公开(公告)号：US20180102251A1

公开(公告)日：2018-04-12

申请号：US15725030

申请日：2017-10-04

申请人： Invensas Bonding Technologies, Inc.

发明人： Javier A. DELACRUZ ,  Steven L. TEIG ,  Shaowu HUANG ,  William C. PLANTS ,  David Edward FISCH

IPC分类号： H01L21/20 ,  H01L21/48 ,  H01L21/74 ,  H01L21/82

摘要： Direct-bonded native interconnects and active base dies are provided. In a microelectronic architecture, active dies or chiplets connect to an active base die via their core-level conductors. These native interconnects provide short data paths, which forgo the overhead of standard interfaces. The system saves redistribution routing as the native interconnects couple in place. The base die may contain custom logic, allowing the attached dies to provide stock functions. The architecture can connect diverse interconnect types and chiplets from various process nodes, operating at different voltages. The base die may have state elements for drive. Functional blocks aboard the base die receive native signals from diverse chiplets, and communicate with all attached chiplets. The chiplets may share processing and memory resources of the base die. Routing blockages are minimal, improving signal quality and timing. The system can operate at dual or quad data rates. The architecture facilitates ASIC, ASSP, and FPGA ICs and neural networks, reducing footprint and power requirements.