公开(公告)号：US20160209334A1

公开(公告)日：2016-07-21

申请号：US15001158

申请日：2016-01-19

Applicant: KLA-Tencor Corporation

Inventor： Grace H. Chen ,  Keith Buckley Wells ,  Markus B. Huber ,  Se Baek Oh

IPC: G01N21/88 ,  G01N21/95

CPC classification number: G01N21/8851 ,  G01N21/9501 ,  G01N2021/8887

Abstract: Disclosed are methods and apparatus for detecting defects in a semiconductor sample. An inspection tool is used to collect intensity data sets at a plurality of focus settings from each of a plurality of xy positions of the sample. A polynomial equation having a plurality of coefficients is extracted for each of the xy position's collected intensity data sets as a function of focus setting. Each of the coefficients' set of values for the plurality of xy positions is represented with a corresponding coefficient image plane. A target set of coefficient image planes and a reference set of coefficient image planes are then analyzed to detect defects on the sample.

Abstract translation: 公开了用于检测半导体样品中的缺陷的方法和装置。 检查工具用于从样本的多个xy位置中的每一个收集多个焦点设置的强度数据集合。 作为焦点设置的函数，针对xy位置的收集的强度数据集中的每个提取具有多个系数的多项式方程。 用相应的系数图像平面表示多个xy位置的每个系数的值集合。 然后分析系数图​​像平面的目标集合和系数图像平面的参考集合，以检测样本上的缺陷。

公开(公告)号：US09816940B2

公开(公告)日：2017-11-14

申请号：US15001158

申请日：2016-01-19

Applicant: KLA-Tencor Corporation

Inventor： Grace H. Chen ,  Keith Buckley Wells ,  Markus B. Huber ,  Se Baek Oh

IPC: G01N21/00 ,  G01N21/88 ,  G01N21/95

CPC classification number: G01N21/8851 ,  G01N21/9501 ,  G01N2021/8887

Abstract: Disclosed are methods and apparatus for detecting defects in a semiconductor sample. An inspection tool is used to collect intensity data sets at a plurality of focus settings from each of a plurality of xy positions of the sample. A polynomial equation having a plurality of coefficients is extracted for each of the xy position's collected intensity data sets as a function of focus setting. Each of the coefficients' set of values for the plurality of xy positions is represented with a corresponding coefficient image plane. A target set of coefficient image planes and a reference set of coefficient image planes are then analyzed to detect defects on the sample.