-
公开(公告)号：US20230062556A1
公开(公告)日：2023-03-02
申请号：US17412887
申请日：2021-08-26
发明人： Michael Kuntzman , Ken Deng , Faisal Zaman , Bing Yu , Vahid Naderyan , Peter V. Loeppert
IPC分类号： B81B7/00
摘要： A microelectromechanical systems (MEMS) die includes a first diaphragm and a second diaphragm, wherein the first diaphragm and the second diaphragm bound a sealed chamber. A stationary electrode is disposed within the sealed chamber between the first diaphragm and the second diaphragm. A tunnel passes through the first diaphragm and the second diaphragm without passing through the stationary electrode, wherein the tunnel is sealed off from the chamber. The MEMS die further includes a substrate having an opening formed therethrough, wherein the tunnel provides fluid communication from the opening, through the second diaphragm, and through the first diaphragm.
-
公开(公告)号：US10939214B2
公开(公告)日：2021-03-02
申请号：US16593263
申请日：2019-10-04
发明人： Michael Kuntzman , Michael Pedersen , Sung Bok Lee , Bing Yu , Vahid Naderyan , Peter Loeppert
摘要： An acoustic transducer for generating electrical signals in response to acoustic signals, comprises a first diaphragm having a first corrugation formed therein. A second diaphragm has a second corrugation formed therein, and is spaced apart from the first diaphragm such that a cavity having a pressure lower than atmospheric pressure is formed therebetween. A back plate is disposed between the first diaphragm and the second diaphragm. One or more posts extend from at least one of the first diaphragm or the second diaphragm towards the other through the back plate. The one or more posts prevent each of the first diaphragm and the second diaphragm from contacting the back plate due to movement of the first diaphragm and/or the second diaphragm towards the back plate. Each of the first corrugation and the second corrugation protrude outwardly from the first diaphragm and the second diaphragm, respectively, away from the back plate.
-
公开(公告)号：US20230134752A1
公开(公告)日：2023-05-04
申请号：US17518350
申请日：2021-11-03
发明人： Michael Kuntzman , Michael Pedersen , Faisal Zaman , Xin Song , Vahid Naderyan
摘要： A MEMS diaphragm assembly comprises a first diaphragm, a second diaphragm, and a stationary electrode assembly spaced between the first and second diaphragms and including a plurality of apertures disposed therethrough. Each of a plurality of pillars is disposed through one of the plurality of apertures and connects the first and second diaphragms. At least one of the first and second diaphragms is connected to the stationary electrode assembly at a geometric center of the assembly.
-
公开(公告)号：US11617042B2
公开(公告)日：2023-03-28
申请号：US17159983
申请日：2021-01-27
发明人： Michael Kuntzman , Michael Pedersen , Sung Bok Lee , Bing Yu , Vahid Naderyan , Peter Loeppert
摘要： An acoustic transducer for generating electrical signals in response to acoustic signals, comprises a first diaphragm having a first corrugation formed therein. A second diaphragm has a second corrugation formed therein, and is spaced apart from the first diaphragm such that a cavity having a pressure lower than atmospheric pressure is formed therebetween. A back plate is disposed between the first diaphragm and the second diaphragm. One or more posts extend from at least one of the first diaphragm or the second diaphragm towards the other through the back plate. The one or more posts prevent each of the first diaphragm and the second diaphragm from contacting the back plate due to movement of the first diaphragm and/or the second diaphragm towards the back plate. Each of the first corrugation and the second corrugation protrude outwardly from the first diaphragm and the second diaphragm, respectively, away from the back plate.
-
公开(公告)号：US20240208802A1
公开(公告)日：2024-06-27
申请号：US18600185
申请日：2024-03-08
IPC分类号： B81B3/00
CPC分类号： B81B3/0021 , B81B3/0054 , B81B2201/0257 , B81B2203/0127 , B81B2203/04
摘要： A micro-electro-mechanical systems (MEMS) die includes a piston; an electrode facing the piston, wherein a capacitance between the piston and the electrode changes as the distance between the piston and the electrode changes; and a resilient structure (e.g., a gasket or a pleated wall) disposed between the piston and the electrode, wherein the resilient structure supports the piston and resists the movement of the piston with respect to the electrode. A back volume is bounded by the piston and the resilient structure and the resilient structure blocks air from leaving the back volume. The piston may be a rigid body made of a conductive material, such as metal or a doped semiconductor. The MEMS die may also include a second resilient structure, which provides further support to the piston and is disposed within the back volume.
-
公开(公告)号：US11787688B2
公开(公告)日：2023-10-17
申请号：US17099442
申请日：2020-11-16
发明人： Sung Bok Lee , Vahid Naderyan , Bing Yu , Michael Kuntzman , Yunfei Ma , Michael Pedersen
CPC分类号： B81C1/00158 , B81B3/0021 , G01L9/0042 , H04R31/003 , B81B2201/0257 , B81B2201/0264 , B81B2203/0127 , B81C2201/0132 , B81C2201/0133
摘要： A method of forming an acoustic transducer comprises providing a substrate and depositing a first structural layer on the substrate. The first structural layer is selectively etched to form at least one of an enclosed trench or an enclosed pillar thereon. A second structural layer is deposited on the first structural layer and includes a depression or a bump corresponding to the enclosed trench or pillar, respectively. At least the second structural layer is heated to a temperature above a glass transition temperature of the second structural layer causing the second structural layer to reflow. A diaphragm layer is deposited on the second structural layer such that the diaphragm layer includes at least one of a downward facing corrugation corresponding to the depression or an upward facing corrugation corresponding to the bump. The diaphragm layer is released, thereby forming a diaphragm suspended over the substrate.
-
公开(公告)号：US20230288281A1
公开(公告)日：2023-09-14
申请号：US18184466
申请日：2023-03-15
发明人： Andy Unruh , Sung Bok Lee , Pete Loeppert , Wade Conklin , Michael Kuntzman , Vahid Naderyan
CPC分类号： G01L19/0092 , G01L9/0016 , G01L9/0047 , H04R19/005 , H04R19/04 , H04R2499/11 , H04R2499/15
摘要： In accordance with one aspect, a device is provided having a transducer comprising a conductor, a diaphragm configured to move relative to the conductor, and a reference volume in communication with the external environment. The diaphragm separates the reference volume and the external environment. The device further includes a controller operably coupled to the transducer and configured to determine an air pressure of an external environment based at least in part on movement of the diaphragm.
-
公开(公告)号：US11716578B2
公开(公告)日：2023-08-01
申请号：US17173661
申请日：2021-02-11
发明人： Vahid Naderyan , Sung Lee , Ankur Sharma , Nick Wakefield
CPC分类号： H04R19/04 , H04R7/06 , H04R7/18 , H04R2201/003 , H04R2307/027
摘要： A MEMS die includes a substrate having an opening formed therein, a diaphragm having a first surface attached around a periphery thereof to the substrate and over the opening, and a backplate separated from a second surface of the diaphragm. The diaphragm includes at least one passage disposed between the first and second surfaces, and the at least one passage has a smaller cross-sectional area at the first surface than at the second surface.
-
公开(公告)号：US11671766B2
公开(公告)日：2023-06-06
申请号：US17531229
申请日：2021-11-19
发明人： Sung Bok Lee , Vahid Naderyan , Bing Yu , Michael Kuntzman , Yunfei Ma , Wade Conklin , Peter Loeppert
IPC分类号： H04R25/00 , H04R19/04 , H04R7/18 , H04R7/06 , B81B3/00 , B81B7/00 , H04R1/04 , H04R3/00 , H04R7/10
CPC分类号： H04R19/04 , B81B3/0072 , B81B7/0025 , H04R1/04 , H04R3/00 , H04R7/06 , H04R7/10 , H04R7/18 , B81B2201/0257 , B81B2203/019 , B81B2203/0127 , B81B2207/012 , H04R2201/003
摘要： A microphone device includes a base and a microelectromechanical system (MEMS) transducer and an integrated circuit (IC) disposed on the base. The microphone device also includes a cover mounted on the base and covering the MEMS transducer and the IC. The MEMS transducer includes a diaphragm attached to a surface of the substrate and a back plate mounted on the substrate and in a spaced apart relationship with the diaphragm. The diaphragm is attached to the surface of the substrate along at least a portion of a periphery of the diaphragm. The diaphragm can include a silicon nitride insulating layer, and a conductive layer, that faces a conductive layer of the back plate. The MEMS transducer can include a peripheral support structure that is disposed between at least a portion of the diaphragm and the substrate. The diaphragm can include one or more pressure equalizing apertures.
-
公开(公告)号：US11477555B2
公开(公告)日：2022-10-18
申请号：US17081628
申请日：2020-10-27
发明人： Michael Kuntzman , Sung B. Lee , Vahid Naderyan , Yunfei Ma , Bing Yu
IPC分类号： H04R1/08
摘要： An acoustic transducer comprises a transducer substrate having an aperture defined therethrough. At least one diaphragm is disposed on the transducer substrate over the aperture. A back plate is disposed on the transducer substrate and axially spaced apart from the at least one diaphragm. A perimetral support structure is disposed circumferentially between the at least one diaphragm and the back plate at a radially outer perimeter of the back plate. A plurality of perimetral release holes are defined circumferentially through at least one of the at least one diaphragm or the back plate proximate to and radially inwards of the perimetral support structure, at least a portion of the plurality of perimetral release holes defining a non-circular shape.
-
-
-
-
-
-
-
-
-
搜索结果
31 条记录 (耗时 0.021 秒)
