公开(公告)号：US20060211461A1

公开(公告)日：2006-09-21

申请号：US11403492

申请日：2006-04-13

Applicant: James Hattis

Inventor： James Hattis

IPC: B41L1/24

CPC classification number: H01L24/17 ,  H01L23/3677 ,  H01L24/13 ,  H01L24/14 ,  H01L24/81 ,  H01L2224/10135 ,  H01L2224/10165 ,  H01L2224/131 ,  H01L2224/13291 ,  H01L2224/13299 ,  H01L2224/1403 ,  H01L2224/14051 ,  H01L2224/14135 ,  H01L2224/14505 ,  H01L2224/16 ,  H01L2224/17519 ,  H01L2224/81141 ,  H01L2224/81385 ,  H01L2224/81902 ,  H01L2224/94 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01041 ,  H01L2924/01057 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H05K1/0204 ,  H05K3/0061 ,  H05K2201/0154 ,  H05K2201/10674 ,  H01L2224/11 ,  H01L2224/0401

Abstract: A method and apparatus for improving the thermal conductivity of a circuit board (CB) assembly comprising an integrated circuit (IC) die mounted on a CB. A high thermal conductivity device is attached on a first end to a surface of the die. When the die is mounted on the CB, a void formed in the CB receives a second end of the HTC device, and the second end of the HTC device comes into contact with a portion of the CB. During operation of the die, heat produced by the die is dissipated through the HTC device and into the CB.

Abstract translation: 一种用于改善电路板（CB）组件的热导率的方法和装置，其包括安装在CB上的集成电路（IC）模具。 高导热性装置在第一端附接到模具的表面。 当芯片安装在CB上时，形成在CB中的空隙接收HTC设备的第二端，并且HTC设备的第二端与CB的一部分接触。 在模具的操作期间，由模具产生的热量通过HTC装置消散并进入CB。