公开(公告)号：US11366027B2

公开(公告)日：2022-06-21

申请号：US15777448

申请日：2016-12-12

Applicant: KONINKLIJKE PHILIPS N.V.

Inventor： Louis Nicolas Atallah ,  Patrick Zuidema

IPC: A61B5/00 ,  G01K13/20 ,  G01K7/42 ,  A61B5/01 ,  G01K1/16

Abstract: The invention describes a method of predicting a stabilization temperature (T∞) of a subject (8) with a heat-flow sensor (1) comprising a plurality of thermistors (S1, S2, S1A, S2A, S1B, S2B), which method comprises the steps of expressing the temperature development of the heat-flow sensor (1) as a stretched exponential equation characterized by a time constant (τ) and a sensor characteristic scalar value (m); receiving temperature measurement values (T1, T2, T3, T4) collected by the thermistors (S1, S2, S1A, S2A, S1B, S2B); estimating the time constant (τ) on the basis of the temperature measurement values (T1, T2, T3, T4); and deducing the future stabilization temperature (T∞) on the basis of the estimated time constant (τ). The invention further describes heat-flow sensor (1) and a temperature sensing arrangement (9).

公开(公告)号：US10026884B2

公开(公告)日：2018-07-17

申请号：US15557087

申请日：2016-03-03

Applicant: KONINKLIJKE PHILIPS N.V.

Inventor： Norbertus Antonius Maria Sweegers ,  Marc Andre de Samber ,  Patrick Zuidema

IPC: H01L33/00 ,  H01L33/64 ,  H01L33/62 ,  H01L33/50 ,  F21V19/00 ,  H01L25/075 ,  F21K9/232 ,  F21Y115/10

Abstract: A light emitting device such as luminaire includes one or more light emitting device chips mounted on a board. The light emitting device chips have electrical contacts and are flip chip mounted to board with the electrical contacts connected to contact pads. Sidewall metallizations on the sidewalls of the light emitting device chips are connected by metal heat transfer elements to heat dissipation regions of board. The metal heat transfer elements may be of solder which may be deposited using equipment conventionally used for attaching surface mount devices.

公开(公告)号：US20180356298A1

公开(公告)日：2018-12-13

申请号：US15777448

申请日：2016-12-12

Applicant: KONINKLIJKE PHILIPS N.V.

Inventor： Louis Nicolas Atallah ,  Patrick Zuidema

IPC: G01K13/00 ,  G01K7/42 ,  G01K1/16

CPC classification number: G01K13/002 ,  G01K1/165 ,  G01K7/42

Abstract: The invention describes a method of predicting a stabilization temperature (T∞) of a subject (8) by means of a heat-flow sensor (1) comprising a plurality of thermistors (S1, S2, S1A, S2A, S1B, S2B), which method comprises the steps of expressing the temperature development of the heat-flow sensor (1) as a stretched exponential equation characterized by a time constant (τ) and a sensor characteristic scalar value (m); receiving temperature measurement values (T1, T2, T3, T4) collected by the thermistors (S1, S2, S1A, S2A, S1B, S2B); estimating the time constant (τ) on the basis of the temperature measurement values (T1, T2, T3, T4); and deducing the future stabilization temperature (T∞) on the basis of the estimated time constant (τ). The invention further describes heat-flow sensor (1) and a temperature sensing arrangement (9).