Invention Grant
- Patent Title: Press fitting head and semiconductor manufacturing apparatus using the same
-
Application No.: US15290557Application Date: 2016-10-11
-
Publication No.: US10388625B2Publication Date: 2019-08-20
- Inventor: Minoru Kai
- Applicant: J-DEVICES CORPORATION
- Applicant Address: JP Oita
- Assignee: J-Devices Corporation
- Current Assignee: J-Devices Corporation
- Current Assignee Address: JP Oita
- Priority: JP2015-203884 20151015
- Main IPC: H01L21/68
- IPC: H01L21/68 ; H01L21/67 ; H01L23/00
Abstract:
A press fitting head comprising an elastic member in a part where the press fitting head contacts a semiconductor device, and an alignment mark recognition area capable of detecting an optically readable marker provided on a surface to be contacted to the semiconductor device is provided. Additionally, a semiconductor manufacturing apparatus in which the press fitting head is applied is provided.
Public/Granted literature
- US20170110432A1 PRESS FITTING HEAD AND SEMICONDUCTOR MANUFACTURING APPARATUS USING THE SAME Public/Granted day:2017-04-20
Information query
IPC分类:
