ULSI MICRO-INTERCONNECT MEMBER HAVING RUTHENIUM ELECTROPLATING LAYER ON BARRIER LAYER
    2.
    发明申请
    ULSI MICRO-INTERCONNECT MEMBER HAVING RUTHENIUM ELECTROPLATING LAYER ON BARRIER LAYER 有权
    ULSI微型互连成员,具有在屏障层上的电镀层

    公开(公告)号:US20100314766A1

    公开(公告)日:2010-12-16

    申请号:US12735187

    申请日:2009-01-08

    IPC分类号: H01L23/48 H01L21/4763

    摘要: An object of the present is to provide a ULSI micro-interconnect member having a seed layer which, particularly on the inner sidewalls of vias and trenches, is formed with a sufficient coverage and a film thickness uniform with that on surface portion, and which has a low level of impurities. Further objects of the invention are to provide a ULSI micro-interconnect member in which, by utilizing such a seed layer to subsequently effect copper electroplating, micro-interconnects have been formed without generating voids; a process for forming the same; and a semiconductor wafer in which such ULSI micro-interconnects have been formed. A ULSI micro-interconnect member having a substrate and a ULSI micro-interconnect formed on the substrate, wherein the ULSI micro-interconnect includes a barrier layer formed on the substrate and a ruthenium electroplating layer formed on the barrier layer; the ULSI micro-interconnect member further including a copper electroplating layer formed using the ruthenium electroplating layer as a seed layer; and a process for fabricating the ULSI micro-interconnect members.

    摘要翻译: 本发明的目的是提供一种具有种子层的ULSI微互连构件,其特别地在通孔和沟槽的内侧壁上形成有足够的覆盖层,并且膜表面部分具有均匀的膜厚度, 杂质含量低。 本发明的另外的目的是提供一种ULSI微互连构件,其中通过利用这种种子层来随后实现铜电镀,已经形成微互连而不产生空隙; 其形成方法; 以及其中已经形成这种ULSI微互连的半导体晶片。 ULSI微互连构件,其具有形成在基板上的基板和ULSI微互连,其中ULSI微互连包括形成在基板上的阻挡层和形成在阻挡层上的钌电镀层; 所述ULSI微互连构件还包括使用所述钌电镀层作为种子层形成的铜电镀层; 以及制造ULSI微互连部件的工艺。

    SILVER ELECTROPLATED AND/OR SILVER ALLOY ELECTROPLATED ARTICLE HAVING AN OXIDATION LAYER ON ITS SURFACE
    3.
    发明申请
    SILVER ELECTROPLATED AND/OR SILVER ALLOY ELECTROPLATED ARTICLE HAVING AN OXIDATION LAYER ON ITS SURFACE 审中-公开
    在其表面上具有氧化层的银电镀和/或银合金电镀物品

    公开(公告)号:US20120097545A1

    公开(公告)日:2012-04-26

    申请号:US13380946

    申请日:2011-05-18

    IPC分类号: B32B15/04 C23C28/00 C25D7/00

    摘要: The object of the present invention is to provide a silver plated and/or a silver alloy plated article with high productivity, high reflectance in the visible light range, and excellent sulfidizing resistance. The present invention provides a silver electroplated and/or silver alloy electroplated article having an oxidation layer on its surface, wherein a silver plating layer and/or silver alloy plating layer is formed on a substrate by silver electroplating and/or silver alloy electroplating, and then subjected to oxidation treatment to form an oxidation layer on the surface thereof. The thickness of the oxidation layer formed on the surface of the plating layer is 0.05 μm or more.

    摘要翻译: 本发明的目的是提供具有高生产率,可见光范围内的高反射率和优异的耐硫化性的镀银和/或银合金镀层制品。 本发明提供了一种在其表面上具有氧化层的银电镀和/或银合金电镀制品,其中通过银电镀和/或银合金电镀在基板上形成银镀层和/或银合金镀层,以及 然后进行氧化处理以在其表面上形成氧化层。 形成在镀层表面上的氧化层的厚度为0.05μm以上。

    Pretreating solution for silver plating and silver plating treating
process using the solution
    5.
    发明授权
    Pretreating solution for silver plating and silver plating treating process using the solution 失效
    使用溶液镀银和镀银处理工艺的预处理溶液

    公开(公告)号:US5194139A

    公开(公告)日:1993-03-16

    申请号:US666731

    申请日:1991-03-08

    IPC分类号: C25D3/46 C25D5/34

    CPC分类号: C25D5/34

    摘要: An acidic pretreating solution for silver plating, which comprises as an agent for preventing the silver deposition by displacement, an inorganic acid and/or an organic acid, and a silver plating process which uses this pretreating solution. The pretreating solution provides long lasting preventive effect against silver deposition by displacement and the resulting silver plated layer firmly adheres to a metal substrate surface.

    摘要翻译: 一种用于镀银的酸性预处理溶液,其包括作为防止通过置换银沉积的试剂,无机酸和/或有机酸以及使用该预处理溶液的银镀工艺。 预处理溶液通过位移提供对银沉积的持久的预防效果,并且所得到的镀银层牢固地粘附到金属基材表面。