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Patent Agency Ranking
公开(公告)号：US10522426B1
公开(公告)日：2019-12-31
申请号：US16271506
申请日：2019-02-08
Applicant: KLA-TENCOR CORPORATION
Inventor： Hongxing Yuan , Dimitry Pokras , William VanHoomissen , Douglas Chan
Abstract: This system and method minimize an effect of haze to signal-to-noise ratio and compensate for haze on the haze map. A first mask with a first aperture is disposed along the path of the light beam between a light source and a collector. A first actuator moves the first mask along a tangential direction. A second mask with a second aperture is disposed along the path of the light beam between the first mask and the collector. A second actuator moves the second mask along a radial direction perpendicular to the tangential direction. The first mask and the second mask are independently movable along the tangential direction and the radial direction using the first actuator and the second actuator.
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公开(公告)号：US20180021818A1
公开(公告)日：2018-01-25
申请号：US15649471
申请日：2017-07-13
Applicant: KLA-Tencor Corporation
Inventor： William VanHoomissen , Val Estrin , Eric Jong
IPC: B08B1/04 , H01L21/68 , H01L21/673 , H01L21/677
CPC classification number: B08B1/04 , B08B7/02 , H01L21/67028 , H01L21/67103 , H01L21/6735 , H01L21/67769 , H01L21/67775 , H01L21/68 , H01L21/68735
Abstract: A cleaning assembly for cleaning one or more wafer edge handling contact surfaces of wafer handling equipment includes a substrate and a cleaning ring. The substrate includes an edge portion that extends about the body of the substrate. The cleaning ring is reversibly attachable to the edge portion of the substrate. The cleaning ring is formed from a deformable material. The substrate and cleaning ring are sized for compatibility with a front opening unified pod (FOUP) or a wafer cassette of a semiconductor fabrication facility.
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公开(公告)号：US11524319B2
公开(公告)日：2022-12-13
申请号：US15649471
申请日：2017-07-13
Applicant: KLA-Tencor Corporation
Inventor： William VanHoomissen , Val Estrin , Eric Jong
IPC: B08B1/04 , H01L21/67 , H01L21/687 , B08B7/02 , H01L21/673 , H01L21/677 , H01L21/68
Abstract: A cleaning assembly for cleaning one or more wafer edge handling contact surfaces of wafer handling equipment includes a substrate and a cleaning ring. The substrate includes an edge portion that extends about the body of the substrate. The cleaning ring is reversibly attachable to the edge portion of the substrate. The cleaning ring is formed from a deformable material. The substrate and cleaning ring are sized for compatibility with a front opening unified pod (FOUP) or a wafer cassette of a semiconductor fabrication facility.
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公开(公告)号：US20140152976A1
公开(公告)日：2014-06-05
申请号：US14073535
申请日：2013-11-06
Applicant: KLA-Tencor Corporation
Inventor： William VanHoomissen , Sean Wheeler
IPC: G01N21/95
CPC classification number: G01N21/9505
Abstract: A wafer crack detection system includes a rotational wafer stage assembly configured to secure a wafer and selectively rotate the wafer, a light source positioned on a first side of the wafer and configured to direct a light beam through the wafer, a sensor positioned on a second side of the wafer and configured to monitor one or more characteristics of light transmitted through the wafer as the wafer is rotated, and a controller communicatively coupled to the sensor and a portion of the rotational wafer stage assembly, the controller configured to: determine the presence of one or more cracks in the wafer based on the monitored one or more characteristics of light transmitted through the wafer, and, responsive to the determination of the presence of one or more cracks in the wafer, direct the rotational stage assembly to adjust the rotational condition of the wafer.
Abstract translation: 晶片裂纹检测系统包括：旋转晶片台组件，其被配置为固定晶片并选择性地旋转晶片;定位在晶片的第一侧上并被配置成将光束引导通过晶片的光源;位于第二 并且被配置为在晶片旋转时监测透过晶片的光的一个或多个特性，以及控制器，其通信地耦合到所述传感器和所述旋转晶片台组件的一部分，所述控制器被配置为： 基于所监测的透过晶片的光的一个或多个特性，晶片中的一个或多个裂纹，并且响应于确定晶片中一个或多个裂纹的存在，引导旋转台组件调节旋转 晶圆的状态
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公开(公告)号：US09255894B2
公开(公告)日：2016-02-09
申请号：US14073535
申请日：2013-11-06
Applicant: KLA-Tencor Corporation
Inventor： William VanHoomissen , Sean Wheeler
CPC classification number: G01N21/9505
Abstract: A wafer crack detection system includes a rotational wafer stage assembly configured to secure a wafer and selectively rotate the wafer, a light source positioned on a first side of the wafer and configured to direct a light beam through the wafer, a sensor positioned on a second side of the wafer and configured to monitor one or more characteristics of light transmitted through the wafer as the wafer is rotated, and a controller communicatively coupled to the sensor and a portion of the rotational wafer stage assembly, the controller configured to: determine the presence of one or more cracks in the wafer based on the monitored one or more characteristics of light transmitted through the wafer, and, responsive to the determination of the presence of one or more cracks in the wafer, direct the rotational stage assembly to adjust the rotational condition of the wafer.
Abstract translation: 晶片裂纹检测系统包括：旋转晶片台组件，其被配置为固定晶片并选择性地旋转晶片;定位在晶片的第一侧上并被配置成将光束引导通过晶片的光源;位于第二 并且被配置为在晶片旋转时监测透过晶片的光的一个或多个特性，以及控制器，其通信地耦合到所述传感器和所述旋转晶片台组件的一部分，所述控制器被配置为： 基于所监测的透过晶片的光的一个或多个特性，晶片中的一个或多个裂纹，并且响应于确定晶片中一个或多个裂纹的存在，引导旋转台组件调节旋转 晶圆的状态
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