Invention Application
- Patent Title: PRESS FITTING HEAD AND SEMICONDUCTOR MANUFACTURING APPARATUS USING THE SAME
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Application No.: US15290557Application Date: 2016-10-11
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Publication No.: US20170110432A1Publication Date: 2017-04-20
- Inventor: Minoru KAI
- Applicant: J-DEVICES CORPORATION
- Priority: JP2015-203884 20151015
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L21/67 ; H01L21/68
Abstract:
A press fitting head comprising an elastic member in a part where the press fitting head contacts a semiconductor device, and an alignment mark recognition area capable of detecting an optically readable marker provided on a surface to be contacted to the semiconductor device is provided. Additionally, a semiconductor manufacturing apparatus in which the press fitting head is applied is provided.
Public/Granted literature
- US10388625B2 Press fitting head and semiconductor manufacturing apparatus using the same Public/Granted day:2019-08-20
Information query
IPC分类:
