的蒸气制冷剂循环。

公开(公告)号：US20100254088A1

公开(公告)日：2010-10-07

申请号：US12730593

申请日：2010-03-24

申请人： Yuichi Ishida ,  Mitsuo Hashimoto ,  Kazuaki Yazawa ,  Hiroyuki Ryoson ,  Tatsuhiko Shigemoto

发明人： Yuichi Ishida ,  Mitsuo Hashimoto ,  Kazuaki Yazawa ,  Hiroyuki Ryoson ,  Tatsuhiko Shigemoto

IPC分类号： H05K7/20 ,  F28D15/00 ,  B21D53/02

CPC分类号： H05K7/203 ,  F28D15/02 ,  F28D15/046 ,  F28F23/00 ,  G06F1/20 ,  G06F2200/201 ,  Y10T29/4935

摘要： According to an embodiment of the present invention, there is provided a heat transport device including a working fluid, an evaporation portion, a condenser portion, a flow path portion, and an area. The working fluid includes pure water and an organic compound bearing a hydroxyl group. The evaporation portion causes the working fluid to evaporate from a liquid phase to a vapor phase. The condenser portion communicates with the evaporation portion, and causes the working fluid to condense from the vapor phase to the liquid phase. The flow path portion causes the working fluid condensed in the condenser portion to the liquid phase to flow to the evaporation portion. The area is made of a carbon material and provided on at least one of the evaporation portion, the condenser portion, and the flow path portion.

摘要翻译： 根据本发明的实施例，提供了一种包括工作流体，蒸发部分，冷凝器部分，流路部分和区域的热传输装置。 工作流体包括纯水和带有羟基的有机化合物。 蒸发部分使工作流体从液相蒸发成气相。 冷凝器部与蒸发部连通，使工作流体从气相冷凝成液相。 流路部使冷凝部冷凝的液相流向蒸发部。 该区域由碳材料制成并且设置在蒸发部分，冷凝器部分和流动路径部分中的至少一个上。