公开(公告)号：US11043468B2

公开(公告)日：2021-06-22

申请号：US16773368

申请日：2020-01-27

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Charles L. Arvin ,  Clement J. Fortin ,  Christopher D. Muzzy ,  Thomas A. Wassick

IPC: H01L23/00 ,  H01L23/498

Abstract: A method and structure for joining a semiconductor device and a laminate substrate or two laminate substrates where the joint is formed with lead free solders and lead free compositions. The various lead free solders and lead free compositions are chosen so that there is a sufficient difference in liquidus temperatures such that some components may be joined to, or removed from, the laminate substrate without disturbing other components on the laminate substrate.

公开(公告)号：US10950573B2

公开(公告)日：2021-03-16

申请号：US16358658

申请日：2019-03-19

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Charles L. Arvin ,  Clement J. Fortin ,  Christopher D. Muzzy ,  Krishna R. Tunga ,  Thomas Weiss

IPC: H01L23/00 ,  H01L23/532

Abstract: Disclosed are interconnects in which one substrate having a high melting temperature, lead-free solder column is joined to a second substrate having openings filled with a low melting temperature, lead-free solder such that the high melting temperature, lead-free solder column penetrates into the low melting temperature, lead-free solder so as to obtain a short moment arm of solder.

公开(公告)号：US10586782B2

公开(公告)日：2020-03-10

申请号：US15640475

申请日：2017-07-01

Applicant: International Business Machines Corporation

Inventor： Charles L. Arvin ,  Clement J. Fortin ,  Christopher D. Muzzy ,  Brian W. Quinlan ,  Thomas A. Wassick ,  Thomas Weiss

IPC: H01L23/00 ,  H01L23/498

Abstract: A method and structure for joining a semiconductor device and a laminate substrate or two laminate substrates where the joint is formed with lead free solders and lead free compositions. The various lead free solders and lead free compositions are chosen so that there is a sufficient difference in liquidus temperatures such that some components may be joined to, or removed from, the laminate substrate without disturbing other components on the laminate substrate.

公开(公告)号：US20200303339A1

公开(公告)日：2020-09-24

申请号：US16358658

申请日：2019-03-19

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： CHARLES L. ARVIN ,  Clement J. Fortin ,  Christopher D. Muzzy ,  Krishna R. Tunga ,  Thomas Weiss

IPC: H01L23/00 ,  H01L23/532

Abstract: Disclosed are interconnects in which one substrate having a high melting temperature, lead-free solder column is joined to a second substrate having openings filled with a low melting temperature, lead-free solder such that the high melting temperature, lead-free solder column penetrates into the low melting temperature, lead-free solder so as to obtain a short moment arm of solder.

公开(公告)号：US20200294946A1

公开(公告)日：2020-09-17

申请号：US16353411

申请日：2019-03-14

Applicant: International Business Machines Corporation

Inventor： Charles L. Arvin ,  Brian M. Erwin ,  Clement J. Fortin ,  Chris Muzzy

IPC: H01L23/00 ,  H01L21/48 ,  H01L23/498

Abstract: A finned contact of an IC device may be utilized to electrically connect the IC device to external circuitry. The finned contact may be fabricated by forming a base upon the IC device and subsequently forming two or more fins upon the base. Each fin may be formed of the same and/or different material(s) as the base. Each fin may include layer(s) of one or materials. The fins may be located upon the base inset from the sidewall(s) of the base. The fins may be arranged as separated ring portions that are concentric with the base. The fins may drive current into the external circuitry connected thereto. Solder may be drawn towards the center of the base within an inner void that is internal to the fins, thereby limiting the likelihood of solder bridging with a neighboring contact.

公开(公告)号：US10756041B1

公开(公告)日：2020-08-25

申请号：US16353411

申请日：2019-03-14

Applicant: International Business Machines Corporation

Inventor： Charles L. Arvin ,  Brian M. Erwin ,  Clement J. Fortin ,  Chris Muzzy

IPC: H05K3/34 ,  H01L23/00 ,  H01L23/498 ,  H01L21/48

Abstract: A finned contact of an IC device may be utilized to electrically connect the IC device to external circuitry. The finned contact may be fabricated by forming a base upon the IC device and subsequently forming two or more fins upon the base. Each fin may be formed of the same and/or different material(s) as the base. Each fin may include layer(s) of one or materials. The fins may be located upon the base inset from the sidewall(s) of the base. The fins may be arranged as separated ring portions that are concentric with the base. The fins may drive current into the external circuitry connected thereto. Solder may be drawn towards the center of the base within an inner void that is internal to the fins, thereby limiting the likelihood of solder bridging with a neighboring contact.