公开(公告)号：US10132760B2

公开(公告)日：2018-11-20

申请号：US15643333

申请日：2017-07-06

Applicant: KLA-Tencor Corporation

Inventor： Pavel Kolchin ,  Richard Wallingford ,  Lisheng Gao ,  Grace H. Chen ,  Markus B. Huber ,  Robert M. Danen

IPC: G01N21/95

Abstract: Disclosed are methods and apparatus for optimizing a mode of an inspection tool. A first image or signal for each of a plurality of first apertures of the inspection tool is obtained, and each first image or signal pertains to a defect area. For each of a plurality of combinations of the first apertures and their first images or signals, a composite image or signal is obtained. Each composite image or signal is analyzed to determine an optimum one of the combinations of the first apertures based on a defect detection characteristic of each composite image. In one aspect, determining an optimum one of the combinations of the first apertures includes selecting a set of one or more individual apertures that result in the highest signal to noise ratio for the defect area, and the method includes setting the optimum combination of the first apertures on the inspection tool and inspecting a sample using such optimum combination of the first apertures.

公开(公告)号：US09726617B2

公开(公告)日：2017-08-08

申请号：US14075488

申请日：2013-11-08

Applicant: KLA-Tencor Corporation

Inventor： Pavel Kolchin ,  Richard Wallingford ,  Lisheng Gao ,  Grace H. Chen ,  Markus B. Huber ,  Robert M. Danen

IPC: G01N21/95

CPC classification number: G01N21/9501

Abstract: Disclosed are methods and apparatus for optimizing a mode of an inspection tool. A first image or signal for each of a plurality of first apertures of the inspection tool is obtained, and each first image or signal pertains to a defect area. For each of a plurality of combinations of the first apertures and their first images or signals, a composite image or signal is obtained. Each composite image or signal is analyzed to determine an optimum one of the combinations of the first apertures based on a defect detection characteristic of each composite image.

公开(公告)号：US09816940B2

公开(公告)日：2017-11-14

申请号：US15001158

申请日：2016-01-19

Applicant: KLA-Tencor Corporation

Inventor： Grace H. Chen ,  Keith Buckley Wells ,  Markus B. Huber ,  Se Baek Oh

IPC: G01N21/00 ,  G01N21/88 ,  G01N21/95

CPC classification number: G01N21/8851 ,  G01N21/9501 ,  G01N2021/8887

Abstract: Disclosed are methods and apparatus for detecting defects in a semiconductor sample. An inspection tool is used to collect intensity data sets at a plurality of focus settings from each of a plurality of xy positions of the sample. A polynomial equation having a plurality of coefficients is extracted for each of the xy position's collected intensity data sets as a function of focus setting. Each of the coefficients' set of values for the plurality of xy positions is represented with a corresponding coefficient image plane. A target set of coefficient image planes and a reference set of coefficient image planes are then analyzed to detect defects on the sample.

公开(公告)号：US20170307545A1

公开(公告)日：2017-10-26

申请号：US15643333

申请日：2017-07-06

Applicant: KLA-Tencor Corporation

Inventor： Pavel Kolchin ,  Richard Wallingford ,  Lisheng Gao ,  Grace H. Chen ,  Markus B. Huber ,  Robert M. Danen

IPC: G01N21/95

CPC classification number: G01N21/9501

Abstract: Disclosed are methods and apparatus for optimizing a mode of an inspection tool. A first image or signal for each of a plurality of first apertures of the inspection tool is obtained, and each first image or signal pertains to a defect area. For each of a plurality of combinations of the first apertures and their first images or signals, a composite image or signal is obtained. Each composite image or signal is analyzed to determine an optimum one of the combinations of the first apertures based on a defect detection characteristic of each composite image. In one aspect, determining an optimum one of the combinations of the first apertures includes selecting a set of one or more individual apertures that result in the highest signal to noise ratio for the defect area, and the method includes setting the optimum combination of the first apertures on the inspection tool and inspecting a sample using such optimum combination of the first apertures.

公开(公告)号：US20160209334A1

公开(公告)日：2016-07-21

申请号：US15001158

申请日：2016-01-19

Applicant: KLA-Tencor Corporation

Inventor： Grace H. Chen ,  Keith Buckley Wells ,  Markus B. Huber ,  Se Baek Oh

IPC: G01N21/88 ,  G01N21/95

CPC classification number: G01N21/8851 ,  G01N21/9501 ,  G01N2021/8887

Abstract: Disclosed are methods and apparatus for detecting defects in a semiconductor sample. An inspection tool is used to collect intensity data sets at a plurality of focus settings from each of a plurality of xy positions of the sample. A polynomial equation having a plurality of coefficients is extracted for each of the xy position's collected intensity data sets as a function of focus setting. Each of the coefficients' set of values for the plurality of xy positions is represented with a corresponding coefficient image plane. A target set of coefficient image planes and a reference set of coefficient image planes are then analyzed to detect defects on the sample.

Abstract translation: 公开了用于检测半导体样品中的缺陷的方法和装置。 检查工具用于从样本的多个xy位置中的每一个收集多个焦点设置的强度数据集合。 作为焦点设置的函数，针对xy位置的收集的强度数据集中的每个提取具有多个系数的多项式方程。 用相应的系数图像平面表示多个xy位置的每个系数的值集合。 然后分析系数图​​像平面的目标集合和系数图像平面的参考集合，以检测样本上的缺陷。