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公开(公告)号：US10210606B2
公开(公告)日：2019-02-19
申请号：US14880077
申请日：2015-10-09
Applicant: KLA-Tencor Corporation
Inventor： Stilian Ivanov Pandev , Dzmitry Sanko , Wei Lu , Siddharth Srivastava
IPC: G06T7/00 , G01N21/956 , G03F7/20 , G06T7/33 , H04N5/225
Abstract: Methods and systems for measuring overlay error between structures formed on a substrate by successive lithographic processes are presented herein. Two overlay targets, each having programmed offsets in opposite directions are employed to perform an overlay measurement. Overlay error is measured based on zero order scatterometry signals and scatterometry data is collected from each target at two different azimuth angles. In addition, methods and systems for creating an image-based measurement model based on measured, image-based training data are presented. The trained, image-based measurement model is then used to calculate values of one or more parameters of interest directly from measured image data collected from other wafers. The methods and systems for image based measurement described herein are applicable to both metrology and inspection applications.
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公开(公告)号：US20160117812A1
公开(公告)日：2016-04-28
申请号：US14924308
申请日：2015-10-27
Applicant: KLA-Tencor Corporation
Inventor： Stilian Ivanov Pandev , Siddharth Srivastava
CPC classification number: G06K9/6256 , G03F7/70633 , G06K9/2018 , G06K9/4604 , G06K9/6247 , G06K9/629 , G06T7/0004 , G06T2207/20081 , G06T2207/30148
Abstract: Methods and systems for measuring overlay error between structures formed on a substrate by successive lithographic processes are presented herein. Two overlay targets, each having programmed offsets in opposite directions are employed to perform an overlay measurement. Overlay error is measured based on zero order scatterometry signals and scatterometry data is collected from each target at two different azimuth angles. In addition, methods and systems for creating an image-based measurement model based on measured, image-based training data are presented. The trained, image-based measurement model is then used to calculate values of one or more parameters of interest directly from measured image data collected from other wafers. The methods and systems for image based measurement described herein are applicable to both metrology and inspection applications.
Abstract translation: 本文介绍了通过连续光刻过程测量在基底上形成的结构之间的重叠误差的方法和系统。 采用两个覆盖目标，每个具有相反方向的编程偏移量来执行覆盖测量。 覆盖误差是基于零阶散射测量信号测量的，并且从两个不同方位角的每个目标采集散射测量数据。 另外，提出了基于测量的基于图像的训练数据创建基于图像的测量模型的方法和系统。 然后使用经过训练的基于图像的测量模型来从其他晶片收集的测量图像数据直接计算一个或多个感兴趣的参数的值。 本文描述的基于图像的测量的方法和系统适用于计量和检验应用。
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公开(公告)号：US09710728B2
公开(公告)日：2017-07-18
申请号：US14924308
申请日：2015-10-27
Applicant: KLA-Tencor Corporation
Inventor： Stilian Ivanov Pandev , Siddharth Srivastava
CPC classification number: G06K9/6256 , G03F7/70633 , G06K9/2018 , G06K9/4604 , G06K9/6247 , G06K9/629 , G06T7/0004 , G06T2207/20081 , G06T2207/30148
Abstract: Methods and systems for measuring overlay error between structures formed on a substrate by successive lithographic processes are presented herein. Two overlay targets, each having programmed offsets in opposite directions are employed to perform an overlay measurement. Overlay error is measured based on zero order scatterometry signals and scatterometry data is collected from each target at two different azimuth angles. In addition, methods and systems for creating an image-based measurement model based on measured, image-based training data are presented. The trained, image-based measurement model is then used to calculate values of one or more parameters of interest directly from measured image data collected from other wafers. The methods and systems for image based measurement described herein are applicable to both metrology and inspection applications.
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4.发明申请Signal Response Metrology For Image Based And Scatterometry Overlay Measurements 审中-公开信号响应测量用于基于图像和散射测量的叠加测量公开(公告)号：US20160117847A1
公开(公告)日：2016-04-28
申请号：US14880077
申请日：2015-10-09
Applicant: KLA-Tencor Corporation
Inventor： Stilian Ivanov Pandev , Dzmitry Sanko , Wei Lu , Siddharth Srivastava
CPC classification number: G06T7/001 , G01N21/956 , G03F7/70633 , G06T7/33 , G06T2207/10056 , G06T2207/20081 , G06T2207/30148 , H04N5/2256
Abstract: Methods and systems for measuring overlay error between structures formed on a substrate by successive lithographic processes are presented herein. Two overlay targets, each having programmed offsets in opposite directions are employed to perform an overlay measurement. Overlay error is measured based on zero order scatterometry signals and scatterometry data is collected from each target at two different azimuth angles. In addition, methods and systems for creating an image-based measurement model based on measured, image-based training data are presented. The trained, image-based measurement model is then used to calculate values of one or more parameters of interest directly from measured image data collected from other wafers. The methods and systems for image based measurement described herein are applicable to both metrology and inspection applications.
Abstract translation: 本文介绍了通过连续光刻过程测量在基底上形成的结构之间的重叠误差的方法和系统。 采用两个覆盖目标，每个具有相反方向的编程偏移量来执行覆盖测量。 覆盖误差是基于零阶散射测量信号测量的，并且从两个不同方位角的每个目标采集散射测量数据。 另外，提出了基于测量的基于图像的训练数据创建基于图像的测量模型的方法和系统。 然后使用经过训练的基于图像的测量模型来从其他晶片收集的测量图像数据直接计算一个或多个感兴趣的参数的值。 本文描述的基于图像的测量的方法和系统适用于计量和检验应用。
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