摘要:
The method for producing glass-coated electronic components includes processing a lead-free glass with a liquid to form a suspension, applying the suspension on an electronic component body and subsequently sintering the component body with the suspension on it. The lead-free glass contains, in % by weight, SiO2, 3-12; B2O3, 15-
摘要:
The invention relates to a method for the production of glass-coated electric components, wherein the components are, inter alia, passivated by the application of the glass. The lead-free glass used is not affected through purification and processing steps and the electric component is protected from mechanical damaging and other detrimental influences, such as impurities. Further, the method remarkably helps to stabilize the electrical properties of the components. Inter alia, a sufficient acid resistance is achieved and it results in an improvement of the expansion adjustment of the glass.
摘要:
The invention relates to a method for producing glass-coated electronic components and the use of the method for passivating electronic components.
摘要:
The invention relates to a method for the production of glass-coated electric components, wherein the components are, inter alia, passivated by the application of the glass. The lead-free glass used is not affected through purification and processing steps and the electric component is protected from mechanical damaging and other detrimental influences, such as impurities. Further, the method remarkably helps to stabilise the electrical properties of the components. Inter alia, a sufficient acid resistance is achieved and it results in an improvement of the expansion adjustment of the glass.
摘要:
A crystallizing glass solder for high-temperature applications, containing, in % by weight on an oxide basis: 45% to 60% of BaO, 25% to 40% of SiO2, 5% to 15% of B2O3, 0 to
摘要:
A crystallizing glass solder for high-temperature applications, containing, in % by weight on an oxide basis: 45% to 60% of BaO, 25% to 40% of SiO2, 5% to 15% of B2O3, 0 to
摘要:
A crystallizing glass solder for high-temperature applications, containing, in % by weight on an oxide basis: 45% to 60% of BaO, 25% to 40% of SiO2, 5% to 15% of B2O3, 0 to
摘要:
A glass powder or a glass-ceramic powder is provided that includes multicomponent glasses with at least three elements, where the glass powder or a glass-ceramic powder has a mean particle size of less than 1 μm. In some embodiments, the mean particle size is less than 0.1 μm, while in other embodiments the mean particle size is less than 10 nm.
摘要:
The X-ray opaque glass is characterized by a composition, in mol %, of SiO2, 75-98; Yb2O3, 0.1 to 40; and ZrO2, 0 to 40. Preferred embodiments of the glass are free of Al2O3 and B2O3. The glass is produced from the glass batch by melting at a temperature of at least 1500° C. in an iridium or iridium alloy vessel with the assistance of high-frequency radiation. In preferred embodiments of the glass production process at least one raw material ingredient is present in the batch as a nanoscale powder. The glass is useful in dental applications, optical applications, and biomedical applications, or for photovoltaics, or as a target material in PVD processes.
摘要翻译:X射线不透明玻璃的特征在于以摩尔%计的SiO 2,75-98的组成; Yb2O3,0.1〜40; 和ZrO 2,0至40.玻璃的优选实施方案不含Al 2 O 3和B 2 O 3。 在高频辐射的帮助下,通过在铱或铱合金容器中在至少1500℃的温度下熔融从玻璃批料中制造玻璃。 在玻璃制备方法的优选实施方案中,至少一种原料成分以批量存在于纳米级粉末中。 该玻璃可用于牙科应用,光学应用,生物医学应用,或光伏发电,或作为PVD工艺中的靶材料。
摘要:
The invention relates to a method for producing package parts for optical or optoelectronic components. To this end a metal package element is bonded to a transparent package element by means of a glass solder ring, the glass solder being brought in contact with the metal package element and the transparent package element, and the metal package element being inductively heated by an alternating electromagnetic field generated by an induction coil, so that the glass solder is heated and fused in contact with the metal package element and a hermetic, preferably ring-shaped bond between the metal package element and the transparent package element being produced by fusing and subsequently solidifying the glass solder.