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公开(公告)号：US20180120037A1
公开(公告)日：2018-05-03
申请号：US15337959
申请日：2016-10-28
发明人： Eric J. CAMPBELL , Phillip V. MANN
CPC分类号： F28F3/02 , B32B5/00 , F28F3/022 , F28F13/003 , F28F13/185 , F28F21/067 , F28F21/081 , F28F21/085 , F28F21/087 , F28F21/089 , F28F2215/04 , F28F2215/06 , F28F2215/10 , F28F2245/06 , F28F2255/06 , F28F2255/146
摘要： A heat exchange apparatus, and method of forming the apparatus, are disclosed. The apparatus includes a thermally conductive substrate with a metal microlattice structure adhered to the thermally conductive substrate and in thermal communication with the thermally conductive substrate, the metal microlattice structure comprising a region containing an electroless metal. A method of making the apparatus includes forming a polymer lattice, applying the polymer lattice to a thermally conductive substrate, forming an electroless plated metal layer on the polymer lattice, forming an electroplated metal layer on the electroless metal layer, and forming a metal microlattice of the electroless metal layer and the electroplated metal layer.
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公开(公告)号：US20180332719A1
公开(公告)日：2018-11-15
申请号：US15593610
申请日：2017-05-12
CPC分类号： H05K3/429 , H05K3/0047 , H05K3/0094 , H05K3/421 , H05K2201/0254 , H05K2201/09509 , H05K2201/09563
摘要： A method and associated apparatus are disclosed for forming a conductive via that extends partly through a multi-layer assembly, wherein the method comprises forming a cavity from a surface of the multi-layer assembly to a first depth. The cavity extends through a plurality of layers of the multi-layer assembly. The plurality of layers comprises a healing layer comprising a plurality of microcapsules. Forming the cavity ruptures some of the plurality of microcapsules to release encapsulated material into the cavity. The released encapsulated material defines a second depth from the surface, the second depth being closer to the surface than the first depth. The method further comprises depositing conductive material within the cavity to form the conductive via that extends to the second depth.
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公开(公告)号：US20180123294A1
公开(公告)日：2018-05-03
申请号：US15800774
申请日：2017-11-01
IPC分类号： H01R13/66 , H01R9/03 , H01R13/6592
CPC分类号： H01R13/665 , H01R9/03 , H01R13/6592
摘要： A cable, system, and method for cooling a semiconductor chip on an active cable. The active cable includes a heat sink that is thermally coupled to the semiconductor chip and movable from a retracted position to an extended position. The heat sink is in the retracted position when the active cable is not installed in a card connector in a computer case. After the active cable is installed in the card connector, the heat sink is urged to the extended position in which the heat sink is exposed to air flow circulation within the computer case.
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公开(公告)号：US20240349448A1
公开(公告)日：2024-10-17
申请号：US18300755
申请日：2023-04-14
发明人： Phillip V. MANN , Christopher M. MARROQUIN , Ray Clement LANING , Milnes P. DAVID , Nathan Lee DUNFEE
IPC分类号： H05K7/20
CPC分类号： H05K7/20272
摘要： Embodiments of the disclosure provide cooling systems and cooling methods for isolating temperature fluctuation in an electronics enclosure. Embodiments of the disclosure provide effective cooling of high power temperature fluctuating components and a stable reference temperature for temperature sensitive components included in a single electronics enclosure. A disclosed multiple path cooling system includes a first path for cooling power variable components and a second path to maintain stable temperature cooling for temperature sensitive components.
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