SCINTILLATOR PACK COMPRISING AN X-RAY ABSORBING ENCAPSULATION AND X-RAY DETECTOR ARRAY COMPRISING SUCH SCINTILLATOR PACK
    2.
    发明申请
    SCINTILLATOR PACK COMPRISING AN X-RAY ABSORBING ENCAPSULATION AND X-RAY DETECTOR ARRAY COMPRISING SUCH SCINTILLATOR PACK 有权
    包含X射线吸收封装的X射线探测器阵列和包含这种扫描器包的X射线探测器阵列

    公开(公告)号:US20140321609A1

    公开(公告)日:2014-10-30

    申请号:US14358058

    申请日:2012-11-23

    IPC分类号: G01T1/208 G01N23/04

    摘要: A scintillator pack (2) and a CT X-ray detector array (1) comprising such scintillator pack (2) are proposed. The scintillator pack (2) comprises an array of scintillator pixels (3). At a bottom surface (31) of each scintillator pixel (3), an X-ray absorbing encapsulation (13) is provided. This encapsulation (13) comprises an electrically insulating highly X-ray absorbing material having an atomic number greater than 60 such as, for example, Bismuth oxide (Bi2O3). The X-ray absorbing encapsulation (13) is interposed between the scintillator pixels (3) and an electronic circuit (19). The electronic circuit (19) may be provided as an ASIC in CMOS technology and may therefore be sensitive to X-ray induced damage. The encapsulation (13) provides for good X-ray protection of such electronic circuit (19).

    摘要翻译: 提出了包括这种闪烁体组(2)的闪烁体组(2)和CT X射线检测器阵列(1)。 闪烁体组件(2)包括闪烁体像素阵列(3)。 在每个闪烁体像素(3)的底表面(31)处,提供X射线吸收封装(13)。 这种封装(13)包括原子序数大于60的电绝缘高X射线吸收材料,例如氧化铋(Bi 2 O 3)。 X射线吸收封装(13)介于闪烁体像素(3)和电子电路(19)之间。 电子电路(19)可以以CMOS技术提供为ASIC,因此可能对X射线引起的损伤敏感。 封装(13)提供了这种电子电路(19)的良好X射线保护。