公开(公告)号：US11716578B2

公开(公告)日：2023-08-01

申请号：US17173661

申请日：2021-02-11

申请人： Knowles Electronics, LLC

发明人： Vahid Naderyan ,  Sung Lee ,  Ankur Sharma ,  Nick Wakefield

IPC分类号： H04R19/04 ,  H04R7/06 ,  H04R7/18

CPC分类号： H04R19/04 ,  H04R7/06 ,  H04R7/18 ,  H04R2201/003 ,  H04R2307/027

摘要： A MEMS die includes a substrate having an opening formed therein, a diaphragm having a first surface attached around a periphery thereof to the substrate and over the opening, and a backplate separated from a second surface of the diaphragm. The diaphragm includes at least one passage disposed between the first and second surfaces, and the at least one passage has a smaller cross-sectional area at the first surface than at the second surface.