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公开(公告)号：US09953501B2
公开(公告)日：2018-04-24
申请号：US15466122
申请日：2017-03-22
IPC分类号： G06K19/077 , G08B13/24 , H01L31/054 , H01L23/544 , H01L23/66 , H01L21/78
CPC分类号： G08B13/244 , G06K19/0704 , G06K19/0707 , G06K19/0716 , G06K19/0717 , G06K19/0723 , G06K19/07749 , G06K19/0775 , G06K19/07775 , H01L21/78 , H01L23/544 , H01L23/66 , H01L31/0547 , H01L2223/54426 , H01L2223/6677
摘要： A method comprises forming a structure, the structure comprising at least one of a wafer, a panel and a roll to roll structure and forming a plurality of integrated circuit chips from the structure. At least a given one of the plurality of integrated circuit chips or a heterogeneous integrated sub-component thereof forms a smart tag comprising a processor, a non-volatile memory, an internal power source, and a transceiver configured for two-way communication with a reader external to the smart tag. The given integrated circuit chip less than 10 cubic millimeters in size.
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公开(公告)号：US11335657B2
公开(公告)日：2022-05-17
申请号：US17023297
申请日：2020-09-16
发明人： Evan Colgan , Timothy J. Chainer , Monty Montague Denneau , Kai Schleupen , Diego Anzola , Mark D. Schultz , Layne A. Berge
IPC分类号： H01L23/00 , H01L25/065 , H01L23/48 , H01L23/544
摘要： A data processing system includes a first wafer comprising a plurality of first chips, and kerf and crack-stop structures around perimeters of the first chips, and a second wafer comprising a plurality second chips, a plurality of interconnect structures through a connection zone between the second chips, and a plurality of thru silicon vias, wherein the first wafer and the second wafer are bonded face-to-face such that the interconnect structures of the second wafer electrically connect adjacent chip sites of the first wafer and where a pitch of the chips on the first and second wafer are equal.
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公开(公告)号：US20220084969A1
公开(公告)日：2022-03-17
申请号：US17023297
申请日：2020-09-16
发明人： Evan Colgan , Timothy J. Chainer , Monty Montague Denneau , Kai Schleupen , Diego Anzola , Mark D. Schultz , Layne A. Berge
IPC分类号： H01L23/00 , H01L25/065 , H01L23/48 , H01L23/544
摘要： A data processing system includes a first wafer comprising a plurality of first chips, and kerf and crack-stop structures around perimeters of the first chips, and a second wafer comprising a plurality second chips, a plurality of interconnect structures through a connection zone between the second chips, and a plurality of thru silicon vias, wherein the first wafer and the second wafer are bonded face-to-face such that the interconnect structures of the second wafer electrically connect adjacent chip sites of the first wafer and where a pitch of the chips on the first and second wafer are equal.
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公开(公告)号：US20170193775A1
公开(公告)日：2017-07-06
申请号：US15466122
申请日：2017-03-22
IPC分类号： G08B13/24 , H01L21/78 , H01L23/66 , H01L31/054 , H01L23/544
CPC分类号： G08B13/244 , G06K19/0704 , G06K19/0707 , G06K19/0716 , G06K19/0717 , G06K19/0723 , G06K19/07749 , G06K19/0775 , G06K19/07775 , H01L21/78 , H01L23/544 , H01L23/66 , H01L31/0547 , H01L2223/54426 , H01L2223/6677
摘要： A smart tag comprises a processor, a non-volatile memory, at least one of an internal power source and an external power source, and a transceiver configured for two-way communication with a reader external to the smart tag. The smart tag is formed as an integrated circuit chip less than 10 cubic millimeters in size to less than 0.000125 cubic millimeters in size. An apparatus comprising the smart tag may further include an antenna connect to the smart tag.
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公开(公告)号：US09684862B2
公开(公告)日：2017-06-20
申请号：US14927013
申请日：2015-10-29
IPC分类号： G06K19/077
CPC分类号： G08B13/244 , G06K19/0704 , G06K19/0707 , G06K19/0716 , G06K19/0717 , G06K19/0723 , G06K19/07749 , G06K19/0775 , G06K19/07775 , H01L21/78 , H01L23/544 , H01L23/66 , H01L31/0547 , H01L2223/54426 , H01L2223/6677
摘要： A smart tag comprises a processor, a non-volatile memory, at least one of an internal power source and an external power source, and a transceiver configured for two-way communication with a reader external to the smart tag. The smart tag is formed as an integrated circuit chip less than 10 cubic millimeters in size to less than 0.000125 cubic millimeters in size. An apparatus comprising the smart tag may further include an antenna connect to the smart tag.
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