公开(公告)号：US20170316998A1

公开(公告)日：2017-11-02

申请号：US15493231

申请日：2017-04-21

Applicant: J-DEVICES CORPORATION

Inventor： Hisakazu MARUTANI ,  Minoru KAI ,  Kazuhiko KITANO

IPC: H01L23/31 ,  H01L21/82 ,  H01L21/56 ,  H01L23/544 ,  H01L23/00

Abstract: A manufacturing method of a semiconductor package includes locating a plurality of semiconductor packages on a substrate, forming a resin insulating layer covering the plurality of semiconductor devices, forming grooves, in the resin insulating layer, enclosing each of the plurality of semiconductor devices and reaching the substrate, and irradiating the substrate with laser light in positional correspondence with the grooves to separate the plurality of semiconductor devices from each other.

公开(公告)号：US20170110432A1

公开(公告)日：2017-04-20

申请号：US15290557

申请日：2016-10-11

Applicant: J-DEVICES CORPORATION

Inventor： Minoru KAI

IPC: H01L23/00 ,  H01L21/67 ,  H01L21/68

CPC classification number: H01L24/75 ,  H01L21/67132 ,  H01L21/67144 ,  H01L21/681 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/27436 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/75312 ,  H01L2224/75316 ,  H01L2224/7532 ,  H01L2224/75702 ,  H01L2224/75745 ,  H01L2224/75753 ,  H01L2224/75822 ,  H01L2224/75824 ,  H01L2224/8313 ,  H01L2224/83132 ,  H01L2224/8317 ,  H01L2224/8318 ,  H01L2224/83191 ,  H01L2924/00014 ,  H01L2924/0715 ,  H01L2924/0635 ,  H01L2924/06 ,  H01L2924/013 ,  H01L2924/00012

Abstract: A press fitting head comprising an elastic member in a part where the press fitting head contacts a semiconductor device, and an alignment mark recognition area capable of detecting an optically readable marker provided on a surface to be contacted to the semiconductor device is provided. Additionally, a semiconductor manufacturing apparatus in which the press fitting head is applied is provided.

公开(公告)号：US20170338136A1

公开(公告)日：2017-11-23

申请号：US15600082

申请日：2017-05-19

Applicant: J-DEVICES CORPORATION

Inventor： Minoru KAI

IPC: H01L21/67 ,  H01L23/498 ,  H01L21/68 ,  H01L23/00 ,  H01L23/14

CPC classification number: H01L21/67132 ,  H01L21/67144 ,  H01L21/681 ,  H01L21/6838 ,  H01L23/147 ,  H01L23/49833 ,  H01L24/05 ,  H01L24/75

Abstract: A semiconductor manufacturing apparatus includes a stage connected to a vacuum generator to suction a semiconductor wafer including a plurality of semiconductor chips; a suction control unit connected to a connecting portion of the stage and the vacuum generator to control the connection of the stage and the vacuum generator; a pickup unit picking up each of the plurality of semiconductor chips; and a control unit controlling movement and rotation of the pickup unit and controlling the suction control unit; wherein the pickup unit moves the semiconductor chip from the stage to a mounting position of a supporting substrate and adherers the semiconductor chip by the control unit.