P-type layer for a III-nitride light emitting device
    1.
    发明授权
    P-type layer for a III-nitride light emitting device 失效
    用于III族氮化物发光器件的P型层

    公开(公告)号:US07906357B2

    公开(公告)日:2011-03-15

    申请号:US11383456

    申请日:2006-05-15

    IPC分类号: H01L21/00

    摘要: A semiconductor structure includes a light emitting region, a p-type region disposed on a first side of the light emitting region, and an n-type region disposed on a second side of the light emitting region. At least 10% of a thickness of the semiconductor structure on the first side of the light emitting region comprises indium. Some examples of such a semiconductor light emitting device may be formed by growing an n-type region, growing a p-type region, and growing a light emitting layer disposed between the n-type region and the p-type region. The difference in temperature between the growth temperature of a part of the n-type region and the growth temperature of a part of the p-type region is at least 140° C.

    摘要翻译: 半导体结构包括发光区域,设置在发光区域的第一侧上的p型区域和设置在发光区域的第二侧上的n型区域。 发光区域的第一侧的半导体结构的厚度的至少10%包括铟。 可以通过生长n型区域,生长p型区域以及生长设置在n型区域和p型区域之间的发光层来形成这种半导体发光器件的一些示例。 n型区域的一部分的生长温度与p型区域的一部分的生长温度之间的温度差为至少140℃。

    Strain-controlled III-nitride light emitting device
    2.
    发明授权
    Strain-controlled III-nitride light emitting device 有权
    应变控制III族氮化物发光器件

    公开(公告)号:US06989555B2

    公开(公告)日:2006-01-24

    申请号:US10830202

    申请日:2004-04-21

    IPC分类号: H01L29/24

    CPC分类号: H01L33/32 H01L33/08 H01L33/12

    摘要: In a III-nitride light emitting device, a ternary or quaternary light emitting layer is configured to control the degree of phase separation. In some embodiments, the difference between the InN composition at any point in the light emitting layer and the average InN composition in the light emitting layer is less than 20%. In some embodiments, control of phase separation is accomplished by controlling the ratio of the lattice constant in a relaxed, free standing layer having the same composition as the light emitting layer to the lattice constant in a base region. For example, the ratio may be between about 1 and about 1.01.

    摘要翻译: 在III族氮化物发光器件中,三元或四元发光层被配置为控制相分离程度。 在一些实施例中,发光层中的任何点处的InN组成与发光层中的平均InN组成之间的差小于20%。 在一些实施方案中,通过控制具有与发光层相同的组成的松弛的独立层中的晶格常数与基极区域中的晶格常数的比例来实现相分离的控制。 例如,该比率可以在约1至约1.01之间。

    P-Type Layer For A III-Nitride Light Emitting Device
    3.
    发明申请
    P-Type Layer For A III-Nitride Light Emitting Device 失效
    III型氮化物发光器件的P型层

    公开(公告)号:US20070262342A1

    公开(公告)日:2007-11-15

    申请号:US11383456

    申请日:2006-05-15

    IPC分类号: H01L33/00

    摘要: A semiconductor structure includes a light emitting region, a p-type region disposed on a first side of the light emitting region, and an n-type region disposed on a second side of the light emitting region. At least 10% of a thickness of the semiconductor structure on the first side of the light emitting region comprises indium. Some examples of such a semiconductor light emitting device may be formed by growing an n-type region, growing a p-type region, and growing a light emitting layer disposed between the n-type region and the p-type region. The difference in temperature between the growth temperature of a part of the n-type region and the growth temperature of a part of the p-type region is at least 140° C.

    摘要翻译: 半导体结构包括发光区域,设置在发光区域的第一侧上的p型区域和设置在发光区域的第二侧上的n型区域。 发光区域的第一侧的半导体结构的厚度的至少10%包括铟。 可以通过生长n型区域,生长p型区域以及生长设置在n型区域和p型区域之间的发光层来形成这种半导体发光器件的一些示例。 n型区域的一部分的生长温度与p型区域的一部分的生长温度之间的温度差为至少140℃。

    Strain-controlled III-nitride light emitting device

    公开(公告)号:US20060011937A1

    公开(公告)日:2006-01-19

    申请号:US11227814

    申请日:2005-09-14

    IPC分类号: H01L21/00 H01L33/00

    摘要: In a III-nitride light emitting device, a ternary or quaternary light emitting layer is configured to control the degree of phase separation. In some embodiments, the difference between the InN composition at any point in the light emitting layer and the average InN composition in the light emitting layer is less than 20%. In some embodiments, control of phase separation is accomplished by controlling the ratio of the lattice constant in a relaxed, free standing layer having the same composition as the light emitting layer to the lattice constant in a base region. For example, the ratio may be between about 1 and about 1.01.

    STRAIN-CONTROLLED III-NITRIDE LIGHT EMITTING DEVICE
    5.
    发明申请
    STRAIN-CONTROLLED III-NITRIDE LIGHT EMITTING DEVICE 有权
    应变控制的III-NITRIDE发光装置

    公开(公告)号:US20050236641A1

    公开(公告)日:2005-10-27

    申请号:US10830202

    申请日:2004-04-21

    IPC分类号: H01L33/08 H01L33/32 H01L29/22

    CPC分类号: H01L33/32 H01L33/08 H01L33/12

    摘要: In a III-nitride light emitting device, a ternary or quaternary light emitting layer is configured to control the degree of phase separation. In some embodiments, the difference between the InN composition at any point in the light emitting layer and the average InN composition in the light emitting layer is less than 20%. In some embodiments, control of phase separation is accomplished by controlling the ratio of the lattice constant in a relaxed, free standing layer having the same composition as the light emitting layer to the lattice constant in a base region. For example, the ratio may be between about 1 and about 1.01.

    摘要翻译: 在III族氮化物发光器件中,三元或四元发光层被配置为控制相分离程度。 在一些实施例中,发光层中的任何点处的InN组成与发光层中的平均InN组成之间的差小于20%。 在一些实施方案中,通过控制具有与发光层相同的组成的松弛的独立层中的晶格常数与基极区域中的晶格常数的比例来实现相分离的控制。 例如,该比率可以在约1至约1.01之间。

    P-CONTACT LAYER FOR A III-P SEMICONDUCTOR LIGHT EMITTING DEVICE
    6.
    发明申请
    P-CONTACT LAYER FOR A III-P SEMICONDUCTOR LIGHT EMITTING DEVICE 有权
    用于III-P半导体发光器件的P-接触层

    公开(公告)号:US20100327299A1

    公开(公告)日:2010-12-30

    申请号:US12494988

    申请日:2009-06-30

    IPC分类号: H01L33/00 H01L21/20

    摘要: A device includes a semiconductor structure with at least one III-P light emitting layer disposed between an n-type region and a p-type region. The semiconductor structure further includes a GaAsxP1-x p-contact layer, wherein x

    摘要翻译: 一种器件包括具有设置在n型区域和p型区域之间的至少一个III-P发光层的半导体结构。 半导体结构还包括GaAs xP 1-x p接触层,其中x <0.45。 第一金属触点与GaAsxP1-x p-接触层直接接触。 第二金属触点电连接到n型区域。 第一和第二金属触点形成在半导体结构的同一侧上。

    P-contact layer for a III-P semiconductor light emitting device
    7.
    发明授权
    P-contact layer for a III-P semiconductor light emitting device 有权
    用于III-P半导体发光器件的P接触层

    公开(公告)号:US08017958B2

    公开(公告)日:2011-09-13

    申请号:US12494988

    申请日:2009-06-30

    IPC分类号: H01L33/00 H01L21/00

    摘要: A device includes a semiconductor structure with at least one III-P light emitting layer disposed between an n-type region and a p-type region. The semiconductor structure further includes a GaAsxP1−x p-contact layer, wherein x

    摘要翻译: 一种器件包括具有设置在n型区域和p型区域之间的至少一个III-P发光层的半导体结构。 半导体结构还包括GaAs xP 1-x p接触层,其中x <0.45。 第一金属触点与GaAsxP1-x p-接触层直接接触。 第二金属触点电连接到n型区域。 第一和第二金属触点形成在半导体结构的同一侧上。

    P-contact layer for a III-P semiconductor light emitting device
    8.
    发明授权
    P-contact layer for a III-P semiconductor light emitting device 有权
    用于III-P半导体发光器件的P接触层

    公开(公告)号:US08816368B2

    公开(公告)日:2014-08-26

    申请号:US13204750

    申请日:2011-08-08

    IPC分类号: H01L33/00

    摘要: A device includes a semiconductor structure with at least one III-P light emitting layer disposed between an n-type region and a p-type region. The semiconductor structure further includes a GaAsxP1-x p-contact layer, wherein x

    摘要翻译: 一种器件包括具有设置在n型区域和p型区域之间的至少一个III-P发光层的半导体结构。 半导体结构还包括GaAs xP 1-x p接触层,其中x <0.45。 第一金属触点与GaAsxP1-x p-接触层直接接触。 第二金属触点电连接到n型区域。 第一和第二金属触点形成在半导体结构的同一侧上。

    Light emitting device with bonded interface
    9.
    发明授权
    Light emitting device with bonded interface 有权
    具有接合界面的发光器件

    公开(公告)号:US08692286B2

    公开(公告)日:2014-04-08

    申请号:US11957031

    申请日:2007-12-14

    IPC分类号: H01L33/00 H01L21/00

    摘要: In some embodiments of the invention, a transparent substrate AlInGaP device includes an etch stop layer that may be less absorbing than a conventional etch stop layer. In some embodiments of the invention, a transparent substrate AlInGaP device includes a bonded interface that may be configured to give a lower forward voltage than a conventional bonded interface. Reducing the absorption and/or the forward voltage in a device may improve the efficiency of the device.

    摘要翻译: 在本发明的一些实施例中,透明衬底AlInGaP器件包括可以比常规蚀刻停止层更少吸收的蚀刻停止层。 在本发明的一些实施例中,透明衬底AlInGaP器件包括可被配置为给出比常规接合界面更低的正向电压的接合界面。 降低装置中的吸收和/或正向电压可以提高装置的效率。