公开(公告)号：US20180021818A1

公开(公告)日：2018-01-25

申请号：US15649471

申请日：2017-07-13

Applicant: KLA-Tencor Corporation

Inventor： William VanHoomissen ,  Val Estrin ,  Eric Jong

IPC: B08B1/04 ,  H01L21/68 ,  H01L21/673 ,  H01L21/677

CPC classification number: B08B1/04 ,  B08B7/02 ,  H01L21/67028 ,  H01L21/67103 ,  H01L21/6735 ,  H01L21/67769 ,  H01L21/67775 ,  H01L21/68 ,  H01L21/68735

Abstract: A cleaning assembly for cleaning one or more wafer edge handling contact surfaces of wafer handling equipment includes a substrate and a cleaning ring. The substrate includes an edge portion that extends about the body of the substrate. The cleaning ring is reversibly attachable to the edge portion of the substrate. The cleaning ring is formed from a deformable material. The substrate and cleaning ring are sized for compatibility with a front opening unified pod (FOUP) or a wafer cassette of a semiconductor fabrication facility.

公开(公告)号：US11524319B2

公开(公告)日：2022-12-13

申请号：US15649471

申请日：2017-07-13

Applicant: KLA-Tencor Corporation

Inventor： William VanHoomissen ,  Val Estrin ,  Eric Jong

IPC: B08B1/04 ,  H01L21/67 ,  H01L21/687 ,  B08B7/02 ,  H01L21/673 ,  H01L21/677 ,  H01L21/68

Abstract: A cleaning assembly for cleaning one or more wafer edge handling contact surfaces of wafer handling equipment includes a substrate and a cleaning ring. The substrate includes an edge portion that extends about the body of the substrate. The cleaning ring is reversibly attachable to the edge portion of the substrate. The cleaning ring is formed from a deformable material. The substrate and cleaning ring are sized for compatibility with a front opening unified pod (FOUP) or a wafer cassette of a semiconductor fabrication facility.