公开(公告)号：US20130157458A1

公开(公告)日：2013-06-20

申请号：US13767845

申请日：2013-02-14

申请人： International Business Machines Corporation

发明人： Mukta G. Farooq ,  Emily R. Kinser ,  Ian D. Melville ,  Krystyna Waleria Semkow

IPC分类号： H01L21/02

CPC分类号： H01L21/02697 ,  H01L23/53238 ,  H01L24/03 ,  H01L24/05 ,  H01L24/13 ,  H01L2224/0345 ,  H01L2224/03452 ,  H01L2224/0401 ,  H01L2224/05006 ,  H01L2224/05007 ,  H01L2224/05016 ,  H01L2224/05026 ,  H01L2224/05027 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05157 ,  H01L2224/05187 ,  H01L2224/05562 ,  H01L2224/05572 ,  H01L2224/131 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/15787 ,  H01L2924/04953 ,  H01L2924/01014 ,  H01L2224/05552 ,  H01L2924/00

摘要： Disclosed is a process of making a semiconductor device wherein an insulation layer has a copper plug in contact with the last wiring layer of the device. There may also be a barrier layer separating the copper plug from the insulation layer. There may also be a cap layer over the copper plug to protect it from oxidation. There may also be a dielectric layer over the cap layer.

摘要翻译： 公开了制造半导体器件的方法，其中绝缘层具有与器件的最后布线层接触的铜插塞。 还可以存在将铜塞与绝缘层分离的阻挡层。 在铜塞上方也可能有一个盖层，以防止它被氧化。 在盖层上还可以存在介电层。

公开(公告)号：US08741769B2

公开(公告)日：2014-06-03

申请号：US13767845

申请日：2013-02-14

申请人： International Business Machines Corporation

发明人： Mukta G. Farooq ,  Emily R. Kinser ,  Ian D. Melville ,  Krystyna Waleria Semkow

IPC分类号： H01L21/4763

CPC分类号： H01L21/02697 ,  H01L23/53238 ,  H01L24/03 ,  H01L24/05 ,  H01L24/13 ,  H01L2224/0345 ,  H01L2224/03452 ,  H01L2224/0401 ,  H01L2224/05006 ,  H01L2224/05007 ,  H01L2224/05016 ,  H01L2224/05026 ,  H01L2224/05027 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05157 ,  H01L2224/05187 ,  H01L2224/05562 ,  H01L2224/05572 ,  H01L2224/131 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/15787 ,  H01L2924/04953 ,  H01L2924/01014 ,  H01L2224/05552 ,  H01L2924/00

摘要： Disclosed is a process of making a semiconductor device wherein an insulation layer has a copper plug in contact with the last wiring layer of the device. There may also be a barrier layer separating the copper plug from the insulation layer. There may also be a cap layer over the copper plug to protect it from oxidation. There may also be a dielectric layer over the cap layer.