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公开(公告)号：US20210111037A1
公开(公告)日：2021-04-15
申请号：US17130041
申请日：2020-12-22
发明人： Phillip D. ISAACS , Christopher M. MARROQUIN , Daren SIMMONS , Frank L. POMPEO , Jason R. EAGLE , Mark K. HOFFMEYER , Michael J. ELLSWORTH, JR. , Prabjit SINGH , Steve OSTRANDER
IPC分类号： H01L21/48 , H01L23/367 , H01L23/40 , H05K7/20 , B21D53/02 , H01L23/473
摘要： A fixture to facilitate fabrication of a heat sink includes a base plate to support a lower section of the heat sink, and multiple registration pins extending from the base plate. A platen is provided over a heat transfer element (HTE) of the heat sink, with the platen including slip fit regions to slip fit around respective registration pins, and with the lower section and HTE disposed between the base plate and the platen, and forming a fixture stack segment aligned with an active region of the cold plate. A load plate is provided which includes slip fit regions configured to slip fit around corresponding registration pins with the load plate disposed over the fixture stack segment. The load plate includes a single load pin centrally disposed to apply a load to the fixture stack segment and facilitate bonding the lower section and HTE together.
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公开(公告)号：US20240349448A1
公开(公告)日：2024-10-17
申请号：US18300755
申请日：2023-04-14
发明人： Phillip V. MANN , Christopher M. MARROQUIN , Ray Clement LANING , Milnes P. DAVID , Nathan Lee DUNFEE
IPC分类号： H05K7/20
CPC分类号： H05K7/20272
摘要： Embodiments of the disclosure provide cooling systems and cooling methods for isolating temperature fluctuation in an electronics enclosure. Embodiments of the disclosure provide effective cooling of high power temperature fluctuating components and a stable reference temperature for temperature sensitive components included in a single electronics enclosure. A disclosed multiple path cooling system includes a first path for cooling power variable components and a second path to maintain stable temperature cooling for temperature sensitive components.
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公开(公告)号：US20190307018A1
公开(公告)日：2019-10-03
申请号：US15937480
申请日：2018-03-27
摘要： A method and apparatus includes a first fin structure having a flat portion for a cooling medium to travel across. The first fin structure additionally includes a coupling portion on a first edge of the flat portion. The coupling portion may include an aperture and an arm. The coupling portion may be long enough to attach to a corresponding aperture in a corresponding coupling portion of a corresponding second sink fin structure. The corresponding second sink fin structure may be more than one fin structure away from the first heat sink fin.
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公开(公告)号：US20190259632A1
公开(公告)日：2019-08-22
申请号：US15899661
申请日：2018-02-20
发明人： Phillip D. ISAACS , Christopher M. MARROQUIN , Daren SIMMONS , Frank L. POMPEO , Jason R. EAGLE , Mark K. HOFFMEYER , Michael J. ELLSWORTH, JR. , Prabjit SINGH , Steve OSTRANDER
IPC分类号： H01L21/48 , H01L23/367 , B21D53/02 , H05K7/20 , H01L23/40
摘要： A fixture to facilitate fabrication of a heat sink includes a base plate to support a lower section of the heat sink, and multiple registration pins extending from the base plate. A platen is provided over a heat transfer element (HTE) of the heat sink, with the platen including slip fit regions to slip fit around respective registration pins, and with the lower section and HTE disposed between the base plate and the platen, and forming a fixture stack segment aligned with an active region of the cold plate. A load plate is provided which includes slip fit regions configured to slip fit around corresponding registration pins with the load plate disposed over the fixture stack segment. The load plate includes a single load pin centrally disposed to apply a load to the fixture stack segment and facilitate bonding the lower section and HTE together.
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公开(公告)号：US20180324984A1
公开(公告)日：2018-11-08
申请号：US15586107
申请日：2017-05-03
CPC分类号： H05K7/20772 , H05K7/20254
摘要： A method and apparatuses are provided for removing a cold plate assembly from an electronics enclosure. The apparatus includes a chassis configured to be placed on the electronics housing in an aligned manner. The chassis includes a plurality of brackets disposed on the chassis. The respective ones of the plurality of brackets are configured to be attached to respective electrical components in the electronics housing. The respective ones of the plurality of brackets are also configured to be disposed on the chassis at locations corresponding to the locations of the respective electrical components within the electronics housing when the chassis is aligned with the electronics housing. The respective ones of the plurality of brackets are also configured to selectively movable between a first orientation and a second orientation. The respective brackets are closer to the respective electrical components in the first orientation than in the second orientation.
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公开(公告)号：US20180124949A1
公开(公告)日：2018-05-03
申请号：US15803945
申请日：2017-11-06
IPC分类号： H05K7/20 , H01L23/473 , H01L23/427
CPC分类号： H05K7/20254 , H01L23/427 , H01L23/473 , H05K7/2049 , H05K7/20509
摘要： A cold plate, an electronic assembly including a cold plate, and a method for forming a cold plate are provided. The cold plate includes an interface plate and an opposing plate that form a plenum. The cold plate includes a plurality of active areas arranged for alignment over respective heat generating portions of an electronic assembly, and non-active areas between the active areas. A cooling fluid flows through the plenum. The plenum, at the non-active areas, has a reduced width and/or reduced height relative to the plenum at the active areas. The reduced width and/or height of the plenum, and exterior dimensions of cold plate, at the non-active areas allow the non-active areas to flex to accommodate surface variations of the electronics assembly. The reduced width and/or height non-active areas can be specifically shaped to fit between physical features of the electronics assembly.
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