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公开(公告)号：US20240225911A1
公开(公告)日：2024-07-11
申请号：US18610725
申请日：2024-03-20
CPC分类号： A61F13/15 , D21F1/02 , A61F13/15642 , A61F13/15699
摘要： Methods and apparatuses for producing a substrate are described. A method and apparatus for introducing a component into a fluid supply is also presented. A method can include providing a first fluid supply. The fluid supply can be configured as a foam in some embodiments. The method can also include providing a component feed system and a supply of the component. The method can include introducing the component to a fluid supply in an eductor in some aspects. A resultant slurry including a fluid supply and the component can be transferred through a headbox. The resultant slurry can be dewatered to provide a substrate including the component.
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公开(公告)号：US11963851B2
公开(公告)日：2024-04-23
申请号：US17928297
申请日：2021-05-28
CPC分类号： A61F13/15 , D21F1/02 , A61F13/15642 , A61F13/15699
摘要： Methods and apparatuses for producing a substrate are described. A method and apparatus for introducing a component into a fluid supply is also presented. A method can include providing a first fluid supply. The fluid supply can be configured as a foam in some embodiments. The method can also include providing a component feed system and a supply of the component. The method can include introducing the component to a fluid supply in an eductor in some aspects. A resultant slurry including a fluid supply and the component can be transferred through a headbox. The resultant slurry can be dewatered to provide a substrate including the component.
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公开(公告)号：US20230212800A1
公开(公告)日：2023-07-06
申请号：US17928051
申请日：2021-05-28
CPC分类号： D04H1/732 , B01F23/582 , B01F23/59 , B01F25/31243 , B01F35/7176 , D04H1/58 , D04H1/407 , D21F1/024
摘要： Methods and apparatuses for producing a substrate are described. A method and apparatus for introducing a component into a fluid supply is also presented. A method can include providing a first fluid supply. The fluid supply can be configured as a foam in some embodiments. The method can also include providing a component feed system and a supply of the component. The method can include introducing the component to a fluid supply in an eductor in some aspects. A resultant slurry including a fluid supply and the component can be transferred through a headbox. The resultant slurry can be dewatered to provide a substrate including the component.
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公开(公告)号：US20240279856A1
公开(公告)日：2024-08-22
申请号：US18654323
申请日：2024-05-03
CPC分类号： D04H1/732 , B01F23/582 , B01F23/59 , B01F25/31243 , B01F35/712 , B01F35/71731 , B01F35/7176 , D04H1/407 , D04H1/58 , D21F1/0018 , D21F1/02 , D21F1/024
摘要： Methods and apparatuses for producing a substrate are described. A method and apparatus for introducing a component into a fluid supply is also presented. A method can include providing a first fluid supply. The fluid supply can be configured as a foam in some embodiments. The method can also include providing a component feed system and a supply of the component. The method can include introducing the component to a fluid supply in an eductor in some aspects. A resultant slurry including a fluid supply and the component can be transferred through a headbox. The resultant slurry can be dewatered to provide a substrate including the component.
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公开(公告)号：US20230241561A1
公开(公告)日：2023-08-03
申请号：US17928302
申请日：2021-05-28
IPC分类号： B01F23/50 , B01F25/312 , B01F35/221
CPC分类号： B01F23/582 , B01F23/511 , B01F23/56 , B01F23/59 , B01F25/31243 , B01F35/2211
摘要： Methods and apparatuses for producing a substrate are described. A method and apparatus for introducing a component into a fluid supply is also presented. A method can include providing a first fluid supply. The fluid supply can be configured as a foam in some embodiments. The method can also include providing a component feed system and a supply of the component. The method can include introducing the component to a fluid supply in an eductor in some aspects. A resultant slurry including a fluid supply and the component can be transferred through a headbox. The resultant slurry can be dewatered to provide a substrate including the component.
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公开(公告)号：US12006604B2
公开(公告)日：2024-06-11
申请号：US17928051
申请日：2021-05-28
CPC分类号： D04H1/732 , B01F23/582 , B01F23/59 , B01F25/31243 , B01F35/712 , B01F35/71731 , B01F35/7176 , D04H1/407 , D04H1/58 , D21F1/0018 , D21F1/02 , D21F1/024
摘要： Methods and apparatuses for producing a substrate are described. A method and apparatus for introducing a component into a fluid supply is also presented. A method can include providing a first fluid supply. The fluid supply can be configured as a foam in some embodiments. The method can also include providing a component feed system and a supply of the component. The method can include introducing the component to a fluid supply in an eductor in some aspects. A resultant slurry including a fluid supply and the component can be transferred through a headbox. The resultant slurry can be dewatered to provide a substrate including the component.
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公开(公告)号：US20230212796A1
公开(公告)日：2023-07-06
申请号：US17928084
申请日：2021-05-28
IPC分类号： D04H1/425 , A61F13/53 , B01F23/235 , B01F23/50 , B01F25/312 , D04H1/407 , D04H1/732
CPC分类号： D04H1/425 , A61F13/53 , B01F23/2351 , B01F23/582 , B01F25/31243 , D04H1/407 , D04H1/732
摘要： Methods and apparatuses for producing a substrate are described. A method and apparatus for introducing a component into a fluid supply is also presented. A method can include providing a first fluid supply. The fluid supply can be configured as a foam in some embodiments. The method can also include providing a component feed system and a supply of the component. The method can include introducing the component to a fluid supply in an eductor in some aspects. A resultant slurry including a fluid supply and the component can be transferred through a headbox. The resultant slurry can be dewatered to provide a substrate including the component.
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公开(公告)号：US20230201044A1
公开(公告)日：2023-06-29
申请号：US17928297
申请日：2021-05-28
IPC分类号： A61F13/15
CPC分类号： A61F13/15 , A61F13/15699 , A61F13/15642
摘要： Methods and apparatuses for producing a substrate are described. A method and apparatus for introducing a component into a fluid supply is also presented. A method can include providing a first fluid supply. The fluid supply can be configured as a foam in me embodiments. The method can also include providing a component feed system and a supply of the component. The method can include introducing the component to a fluid supply in an eductor in some aspects. A resultant slurry including a fluid supply and the component can be transferred through a headbox. The resultant slurry can be dewatered to provide a substrate including the component.
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