Light source and vehicle lamp
    2.
    发明授权
    Light source and vehicle lamp 有权
    光源和车灯

    公开(公告)号:US08142060B2

    公开(公告)日:2012-03-27

    申请号:US12372831

    申请日:2009-02-18

    IPC分类号: F21S8/10

    摘要: The disclosed subject matter includes light sources that have high use efficiency and a favorable bright distribution, and includes vehicle lamps that have both a favorable light distribution pattern and a capability of being simply composed by using the LED light sources. The light source can include a base board, at least one die bonding pad and wire bonding pad on the base board, at least one LED chip mounted on the die bonding pad and connected to respective bonding pads, and an encapsulating resin over the LED chip. The at least one LED chip can emit a uniform light with a distribution electrode on a top surface thereof and can form a favorable light distribution using a shield electrode on the top surface. The vehicle lamp can include the light source and an optical lens selected according to a kind and/or design of a vehicle lamp.

    摘要翻译: 所公开的主题包括具有高使用效率和良好的亮度分布的光源,并且包括具有良好的配光图案和能够简单地通过使用LED光源的能力的车辆灯。 光源可以包括基板,至少一个裸片接合焊盘和基板上的引线键合焊盘,安装在芯片焊盘上并连接到各个焊盘的至少一个LED芯片以及LED芯片上的封装树脂 。 至少一个LED芯片可以在其顶表面上发射具有分配电极的均匀光,并且可以在顶表面上使用屏蔽电极形成良好的光分布。 车灯可以包括光源和根据车灯的种类和/或设计选择的光学透镜。

    SEMICONDUCTOR LIGHT-EMITTING DEVICE AND MANUFACTURING METHOD
    3.
    发明申请
    SEMICONDUCTOR LIGHT-EMITTING DEVICE AND MANUFACTURING METHOD 有权
    半导体发光器件及制造方法

    公开(公告)号:US20120025218A1

    公开(公告)日:2012-02-02

    申请号:US13196868

    申请日:2011-08-02

    IPC分类号: H01L33/50

    摘要: A semiconductor light-emitting device and a method for manufacturing the same can include a wavelength converting layer located on at least one semiconductor light-emitting chip in order to emit various colored lights including white light. The semiconductor light-emitting device can include a base board, the chip mounted on the base board and a transparent plate disposed on the wavelength converting layer including a spacer and a phosphor having a high density. The wavelength converting layer can be formed in a thin uniform thickness between the transparent plate and a top surface of the chip using the spacer so as to extend toward the transparent plate. The semiconductor light-emitting device can be configured to improve light-emitting efficiency of the chip by using the thin wavelength converting layer including the phosphor having a high density, and therefore can emit a wavelength-converted light having a high light-emitting efficiency from a small light-emitting surface.

    摘要翻译: 半导体发光器件及其制造方法可以包括位于至少一个半导体发光芯片上的波长转换层,以便发射包括白光的各种彩色光。 半导体发光装置可以包括基板,安装在基板上的芯片和布置在波长转换层上的透明板,该透明板包括间隔物和具有高密度的荧光体。 波长转换层可以使用间隔物在透明板和芯片的顶表面之间以均匀的厚度形成,以朝向透明板延伸。 半导体发光器件可以通过使用包括具有高密度的荧光体的薄波长转换层来提高芯片的发光效率,因此可以发射具有高发光效率的波长转换光 一个小的发光面。

    LED and method of manufacturing the same
    4.
    发明申请
    LED and method of manufacturing the same 有权
    LED及其制造方法

    公开(公告)号:US20060038187A1

    公开(公告)日:2006-02-23

    申请号:US11199168

    申请日:2005-08-09

    申请人: Kazuhiko Ueno

    发明人: Kazuhiko Ueno

    IPC分类号: H01L33/00

    摘要: An LED can include a pair of electrode members, and an LED chip joined to a chip mount portion disposed at the extremity of one of the pair of electrode members. The LED chip can be electrically connected to the pair of electrode members. A transparent resin portion can include a wavelength conversion material mixed therein, the transparent resin portion formed in such a manner as to surround the LED chip, wherein the LED chip is positioned offset toward one side in the transparent resin portion, and wherein the wavelength conversion material mixed in the transparent resin portion has a higher density around the LED chip within the transparent resin portion.

    摘要翻译: LED可以包括一对电极构件和连接到设置在该对电极构件之一的末端的芯片安装部分的LED芯片。 LED芯片可以电连接到一对电极部件。 透明树脂部分可以包括混合在其中的波长转换材料,透明树脂部分以围绕LED芯片的方式形成,其中LED芯片定位为偏离透明树脂部分中的一侧,并且其中波长转换 在透明树脂部分中混合的材料在透明树脂部分内的LED芯片周围具有更高的密度。

    White LED light source device and LED backlight using the same
    5.
    发明授权
    White LED light source device and LED backlight using the same 有权
    白色LED光源装置和LED背光使用相同

    公开(公告)号:US07810947B2

    公开(公告)日:2010-10-12

    申请号:US11950100

    申请日:2007-12-04

    IPC分类号: F21V9/00

    摘要: A white LED light source device and an LED backlight using the white LED light source can produce, among other features, white light with sufficient luminous intensity, uniform color tone, and high luminous utilization efficiency. A light path for producing white light with favorable color mixture can be shortened. The white LED light source device can be configured to include a bluish green LED lamp which can emit bluish green light by the combination of a blue LED device and a green phosphor material and a purple LED lamp which can emit purple light by the combination of a blue LED device and a red phosphor material. The bluish green light from the bluish green LED lamp and the purple light from the purple LED lamp are subjected to additive color mixture to produce white light with a spectrum containing three primary color wavelength components.

    摘要翻译: 使用白色LED光源的白色LED光源装置和LED背光源可以产生具有足够的发光强度,均匀色调和高发光效率的白光等特征。 可以缩短用于产生具有良好颜色混合物的白光的光路。 白色LED光源装置可以被配置为包括蓝绿色LED灯,其可以通过蓝色LED装置和绿色荧光体材料的组合发出蓝绿色光,以及紫色LED灯,其可以通过组合发出紫色光 蓝色LED装置和红色荧光体材料。 来自蓝绿色LED灯的蓝绿色绿色和紫色LED灯的紫色光被加入混色,产生含有三原色波长成分的光谱的白光。

    SEMICONDUCTOR LIGHT EMITTING DEVICE AND LIGHTING DEVICE
    7.
    发明申请
    SEMICONDUCTOR LIGHT EMITTING DEVICE AND LIGHTING DEVICE 审中-公开
    半导体发光器件和照明器件

    公开(公告)号:US20090134417A1

    公开(公告)日:2009-05-28

    申请号:US12276271

    申请日:2008-11-21

    IPC分类号: H01J1/62 H01L33/00

    摘要: A semiconductor light emitting device can include a light emitting element with a semiconductor epitaxial layer which has a light emitting portion, and an element substrate which supports the semiconductor epitaxial layer and does not transmit light from the light emitting portion. A resin layer can be provided on the element substrate in a way covering side surfaces and an upper surface of the semiconductor epitaxial layer. The resin layer can contain fluorescent substances that wavelength-convert light from the light emitting portion, and can be inclined toward the top at one cross section. Therefore, the semiconductor light emitting device can exhibit a front luminance distribution having a difference in front luminance between the light emitting portion and the light non-emitting portion at an end portion of the semiconductor light emitting device.

    摘要翻译: 半导体发光器件可以包括具有发光部分的半导体外延层的发光元件和支撑半导体外延层并且不透射来自发光部分的光的元件基板。 可以以覆盖半导体外延层的侧表面和上表面的方式在元件基板上设置树脂层。 树脂层可以含有从发光部分波长转换光的荧光物质,并且可以在一个横截面向顶部倾斜。 因此,半导体发光器件可以呈现在半导体发光器件的端部处的发光部分和不发光部分之间的正面亮度差异的正面亮度分布。

    White LED Light Source Device and LED Backlight Using the Same
    8.
    发明申请
    White LED Light Source Device and LED Backlight Using the Same 有权
    白色LED光源设备和使用其的LED背光源

    公开(公告)号:US20080151527A1

    公开(公告)日:2008-06-26

    申请号:US11950100

    申请日:2007-12-04

    IPC分类号: F21V9/16 F21V9/00

    摘要: A white LED light source device and an LED backlight using the white LED light source can produce, among other features, white light with sufficient luminous intensity, uniform color tone, and high luminous utilization efficiency. A light path for producing white light with favorable color mixture can be shortened. The white LED light source device can be configured to include a bluish green LED lamp which can emit bluish green light by the combination of a blue LED device and a green phosphor material and a purple LED lamp which can emit purple light by the combination of a blue LED device and a red phosphor material. The bluish green light from the bluish green LED lamp and the purple light from the purple LED lamp are subjected to additive color mixture to produce white light with a spectrum containing three primary color wavelength components.

    摘要翻译: 使用白色LED光源的白色LED光源装置和LED背光源可以产生具有足够的发光强度,均匀色调和高发光效率的白光等特征。 可以缩短用于产生具有良好颜色混合物的白光的光路。 白色LED光源装置可以被配置为包括蓝绿色LED灯,其可以通过蓝色LED装置和绿色荧光体材料的组合发出蓝绿色光,以及紫色LED灯,其可以通过组合发出紫色光 蓝色LED装置和红色荧光体材料。 来自蓝绿色LED灯的蓝绿色绿色和紫色LED灯的紫色光被加入混色,产生含有三原色波长成分的光谱的白光。

    Light emitting device
    9.
    发明授权
    Light emitting device 有权
    发光装置

    公开(公告)号:US07221003B2

    公开(公告)日:2007-05-22

    申请号:US11276834

    申请日:2006-03-16

    IPC分类号: H01L33/00

    摘要: A light-emitting device can include a blue LED chip that is covered in a sealing resin composed of a filling resin mixed with a wavelength conversion material, such as a yellow fluorescent material. Light from the blue LED chip is mixed with a light from the yellow fluorescent material to obtain white light emission having a mixed color. The sealing resin has a light emission surface, which can be symmetrical about the normal line passing through the center of the blue LED chip. An optical multi-layered film including layered high- and low-refractive index films can be provided on the light emission surface.

    摘要翻译: 发光装置可以包括蓝色LED芯片,其被由与诸如黄色荧光材料的波长转换材料混合的填充树脂组成的密封树脂中覆盖。 来自蓝色LED芯片的光与来自黄色荧光材料的光混合以获得具有混合颜色的白色发光。 密封树脂具有发光面,其可以通过蓝色LED芯片的中心的法线对称。 可以在光发射表面上设置包括层状高折射率膜和低折射率膜的光学多层膜。