Abstract:
Disclosed is a micromirror actuator having a two-axis freedom and actuated by an electromagnetic force and fabrication method thereof. The micromirror actuator includes a substrate, a frame configured to be connected with the substrate, a micromirror configured to be connected with the frame, first and second torsion bars connecting the substrate with the frame, third and fourth torsion bars connecting the frame with the micromirror, four interdigitated cantilevers configured to be connected to the substrate, four connecting bars connecting the four interdigitated cantilevers with the frame, interconnection lines formed on the four interdigitated cantilevers and the micromirror, and first and second magnets installed outside the substrate. since the micromirror actuator of the present invention can be actuated around two axes by electromagnetic force generated by electromagnetic field applied from outside, it is possible to obtain large force and large rotational angle. In addition, the micromirror actuator has a mechanically robust structure endurable against external impact, and is operable at a low voltage of 5V or loss. Further, it is possible to obtain a flat mirror surface sine the upper silicon layer of the SOI substrate is used as the mirror surface.
Abstract:
Disclosed is an electrostatic actuator. A multi-layered auxiliary electrode is further arranged between main electrode and actuating body, and positive charge or negative charge is applied to main electrode, respective auxiliary electrodes, and actuating body such that electrostatic attractive force is generated between auxiliary electrodes adjacent to the main electrode, between adjacent auxiliary electrodes, and between auxiliary electrodes adjacent to the actuating body. According to the invention, distance between the induced charges is shortened, so that electrostatic attractive force therebetween increases, thereby capable of maintaining an actuating range equal to or larger than the conventional electrostatic actuator. The electrostatic actuator according to the present invention can be applied to various MEMS devices, such as an optical switch in which a mirror is formed in the actuator, a radio frequency (RF) switch, or a variable electrostatic capacitor, or the like.
Abstract:
The present invention relates to a micropump which is driven by movement of a liquid drop based upon continuous electrowetting actuation. The continuous electrowetting means a phenomenon that the liquid drop moves as the surface tension of the liquid drop is electrically varied in succession. When a tube in which electrolyte and a liquid metal drop are inserted is applied with voltage having periodically changing polarity via metal electrodes, the surface tension of the liquid metal is varied so that the liquid metal drop reciprocates in the tube generating pressure or force, which is used as a driving force of the micropump. The micropump is operated in a low voltage and consumes a small amount of electric power.
Abstract:
Disclosed is a micromirror actuator with the degrees of freedom of two axes operated by an electrostatic force. The micromirror actuator comprises: a substrate provided with an insulating layer formed thereon; two lower columns spaced from each other by a designated distance, and formed on the insulating layer; a first torsion bar extending over upper surfaces of the lower columns; a second torsion bar formed so that the first and second torsion bars are orthogonal to each other; four electrodes, each disposed in four areas formed by the orthogonal crossing of the first and second torsion bars, formed on the insulating layer; two upper columns formed on an upper surface of the second torsion bar so that upper surfaces of the upper columns are located at higher positions than upper surfaces of the electrodes; and a micromirror located on the upper surfaces of the upper columns so that the micromirror is supported by the upper columns. In the micromirror actuator, the micromirror is elevated to a desired height by means of two upper columns, and the dimensions of its structure are reduced by locating torsion bars under the micromirror. Further, the micromirror actuator allows the micromirror to be selectively tilted centering on two torsion bars depending on electrodes to which voltage is applied, thus being used as a three-dimensional optical switch.
Abstract:
An electrothermal integrator and audio frequency filter utilizing an electrothermal structure fabricated by way of a micro-machining process. An electrothermal structure is a structure in which there is thermal interaction between its electrical components. It is possible to implement an audio frequency filter by properly integrating electrothermal structures fabricated by micro-machining technology and electrical circuitry, because thermal response is generally slower than electrical response. It is possible to implement a variety of filters by way of forming a Gm-C integrator utilizing an electrothermal structure and using this basic block of Gm-C integrator in general circuitry to form filters.
Abstract:
A probe is provided for an SPM (Scanning Probe Microscope), and a method is provided for fabricating the probe in which a double side alignment process is not required to simplify the fabricating. The probe includes a cantilever; a body supporting the cantilever; and a tip formed at an end of the cantilever, wherein the cantilever, the body and the tip are made of silicon, and boron is diffused into the cantilever and a predetermined area of the body. The method includes steps of: forming a first mask layer on an area of a silicon substrate to be formed with the body and the tip; etching the silicon substrate in a predetermined depth using the first mask layer to form the tip; removing the first mask and forming a second mask layer on an area of the silicon substrate except for an area to be formed with the body and the cantilever; forming a boron-diffused layer by diffusing boron into an area to be formed with the cantilever and a predetermined area of the body using the second mask; removing the second mask layer and forming a third mask layer on the boron-diffused layer; and etching the silicon substrate using the third mask layer to form the body and the cantilever.