公开(公告)号：US20020005752A1

公开(公告)日：2002-01-17

申请号：US09766839

申请日：2001-01-23

Applicant: Korea Advanced Institute of Science and Technology

Inventor： Euisik Yoon ,  Kwang Hyun Lee ,  Hyung Kew Lee

IPC: H03B001/00

CPC classification number: H03H11/0422 ,  G01F1/6845 ,  G01F1/696

Abstract: An electrothermal integrator and audio frequency filter utilizing an electrothermal structure fabricated by way of a micro-machining process. An electrothermal structure is a structure in which there is thermal interaction between its electrical components. It is possible to implement an audio frequency filter by properly integrating electrothermal structures fabricated by micro-machining technology and electrical circuitry, because thermal response is generally slower than electrical response. It is possible to implement a variety of filters by way of forming a Gm-C integrator utilizing an electrothermal structure and using this basic block of Gm-C integrator in general circuitry to form filters.