公开(公告)号：US10784137B2

公开(公告)日：2020-09-22

申请号：US16588082

申请日：2019-09-30

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Damyon L. Corbin ,  Charles F. Musante

IPC: H01L21/673 ,  B65B5/06 ,  B65B7/16 ,  B65B61/20

Abstract: A package assembly for thin wafer shipping using a wafer container and a method of use are disclosed. The package assembly includes a shipping container and a wafer container having a bottom surface and a plurality of straps attached thereto placed within the shipping container. The package assembly further includes upper and lower force distribution plates provided within the shipping container positioned respectively on a top side and bottom side thereof.

公开(公告)号：US10468280B2

公开(公告)日：2019-11-05

申请号：US16023533

申请日：2018-06-29

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Damyon L. Corbin ,  Charles F. Musante

IPC: H01L21/673 ,  B65B5/06 ,  B65B7/16 ,  B65B61/20

Abstract: A package assembly for thin wafer shipping using a wafer container and a method of use are disclosed. The package assembly includes a shipping container and a wafer container having a bottom surface and a plurality of straps attached thereto placed within the shipping container. The package assembly further includes upper and lower force distribution plates provided within the shipping container positioned respectively on a top side and bottom side thereof.

公开(公告)号：US10204877B2

公开(公告)日：2019-02-12

申请号：US15899755

申请日：2018-02-20

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Charles L. Arvin ,  Jeffrey P. Gambino ,  Charles F. Musante ,  Christopher D. Muzzy ,  Wolfgang Sauter

IPC: H01L23/00 ,  C22C21/00

Abstract: A method of manufacturing a bond pad structure may include depositing an aluminum-copper (Al—Cu) layer over a dielectric layer; and depositing an aluminum-chromium (Al—Cr) layer directly over the Al—Cu layer.

公开(公告)号：US09716010B2

公开(公告)日：2017-07-25

申请号：US14077848

申请日：2013-11-12

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Jeffrey P. Gambino ,  Kenneth F. McAvey, Jr. ,  Charles F. Musante ,  Bruce W. Porth ,  Anthony K. Stamper ,  Timothy D. Sullivan

IPC: H01L21/304 ,  H01L21/683

CPC classification number: H01L21/304 ,  H01L21/6835 ,  H01L2221/68327 ,  H01L2221/6834 ,  Y10T428/219

Abstract: A handle wafer which prevents edge cracking during a thinning process and method of using the handle wafer for grinding processes are disclosed. The handle wafer includes a body portion with a bottom surface. A square edge portion is provided about a circumference of the bottom surface.

公开(公告)号：US09607929B2

公开(公告)日：2017-03-28

申请号：US14825778

申请日：2015-08-13

Applicant: International Business Machines Corporation

Inventor： James W. Adkisson ,  Yoba Amoah ,  Jeffrey P. Gambino ,  Christine A. Leggett ,  Max L. Lifson ,  Charles F. Musante ,  Sruthi Samala ,  David C. Thomas

IPC: H01L23/48 ,  H01L23/00 ,  H01L21/768 ,  H01L23/532

CPC classification number: H01L23/481 ,  H01L21/76877 ,  H01L21/76898 ,  H01L23/53223 ,  H01L23/53238 ,  H01L23/53266 ,  H01L23/562 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A method including forming a through-substrate via through a thickness of a substrate, the thickness of the substrate is measured from a front side of the substrate to a back side of the substrate, removing a first portion of the substrate to form an opening in the back side of the substrate such that a second portion of the substrate remains in direct contact surrounding a vertical sidewall of the through-substrate via, and filling the opening with an alternate material having a lower modulus of elasticity than the substrate.

公开(公告)号：US20170032993A1

公开(公告)日：2017-02-02

申请号：US15292613

申请日：2016-10-13

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Damyon L. Corbin ,  Charles F. Musante

IPC: H01L21/673

CPC classification number: H01L21/67396 ,  B65B5/06 ,  B65B7/16 ,  B65B61/20 ,  H01L21/67369 ,  H01L21/67379 ,  H01L21/67386

Abstract: A package assembly for thin wafer shipping using a wafer container and a method of use are disclosed. The package assembly includes a shipping container and a wafer container having a bottom surface and a plurality of straps attached thereto placed within the shipping container. The package assembly further includes upper and lower force distribution plates provided within the shipping container positioned respectively on a top side and bottom side thereof.

公开(公告)号：US20170025295A1

公开(公告)日：2017-01-26

申请号：US15287093

申请日：2016-10-06

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Damyon L. Corbin ,  Charles F. Musante

IPC: H01L21/673 ,  B65B7/16 ,  B65B61/20 ,  B65B5/06

CPC classification number: H01L21/67396 ,  B65B5/06 ,  B65B7/16 ,  B65B61/20 ,  H01L21/67369 ,  H01L21/67379 ,  H01L21/67386

Abstract: A package assembly for thin wafer shipping using a wafer container and a method of use are disclosed. The package assembly includes a shipping container and a wafer container having a bottom surface and a plurality of straps attached thereto placed within the shipping container. The package assembly further includes upper and lower force distribution plates provided within the shipping container positioned respectively on a top side and bottom side thereof.

Abstract translation: 公开了一种用于使用晶片容器的薄晶片运输的封装组件和使用方法。 包装组件包括运送容器和晶片容器，其具有底部表面和附接到其上的多个带状物，放置在运输容器内。 包装组件还包括设置在分配在其顶侧和底侧的运输容器内的上部和下部力分配板。

公开(公告)号：US20150255404A1

公开(公告)日：2015-09-10

申请号：US14195940

申请日：2014-03-04

Applicant: International Business Machines Corporation

Inventor： James W. Adkisson ,  Yoba Amoah ,  Jeffrey P. Gambino ,  Christine A. Leggett ,  Max L. Lifson ,  Charles F. Musante ,  Sruthi Samala ,  David C. Thomas

IPC: H01L23/00 ,  H01L23/48 ,  H01L21/768

CPC classification number: H01L23/481 ,  H01L21/76877 ,  H01L21/76898 ,  H01L23/53223 ,  H01L23/53238 ,  H01L23/53266 ,  H01L23/562 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A method including forming a through-substrate via through a thickness of a substrate, the thickness of the substrate is measured from a front side of the substrate to a back side of the substrate, removing a first portion of the substrate to form an opening in the back side of the substrate such that a second portion of the substrate remains in direct contact surrounding a vertical sidewall of the through-substrate via, and filling the opening with an alternate material having a lower modulus of elasticity than the substrate.

Abstract translation: 一种包括通过基板的厚度形成贯通基板的方法，从基板的前侧到基板的背面测量基板的厚度，去除基板的第一部分以形成开口 衬底的背面，使得衬底的第二部分保持与贯穿衬底通孔的垂直侧壁直接接触，并用与衬底相比具有较低弹性模量的替代材料填充该开口。

公开(公告)号：US09543175B2

公开(公告)日：2017-01-10

申请号：US14036999

申请日：2013-09-25

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Damyon L. Corbin ,  Charles F. Musante

IPC: H01L21/673

CPC classification number: H01L21/67396 ,  B65B5/06 ,  B65B7/16 ,  B65B61/20 ,  H01L21/67369 ,  H01L21/67379 ,  H01L21/67386

Abstract: A package assembly for thin wafer shipping using a wafer container and a method of use are disclosed. The package assembly includes a shipping container and a wafer container having a bottom surface and a plurality of straps attached thereto placed within the shipping container. The package assembly further includes upper and lower force distribution plates provided within the shipping container positioned respectively on a top side and bottom side thereof.

Abstract translation: 公开了一种用于使用晶片容器的薄晶片运输的封装组件和使用方法。 包装组件包括运送容器和晶片容器，其具有底部表面和附接到其上的多个带状物，放置在运输容器内。 包装组件还包括设置在分配在其顶侧和底侧的运输容器内的上部和下部力分配板。

公开(公告)号：US20150044619A1

公开(公告)日：2015-02-12

申请号：US13961208

申请日：2013-08-07

Applicant: International Business Machines Corporation

Inventor： John C. Hall ,  Jeffrey C. Maling ,  Charles F. Musante

IPC: H01L21/673 ,  B65D21/02

CPC classification number: H01L21/67346

Abstract: A substrate carrier, including: a baffle having a continuous perimeter sidewall surrounding an enclosed region; and one or more standoffs attached to an inside surface of the perimeter sidewall, the one or more standoffs extending into the enclosed region and below a bottom edge of the perimeter sidewall, the one or more standoffs each having a lip located between an upper edge of the baffle and the lower edge of the baffle. Also, a method of annealing substrates using the substrate carrier.

Abstract translation: 一种衬底载体，包括：挡板，其具有围绕封闭区域的连续周边侧壁; 以及附接到周边侧壁的内表面的一个或多个支座，所述一个或多个支座延伸到所述封闭区域中并在所述周边侧壁的底部边缘下方，所述一个或多个支座各自具有位于所述周边侧壁的上边缘之间的唇缘 挡板和挡板的下边缘。 另外，使用衬底载体退火衬底的方法。