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公开(公告)号：US20170165715A1
公开(公告)日：2017-06-15
申请号：US15325492
申请日：2015-07-13
发明人： WOJTEK SUDOL , PETER DIRKSEN , VINCENT ADRIANUS HENNEKEN , RONALD DEKKER , MARCUS CORNELIS LOUWERSE
CPC分类号： B06B1/0292 , B81B2201/0292 , B81C1/00214 , G01N29/2406 , G01N29/262 , G01N2291/02475 , G01N2291/106 , H04R19/00
摘要： A large aperture CMUT transducer array is formed of a plurality of adjacently located tiles of CMUT cells. The adjacent edges of the tiles are formed by an anisotropic etch process, preferably a deep reactive ion etching process which is capable of cutting through the die and its substrate while maintaining vertical edges in close proximity to the CMUT cells at the edge of the tile. This enables the CMUT cells of continuous rows or columns to exhibit a constant pitch over multiple CMUT cell tiles. The tiles also contain interconnect electrodes along an edge for making electrical connections to the tiles with flex circuit.
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公开(公告)号：US20170319180A1
公开(公告)日：2017-11-09
申请号：US15533776
申请日：2015-12-10
CPC分类号： A61B8/4494 , A61B8/12 , B06B1/0292
摘要： A CMUT transducer array comprising a first column (58) of spaced CMUT cells on at least one silicon island, a second column (58) of spaced CMUT cells on at least one further silicon island, the second column being staggered in alignment with the first column such that cells of the second column are partially located in spaces between successive cells of the first column, the first column and the second column being spaced apart by a gap, and a flexible foil retaining the respective silicon islands, the flexible foil comprising conductive interconnects.
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公开(公告)号：US20210114061A1
公开(公告)日：2021-04-22
申请号：US17030599
申请日：2020-09-24
发明人： JOHANNES WILHELMUS WEEKAMP , VINCENT ADRIANUS HENNEKEN , ALFONS WOUTER GROENLAND , MARCUS CORNELIS LOUWERSE
IPC分类号： B06B1/06 , G10K11/00 , A61B8/00 , H01L41/047 , H01L41/113 , H01L41/293
摘要： Disclosed is a method for manufacturing an ultrasonic transducer assembly comprising an ultrasonic transducer chip having a main surface comprising a plurality of ultrasound transducer elements and a plurality of first contacts for connecting to said ultrasound transducer elements, a contact chip having a further main surface comprising a plurality of second contacts, a backing member comprising ultrasound absorbing and/or scattering bodies, said backing member comprising a first surface on which the transducer chip is mounted and a second surface on which the contact chip is mounted. A flexible interconnect extends over said backing member from the main surface to the further main surface, the flexible interconnect comprising a plurality of conductive tracks, each conductive track connecting one of said first contacts to a second contact. An ultrasound probe including such an assembly, an ultrasonic imaging system including such an ultrasound probes and manufacturing methods of such an assembly and probe are also disclosed.
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4.发明申请公开(公告)号：US20170209898A1
公开(公告)日：2017-07-27
申请号：US15326055
申请日：2015-06-25
发明人： VINCENT ADRIANUS HENNEKEN , MARCUS CORNELIS LOUWERSE , JOHANNES WILHELMUS WEEKAMP , RONALD DEKKER , MARC GODFRIEDUS MARIE NOTTEN , ANTONIA CORNELIA JEANNET VAN RENS
摘要： An ultrasound transducer arrangement (100) is disclosed comprising a plurality of substrate islands (110, 120, 130) spatially separated and electrically interconnected by a flexible polymer assembly (150) including electrically conductive tracks providing said electrical interconnections, said plurality including a first substrate island (110) comprising a plurality of ultra sound transducer cells (112) and a second substrate island (120) comprising an array of external contacts for connecting the ultrasound sensor arrangement to a flexible tubular body including a coaxial wire assembly (200) comprising a plurality of coaxial wires (220) each having a conductive core (228) covered by an electrically insulating sleeve (226); and an electrically insulating body (210) having a first main surface (211), a second main surface (213) and a plurality of through holes (212) each extending from the first main surface to the second main surface and coated with an electrically conductive member, wherein each coaxial wire comprises an exposed terminal core portion mounted in one of said though holes from the first main surface, and wherein each through hole is sealed by a solder bump (214) on the second main surface such that the ultrasound transducer arrangement can be directly mounted on the flexible tubular body without the need for a PCB.
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