公开(公告)号：US20210122064A1

公开(公告)日：2021-04-29

申请号：US17031888

申请日：2020-09-24

Applicant: KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY

Inventor： Sanha KIM ,  Donggeun KIM ,  Hyeongmin JE

IPC: B25J15/00 ,  B25J13/08 ,  B33Y80/00

Abstract: Disclosed are a design and manufacturing method for a three-dimensional electromechanical adhesive surface structure capable of adhesive force manipulation and tactile sensing by using 3D printing. The three-dimensional electromechanical adhesive surface structure includes: a body; a plurality of three-dimensional micro pillar structures which are attached to the body at a certain angle; and a wire which supplies voltage to the plurality of three-dimensional micro pillar structures. The three-dimensional micro pillar structure includes: a pillar which is attached to the body at a certain angle and is formed integrally with the body; a conductive material which is applied to surround the pillar; and an insulating material coated to surround the conductive material in order to be insulated from an opposite surface. The voltage supplied through the wire is supplied to the conductive material. A passage for providing the wire is formed under the plurality of three-dimensional micro pillar structures of the body. As a result, a technology allowing a robot to recognize, feel, and move an object beyond the human level is implemented, so that it is possible to maximize the convenience and efficiency.

公开(公告)号：US20240217056A1

公开(公告)日：2024-07-04

申请号：US18289189

申请日：2021-11-12

Applicant: KPX CHEMICAL CO., LTD. ,  KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY

Inventor： Byung Ju MIN ,  Seok Ji HONG ,  Seung Geun KIM ,  Jung Hee CHOI ,  Min Woo KANG ,  Nam Gue OH ,  Sanha KIM ,  Ji Hun JEONG ,  Hyun Jun RYU ,  Sukkyung KANG ,  Seong Jae KIM

IPC: B24B37/22 ,  B24B37/24 ,  B24D11/00 ,  B24D11/02

CPC classification number: B24B37/22 ,  B24B37/24 ,  B24D11/003 ,  B24D11/02

Abstract: The present invention provides a composite polishing pad for CMP, and a method for producing the same. The composite polishing pad for CMP comprises: a soft polymer substrate layer including a plurality of protrusions formed on the upper surface thereof; a carbon nanotube layer including carbon nanotubes embedded in and bound to the upper portion of the substrate layer; and a hard polymer coating layer having the carbon nanotubes protruding outwardly on the upper portion of the carbon nanotube layer embedded and bound thereto.

公开(公告)号：US20240253178A1

公开(公告)日：2024-08-01

申请号：US18289607

申请日：2021-11-12

Applicant: KPX CHEMICAL CO., LTD. ,  KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY

Inventor： Byung Ju MIN ,  Seok Ji HONG ,  Seung Geun KIM ,  Jung Hee CHOI ,  Min Woo KANG ,  Nam Gue OH ,  Sanha KIM ,  Ji Hun JEONG ,  Hyun Jun RYU ,  Sukkyung KANG ,  Seong Jae KIM

IPC: B24B37/24 ,  B29C41/00 ,  B29C41/02 ,  B29C41/42 ,  B29C41/50 ,  B29C59/00 ,  B29K105/16 ,  B29K507/04 ,  B29L31/00

CPC classification number: B24B37/24 ,  B29C41/003 ,  B29C41/02 ,  B29C41/42 ,  B29C41/50 ,  B29C59/002 ,  B29K2105/167 ,  B29K2507/04 ,  B29K2995/007 ,  B29K2995/0094 ,  B29L2031/736

Abstract: A composite polishing pad for chemical mechanical polishing (CMP) and a method for producing the composite CMP. The composite polishing pad for CMP contains a polymer substrate layer including a plurality of protrusions formed on the upper surface thereof; and a carbon nanotube layer including carbon nanotubes embedded in and fixed to the upper portion of the substrate layer.