- 专利标题： Press fitting head and semiconductor manufacturing apparatus using the same
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申请号： US15290557申请日： 2016-10-11
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公开(公告)号： US10388625B2公开(公告)日： 2019-08-20
- 发明人: Minoru Kai
- 申请人： J-DEVICES CORPORATION
- 申请人地址： JP Oita
- 专利权人： J-Devices Corporation
- 当前专利权人： J-Devices Corporation
- 当前专利权人地址： JP Oita
- 优先权： JP2015-203884 20151015
- 主分类号： H01L21/68
- IPC分类号： H01L21/68 ; H01L21/67 ; H01L23/00
摘要：
A press fitting head comprising an elastic member in a part where the press fitting head contacts a semiconductor device, and an alignment mark recognition area capable of detecting an optically readable marker provided on a surface to be contacted to the semiconductor device is provided. Additionally, a semiconductor manufacturing apparatus in which the press fitting head is applied is provided.
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