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公开(公告)号：US20090011680A1
公开(公告)日：2009-01-08
申请号：US12230317
申请日：2008-08-27
Applicant: Yoichi Kobayashi , Shunsuke Nakai , Hitoshi Tsuji , Yasuo Tsukuda , Junki Ishimoto , Kazunari Shinya
Inventor： Yoichi Kobayashi , Shunsuke Nakai , Hitoshi Tsuji , Yasuo Tsukuda , Junki Ishimoto , Kazunari Shinya
IPC: B24B49/12
CPC classification number: B24B49/12 , B24B37/013
Abstract: A polishing state monitoring apparatus measures characteristic values of a surface, being polished, of a workpiece to determine the timing of a polishing end point. The polishing state monitoring apparatus includes a light-emitting unit for applying light from a light source to a surface of a workpiece being polished, a light-receiving unit for receiving reflected light from the surface of the workpiece, a spectroscope unit for dividing the reflected light received by the light-receiving unit into a plurality of light rays having respective wavelengths, and light-receiving elements for accumulating the detected light rays as electrical information. The polishing state monitoring apparatus further includes a spectral data generator for reading the electrical information accumulated by the light-receiving elements and generating spectral data of the reflected light, and a processor for calculating a predetermined characteristic value on the surface of the workpiece based on the spectral data generated by the spectral data generator.
Abstract translation: 抛光状态监视装置测量被抛光表面的特征值，以确定抛光终点的定时。 抛光状态监视装置包括用于将光从光源施加到被抛光的工件的表面的发光单元，用于接收来自工件表面的反射光的光接收单元，用于将反射的 由光接收单元接收的多个光具有各自的波长的光;以及用于将检测到的光线累积的光接收元件作为电信息。 抛光状态监视装置还包括：光谱数据发生器，用于读取由光接收元件累积的电信息并产生反射光的光谱数据;以及处理器，用于基于工件的表面计算工件表面上的预定特征值 光谱数据生成器生成的光谱数据。
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公开(公告)号：US07438627B2
公开(公告)日：2008-10-21
申请号：US11819453
申请日：2007-06-27
Applicant: Yoichi Kobayashi , Shunsuke Nakai , Hitoshi Tsuji , Yasuo Tsukuda , Junki Ishimoto , Kazunari Shinya
Inventor： Yoichi Kobayashi , Shunsuke Nakai , Hitoshi Tsuji , Yasuo Tsukuda , Junki Ishimoto , Kazunari Shinya
CPC classification number: B24B49/12 , B24B37/013
Abstract: A polishing state monitoring apparatus measures characteristic values of a surface, being polished, of a workpiece to determine the timing of a polishing end point. The polishing state monitoring apparatus includes a light-emitting unit for applying light from a light source to a surface of a workpiece being polished, a light-receiving unit for receiving reflected light from the surface of the workpiece, a spectroscope unit for dividing the reflected light received by the light-receiving unit into a plurality of light rays having respective wavelengths, and light-receiving elements for accumulating the detected light rays as electrical information. The polishing state monitoring apparatus further includes a spectral data generator for reading the electrical information accumulated by the light-receiving elements and generating spectral data of the reflected light, and a processor for calculating a predetermined characteristic value on the surface of the workpiece based on the spectral data generated by the spectral data generator.
Abstract translation: 抛光状态监视装置测量被抛光表面的特征值，以确定抛光终点的定时。 抛光状态监视装置包括用于将光从光源施加到被抛光的工件的表面的发光单元，用于接收来自工件表面的反射光的光接收单元，用于将反射的 由光接收单元接收的多个光具有各自的波长的光;以及用于将检测到的光线累积的光接收元件作为电信息。 抛光状态监视装置还包括：光谱数据发生器，用于读取由光接收元件累积的电信息并产生反射光的光谱数据;以及处理器，用于基于工件的表面计算工件表面上的预定特征值 光谱数据生成器生成的光谱数据。
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公开(公告)号：US20070254557A1
公开(公告)日：2007-11-01
申请号：US11819453
申请日：2007-06-27
Applicant: Yoichi Kobayashi , Shunsuke Nakai , Hitoshi Tsuji , Yasuo Tsukuda , Junki Ishimoto , Kazunari Shinya
Inventor： Yoichi Kobayashi , Shunsuke Nakai , Hitoshi Tsuji , Yasuo Tsukuda , Junki Ishimoto , Kazunari Shinya
IPC: B24B49/12
CPC classification number: B24B49/12 , B24B37/013
Abstract: A polishing state monitoring apparatus measures characteristic values of a surface, being polished, of a workpiece to determine the timing of a polishing end point. The polishing state monitoring apparatus includes a light-emitting unit for applying light from a light source to a surface of a workpiece being polished, a light-receiving unit for receiving reflected light from the surface of the workpiece, a spectroscope unit for dividing the reflected light received by the light-receiving unit into a plurality of light rays having respective wavelengths, and light-receiving elements for accumulating the detected light rays as electrical information. The polishing state monitoring apparatus further includes a spectral data generator for reading the electrical information accumulated by the light-receiving elements and generating spectral data of the reflected light, and a processor for calculating a predetermined characteristic value on the surface of the workpiece based on the spectral data generated by the spectral data generator.
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Patent Agency Ranking
公开(公告)号：US06999168B2
公开(公告)日：2006-02-14
申请号：US10857706
申请日：2004-05-28
Applicant: Junki Ishimoto
Inventor： Junki Ishimoto
IPC: G01J3/42
CPC classification number: G01J3/2889 , G01J3/10 , G01J2003/2836
Abstract: An external signal detection circuit is installed in a new measuring section, and generation and end timing of a readout signal of a spectrometric detector is directly controlled, and a readout signal in synchronization with an external start signal is generated. After input of measurement standby instructions, the external start signal is monitored anytime. Before detection of the external start signal, the new measuring section is shifted to a pause state and after the detection of the external start signal, transition to a measurement state is made. By this configuration, delay time between input time of the external start signal and readout start time of data is defined and valid measurable time at the time of setting short storage time is increased.
Abstract translation: 外部信号检测电路安装在新的测量部分中，直接控制光谱检测器的读出信号的产生和结束定时，并产生与外部起始信号同步的读出信号。 在输入测量待机指令后，随时监控外部启动信号。 在检测到外部启动信号之前，新的测量部分转移到暂停状态，并且在检测到外部启动信号之后，转变到测量状态。 通过该配置，定义外部启动信号的输入时间和数据的读出开始时间之间的延迟时间，并且在设定较短存储时间时有效的可测量时间增加。
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公开(公告)号：US08342907B2
公开(公告)日：2013-01-01
申请号：US12627333
申请日：2009-11-30
Applicant: Yoichi Kobayashi , Shunsuke Nakai , Hitoshi Tsuji , Yasuo Tsukuda , Junki Ishimoto , Kazunari Shinya
Inventor： Yoichi Kobayashi , Shunsuke Nakai , Hitoshi Tsuji , Yasuo Tsukuda , Junki Ishimoto , Kazunari Shinya
CPC classification number: B24B49/12 , B24B37/013
Abstract: A polishing state monitoring apparatus measures characteristic values of a surface, being polished, of a workpiece to determine the timing of a polishing end point. The polishing state monitoring apparatus includes a light-emitting unit for applying light from a light source to a surface of a workpiece being polished, a light-receiving unit for receiving reflected light from the surface of the workpiece, a spectroscope unit for dividing the reflected light received by the light-receiving unit into a plurality of light rays having respective wavelengths, and light-receiving elements for accumulating the detected light rays as electrical information. The polishing state monitoring apparatus further includes a spectral data generator for reading the electrical information accumulated by the light-receiving elements and generating spectral data of the reflected light, and a processor for calculating a predetermined characteristic value on the surface of the workpiece based on the spectral data generated by the spectral data generator.
Abstract translation: 抛光状态监视装置测量被抛光表面的特征值，以确定抛光终点的定时。 抛光状态监视装置包括用于将光从光源施加到被抛光的工件的表面的发光单元，用于接收来自工件表面的反射光的光接收单元，用于将反射的 由光接收单元接收的多个光具有各自的波长的光;以及用于将检测到的光线累积的光接收元件作为电信息。 抛光状态监视装置还包括：光谱数据发生器，用于读取由光接收元件累积的电信息并产生反射光的光谱数据;以及处理器，用于基于工件的表面计算工件表面上的预定特征值 光谱数据生成器生成的光谱数据。
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公开(公告)号：US07645181B2
公开(公告)日：2010-01-12
申请号：US12230317
申请日：2008-08-27
Applicant: Yoichi Kobayashi , Shunsuke Nakai , Hitoshi Tsuji , Yasuo Tsukuda , Junki Ishimoto , Kazunari Shinya
Inventor： Yoichi Kobayashi , Shunsuke Nakai , Hitoshi Tsuji , Yasuo Tsukuda , Junki Ishimoto , Kazunari Shinya
CPC classification number: B24B49/12 , B24B37/013
Abstract: A polishing state monitoring apparatus measures characteristic values of a surface, being polished, of a workpiece to determine the timing of a polishing end point. The polishing state monitoring apparatus includes a light-emitting unit for applying light from a light source to a surface of a workpiece being polished, a light-receiving unit for receiving reflected light from the surface of the workpiece, a spectroscope unit for dividing the reflected light received by the light-receiving unit into a plurality of light rays having respective wavelengths, and light-receiving elements for accumulating the detected light rays as electrical information. The polishing state monitoring apparatus further includes a spectral data generator for reading the electrical information accumulated by the light-receiving elements and generating spectral data of the reflected light, and a processor for calculating a predetermined characteristic value on the surface of the workpiece based on the spectral data generated by the spectral data generator.
Abstract translation: 抛光状态监视装置测量被抛光表面的特征值，以确定抛光终点的定时。 抛光状态监视装置包括用于将光从光源施加到被抛光的工件的表面的发光单元，用于接收来自工件表面的反射光的光接收单元，用于将反射的 由光接收单元接收的多个光具有各自的波长的光;以及用于将检测到的光线累积的光接收元件作为电信息。 抛光状态监视装置还包括：光谱数据发生器，用于读取由光接收元件累积的电信息并产生反射光的光谱数据;以及处理器，用于基于工件的表面计算工件表面上的预定特征值 光谱数据生成器生成的光谱数据。
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公开(公告)号：US07252575B2
公开(公告)日：2007-08-07
申请号：US10526933
申请日：2003-10-15
Applicant: Yoichi Kobayashi , Shunsuke Nakai , Hitoshi Tsuji , Yasuo Tsukuda , Junki Ishimoto , Kazunari Shinya
Inventor： Yoichi Kobayashi , Shunsuke Nakai , Hitoshi Tsuji , Yasuo Tsukuda , Junki Ishimoto , Kazunari Shinya
CPC classification number: B24B49/12 , B24B37/013
Abstract: A polishing state monitoring apparatus measures characteristic values of a surface, being polished, of a workpiece to determine the timing of a polishing end point. The polishing state monitoring apparatus includes a light-emitting unit for applying light from a light source to a surface of a workpiece being polished, a light-receiving unit for receiving reflected light from the surface of the workpiece, a spectroscope unit for dividing the reflected light received by the light-receiving unit into a plurality of light rays having respective wavelengths, and light-receiving elements for accumulating the detected light rays as electrical information. The polishing state monitoring apparatus further includes a spectral data generator for reading the electrical information accumulated by the light-receiving elements and generating spectral data of the reflected light, and a processor for calculating a predetermined characteristic value on the surface of the workpiece based on the spectral data generated by the spectral data generator.
Abstract translation: 抛光状态监视装置测量被抛光表面的特征值，以确定抛光终点的定时。 抛光状态监视装置包括用于将光从光源施加到被抛光的工件的表面的发光单元，用于接收来自工件表面的反射光的光接收单元，用于将反射的 由光接收单元接收的多个光具有各自的波长的光;以及用于将检测到的光线累积的光接收元件作为电信息。 抛光状态监视装置还包括：光谱数据发生器，用于读取由光接收元件累积的电信息并产生反射光的光谱数据;以及处理器，用于基于工件的表面计算工件表面上的预定特征值 光谱数据生成器生成的光谱数据。
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公开(公告)号：US20060166606A1
公开(公告)日：2006-07-27
申请号：US10526933
申请日：2003-10-15
Applicant: Yoichi Kobayashi , Shunsuke Nakai , Hitoshi Tsuji , Yasuo Tsukuda , Junki Ishimoto , Kazunari Shinya
Inventor： Yoichi Kobayashi , Shunsuke Nakai , Hitoshi Tsuji , Yasuo Tsukuda , Junki Ishimoto , Kazunari Shinya
CPC classification number: B24B49/12 , B24B37/013
Abstract: A polishing state monitoring apparatus measures characteristic values of a surface, being polished, of a workpiece to determine the timing of a polishing end point. The polishing state monitoring apparatus includes a light-emitting unit for applying light from a light source to a surface of a workpiece being polished, a light-receiving unit for receiving reflected light from the surface of the workpiece, a spectroscope unit for dividing the reflected light received by the light-receiving unit into a plurality of light rays having respective wavelengths, and light-receiving elements for accumulating the detected light rays as electrical information. The polishing state monitoring apparatus further includes a spectral data generator for reading the electrical information accumulated by the light-receiving elements and generating spectral data of the reflected light, and a processor for calculating a predetermined characteristic value on the surface of the workpiece based on the spectral data generated by the spectral data generator.
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