公开(公告)号：US20240426867A1

公开(公告)日：2024-12-26

申请号：US18214187

申请日：2023-06-26

Applicant: InvenSense, Inc.

Inventor： Matthew Julian Thompson ,  Roberto Martini

IPC: G01P15/125 ,  G01P21/00

Abstract: A MEMS sensor may include multiple sense electrodes located relative to respective portions of one or more proof masses of a MEMS layer of the sensor. Individual sense electrodes are capable of individual calibration within the drive and/or sense path for the sense electrode. A distance between each individual sense electrode relative to a proof mass is determined for the at-rest state of the sensor. Calibration values are determined based on these distances, and individual drive and/or sense signals associated with each sense electrode are modified to adjust for changes in distance, such as are caused by shifting, tilting, or bending of the MEMS layer or substrate.

公开(公告)号：US20240069061A1

公开(公告)日：2024-02-29

申请号：US18502444

申请日：2023-11-06

Applicant: INVENSENSE, INC.

Inventor： Matthew Julian Thompson ,  Robert Walmsley

IPC: G01P15/08

CPC classification number: G01P15/08 ,  G01P2015/0871

Abstract: A microelectromechanical system device is described. The microelectromechanical system device can comprise: a proof mass coupled to an anchor via a spring, wherein the proof mass moves in response to an imposition of an external load to the proof mass, and an overtravel stop comprising a first portion and a second portion.

公开(公告)号：US11548780B2

公开(公告)日：2023-01-10

申请号：US17516245

申请日：2021-11-01

Applicant: INVENSENSE, INC.

Inventor： David deKoninck ,  Varun Subramaniam Kumar ,  Matthew Julian Thompson ,  Vadim Tsinker ,  Logeeswaran Veerayah Jayaraman ,  Sarah Nitzan ,  Houri Johari-Galle ,  Jongwoo Shin ,  Le Jin

IPC: G01L19/04 ,  G01K1/20 ,  B81B7/00 ,  G01L9/00

Abstract: An exemplary microelectromechanical device includes a MEMS layer, portions of which respond to an external force in order to measure the external force. A substrate layer is located below the MEMS layer and an anchor couples the substrate layer and MEMS layer to each other. A plurality of temperature sensors are located within the substrate layer to identify a temperature gradient being experienced by the MEMS device. Compensation is performed or operations of the MEMS device are modified based on temperature gradient.

公开(公告)号：US11186479B2

公开(公告)日：2021-11-30

申请号：US16547257

申请日：2019-08-21

Applicant: INVENSENSE, INC.

Inventor： David deKoninck ,  Varun Subramaniam Kumar ,  Matthew Julian Thompson ,  Vadim Tsinker ,  Logeeswaran Veerayah Jayaraman ,  Sarah Nitzan ,  Houri Johari-Galle ,  Jongwoo Shin ,  Le Jin

IPC: G01L19/04 ,  G01K1/20 ,  B81B7/00 ,  G01L9/00

Abstract: An exemplary microelectromechanical device includes a MEMS layer, portions of which respond to an external force in order to measure the external force. A substrate layer is located below the MEMS layer and an anchor couples the substrate layer and MEMS layer to each other. A plurality of temperature sensors are located within the substrate layer to identify a temperature gradient being experienced by the MEMS device. Compensation is performed or operations of the MEMS device are modified based on temperature gradient.

公开(公告)号：US10793424B2

公开(公告)日：2020-10-06

申请号：US16558145

申请日：2019-09-01

Applicant: INVENSENSE, INC.

Inventor： Matthew Julian Thompson ,  Stephen Lloyd ,  Joseph Seeger

IPC: B81B7/00 ,  G01N3/02 ,  G01M7/08 ,  G01M17/007 ,  G01M1/16 ,  B81B7/02 ,  B81C99/00 ,  G06F11/30 ,  H01L21/66 ,  H03K21/02

Abstract: A device with a first MEMS device and a second MEMS device is disclosed. The first MEMS device is configured to sense at least one external influence. The second MEMS device is responsive to the at least one external influence. The first MEMS device is configured to change a state when the at least one external influence exceeds a threshold value. The first MEMS device is configured to retain the state below the threshold value, wherein the change in state of the first MEMS device is done passively and wherein the state of the first MEMS device is indicative of a status of the second MEMS device. In one example, the first MEMS device further comprises a normally open switch that closes when the external influence exceeds the threshold value.

公开(公告)号：US20200300887A1

公开(公告)日：2020-09-24

申请号：US16824161

申请日：2020-03-19

Applicant: INVENSENSE, INC.

Inventor： Sriraman Dakshinamurthy ,  Matthew Julian Thompson ,  Vadim Tsinker

IPC: G01P21/00 ,  G01P15/08 ,  G01P15/125

Abstract: A method of measuring noise of an accelerometer can comprise exposing the accelerometer comprising a micro-electro-mechanical system (MEMS) component coupled to an application specific integrated circuit component (ASIC), to an external environmental input, with the MEMS component being configured to provide a first output to the ASIC based on the external environmental input. The method can further comprise estimating a first noise generated by operation of the MEMS component, and replacing the first output provided to the ASIC from the MEMS component, with a second output generated by a MEMS emulator component, with the second output comprising the first noise. Further, the method can include generating an output of the accelerometer based on the second output processed by the ASIC.

公开(公告)号：US10393768B2

公开(公告)日：2019-08-27

申请号：US14981877

申请日：2015-12-28

Applicant: INVENSENSE, INC.

Inventor： Matthew Julian Thompson ,  Joseph Seeger

IPC: G01P15/125 ,  G01R33/028 ,  G01P15/12 ,  G01P15/18 ,  G01P15/08

Abstract: A method and system for a sensor system of a device is disclosed. The sensor system includes a first MEMS sensor (FMEMS), a second MEMS sensor (SMEMS) and a signal processor (SP). An excitation is imparted to the device along a first axis (FA). The FMEMS has a first primary sense axis (FPSA), moves in response to a component of the excitation along the FA aligned with the FPSA and outputs a first signal proportional to an excitation along the FPSA. The SMEMS has a second primary sense axis (SPSA), moves in response to a component of the excitation along the FA aligned with the SPSA and outputs a second signal proportional to an excitation along the SPSA. The SP combines the first signal and the second signal to output a third signal proportional to the excitation along the FA. The FA, the FPSA and the SPSA have different orientations.

公开(公告)号：US11174153B2

公开(公告)日：2021-11-16

申请号：US16547275

申请日：2019-08-21

Applicant: INVENSENSE, INC.

Inventor： Ilya Gurin ,  Matthew Julian Thompson ,  Vadim Tsinker

IPC: B81B7/00

Abstract: A microelectromechanical (MEMS) device may be coupled to a dielectric material at an upper planar surface or lower planar surface of the MEMS device. One or more temperature sensors may be attached to the dielectric material layer. Signals from the one or more temperature sensors may be used to determine a thermal gradient along on axis that is normal to the upper planar surface and the lower planar surface. The thermal gradient may be used to compensate for values measured by the MEMS device.

公开(公告)号：US20200264210A1

公开(公告)日：2020-08-20

申请号：US16794952

申请日：2020-02-19

Applicant: INVENSENSE, INC.

Inventor： Sriraman Dakshinamurthy ,  Vadim Tsinker ,  Matthew Julian Thompson

IPC: G01P15/13 ,  G01P15/08

Abstract: A MEMS accelerometer includes a suspended spring-mass system that has a frequency response to accelerations experienced over a range of frequencies. The components of the suspended spring-mass system such as the proof masses respond to acceleration in a substantially uniform manner at frequencies that fall within a designed bandwidth for the MEMS accelerometer. Digital compensation circuitry compensates for motion of the proof masses outside of the designed bandwidth, such that the functional bandwidth of the MEMS accelerometer is significantly greater than the designed bandwidth.

公开(公告)号：US20200233011A1

公开(公告)日：2020-07-23

申请号：US16842619

申请日：2020-04-07

Applicant: INVENSENSE, INC.

Inventor： Giacomo Laghi ,  Matthew Julian Thompson ,  Luca Coronato ,  Roberto Martini

IPC: G01P15/125 ,  B81B7/00

Abstract: Exemplary embodiment of a tilting z-axis, out-of-plane sensing MEMS accelerometers and associated structures and configurations are described. Disclosed embodiments facilitate improved offset stabilization. Non-limiting embodiments provide exemplary MEMS structures and apparatuses characterized by one or more of having a sensing MEMS structure that is symmetric about the axis orthogonal to the springs or flexible coupling axis, a spring or flexible coupling axis that is aligned to one of the symmetry axes of the electrodes pattern, a different number of reference electrodes and sense electrodes, a reference MEMS structure having at least two symmetry axes, one which is along the axis of the springs or flexible coupling, and/or a reference structure below the spring or flexible coupling axis.