公开(公告)号：US10863628B2

公开(公告)日：2020-12-08

申请号：US16655621

申请日：2019-10-17

申请人： Juniper Networks, Inc.

发明人： Matthew Twarog ,  Hui He ,  Thomas W. Jetton

IPC分类号： H05K1/11 ,  H05K1/02 ,  H05K3/00 ,  H05K3/46 ,  H05K3/40 ,  H05K3/22

摘要： A printed circuit board (PCB) may include a plurality of horizontally disposed signal layers. The PCB may include a first vertically disposed differential via electrically connected to a first horizontally disposed signal layer, of the plurality of horizontally disposed signal layers, and a second horizontally disposed signal layer of the plurality of horizontally disposed signal layers. The PCB may include a second vertically disposed differential via electrically connected to the first signal horizontally disposed layer and the second horizontally disposed signal layer. The PCB may include a first set of clearances encompassing the first vertically disposed differential via and the second vertically disposed differential via, a second set of clearances encompassing the first vertically disposed stub, and a third set of clearances encompassing the second vertically disposed stub.

公开(公告)号：US10470311B2

公开(公告)日：2019-11-05

申请号：US15719168

申请日：2017-09-28

申请人： Juniper Networks, Inc.

发明人： Matthew Twarog ,  Hui He ,  Thomas W. Jetton

IPC分类号： H05K1/11 ,  H05K1/02 ,  H05K3/00 ,  H05K3/46 ,  H05K3/40

摘要： A printed circuit board (PCB) may include a plurality of horizontally disposed signal layers. The PCB may include a first vertically disposed differential via electrically connected to a first horizontally disposed signal layer, of the plurality of horizontally disposed signal layers, and a second horizontally disposed signal layer of the plurality of horizontally disposed signal layers. The PCB may include a second vertically disposed differential via electrically connected to the first signal horizontally disposed layer and the second horizontally disposed signal layer. The PCB may include a first set of clearances encompassing the first vertically disposed differential via and the second vertically disposed differential via, a second set of clearances encompassing the first vertically disposed stub, and a third set of clearances encompassing the second vertically disposed stub.

公开(公告)号：US20190098765A1

公开(公告)日：2019-03-28

申请号：US15719168

申请日：2017-09-28

申请人： Juniper Networks, Inc.

发明人： Matthew TWAROG ,  Hui He ,  Thomas W. Jetton

IPC分类号： H05K3/00 ,  H05K1/11 ,  H05K1/02 ,  H05K3/46 ,  H05K3/40

摘要： A printed circuit board (PCB) may include a plurality of horizontally disposed signal layers. The PCB may include a first vertically disposed differential via electrically connected to a first horizontally disposed signal layer, of the plurality of horizontally disposed signal layers, and a second horizontally disposed signal layer of the plurality of horizontally disposed signal layers. The PCB may include a second vertically disposed differential via electrically connected to the first signal horizontally disposed layer and the second horizontally disposed signal layer. The PCB may include a first set of clearances encompassing the first vertically disposed differential via and the second vertically disposed differential via, a second set of clearances encompassing the first vertically disposed stub, and a third set of clearances encompassing the second vertically disposed stub.

公开(公告)号：US09867317B1

公开(公告)日：2018-01-09

申请号：US15244422

申请日：2016-08-23

申请人： Juniper Networks, Inc.

发明人： Thomas W. Jetton

IPC分类号： H05K7/20 ,  H05K1/02

CPC分类号： H05K7/20445 ,  H05K1/0203 ,  H05K7/2039 ,  H05K7/209 ,  H05K2201/066

摘要： An apparatus may include a heat sink to be mounted to a printed circuit board. The apparatus may include a power supply mounted to the heat sink. The power supply may receive input power and supply output power to one or more components of the printed circuit board.