公开(公告)号：US20150348876A1

公开(公告)日：2015-12-03

申请号：US14825778

申请日：2015-08-13

Applicant: International Business Machines Corporation

Inventor： James W. Adkisson ,  Yoba Amoah ,  Jeffrey P. Gambino ,  Christine A. Leggett ,  Max L. Lifson ,  Charles F. Musante ,  Sruthi Samala ,  David C. Thomas

IPC: H01L23/48 ,  H01L23/00 ,  H01L23/532

CPC classification number: H01L23/481 ,  H01L21/76877 ,  H01L21/76898 ,  H01L23/53223 ,  H01L23/53238 ,  H01L23/53266 ,  H01L23/562 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A method including forming a through-substrate via through a thickness of a substrate, the thickness of the substrate is measured from a front side of the substrate to a back side of the substrate, removing a first portion of the substrate to form an opening in the back side of the substrate such that a second portion of the substrate remains in direct contact surrounding a vertical sidewall of the through-substrate via, and filling the opening with an alternate material having a lower modulus of elasticity than the substrate.

Abstract translation: 一种包括通过基板的厚度形成贯通基板的方法，从基板的前侧到基板的背面测量基板的厚度，去除基板的第一部分以形成开口 衬底的背面，使得衬底的第二部分保持与贯穿衬底通孔的垂直侧壁直接接触，并用与衬底相比具有较低弹性模量的替代材料填充该开口。

公开(公告)号：US09312205B2

公开(公告)日：2016-04-12

申请号：US14195940

申请日：2014-03-04

Applicant: International Business Machines Corporation

Inventor： James W. Adkisson ,  Yoba Amoah ,  Jeffrey P. Gambino ,  Christine A. Leggett ,  Max L. Lifson ,  Charles F. Musante ,  Sruthi Samala ,  David C. Thomas

IPC: H01L23/48 ,  H01L23/00 ,  H01L21/768 ,  H01L23/532

CPC classification number: H01L23/481 ,  H01L21/76877 ,  H01L21/76898 ,  H01L23/53223 ,  H01L23/53238 ,  H01L23/53266 ,  H01L23/562 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A method including forming a through-substrate via through a thickness of a substrate, the thickness of the substrate is measured from a front side of the substrate to a back side of the substrate, removing a first portion of the substrate to form an opening in the back side of the substrate such that a second portion of the substrate remains in direct contact surrounding a vertical sidewall of the through-substrate via, and filling the opening with an alternate material having a lower modulus of elasticity than the substrate.

Abstract translation: 一种包括通过基板的厚度形成贯通基板的方法，从基板的前侧到基板的背面测量基板的厚度，去除基板的第一部分以形成开口 衬底的背面，使得衬底的第二部分保持与贯穿衬底通孔的垂直侧壁直接接触，并用与衬底相比具有较低弹性模量的替代材料填充该开口。

公开(公告)号：US09607929B2

公开(公告)日：2017-03-28

申请号：US14825778

申请日：2015-08-13

Applicant: International Business Machines Corporation

Inventor： James W. Adkisson ,  Yoba Amoah ,  Jeffrey P. Gambino ,  Christine A. Leggett ,  Max L. Lifson ,  Charles F. Musante ,  Sruthi Samala ,  David C. Thomas

IPC: H01L23/48 ,  H01L23/00 ,  H01L21/768 ,  H01L23/532

CPC classification number: H01L23/481 ,  H01L21/76877 ,  H01L21/76898 ,  H01L23/53223 ,  H01L23/53238 ,  H01L23/53266 ,  H01L23/562 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A method including forming a through-substrate via through a thickness of a substrate, the thickness of the substrate is measured from a front side of the substrate to a back side of the substrate, removing a first portion of the substrate to form an opening in the back side of the substrate such that a second portion of the substrate remains in direct contact surrounding a vertical sidewall of the through-substrate via, and filling the opening with an alternate material having a lower modulus of elasticity than the substrate.

公开(公告)号：US20150255404A1

公开(公告)日：2015-09-10

申请号：US14195940

申请日：2014-03-04

Applicant: International Business Machines Corporation

Inventor： James W. Adkisson ,  Yoba Amoah ,  Jeffrey P. Gambino ,  Christine A. Leggett ,  Max L. Lifson ,  Charles F. Musante ,  Sruthi Samala ,  David C. Thomas

IPC: H01L23/00 ,  H01L23/48 ,  H01L21/768

CPC classification number: H01L23/481 ,  H01L21/76877 ,  H01L21/76898 ,  H01L23/53223 ,  H01L23/53238 ,  H01L23/53266 ,  H01L23/562 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A method including forming a through-substrate via through a thickness of a substrate, the thickness of the substrate is measured from a front side of the substrate to a back side of the substrate, removing a first portion of the substrate to form an opening in the back side of the substrate such that a second portion of the substrate remains in direct contact surrounding a vertical sidewall of the through-substrate via, and filling the opening with an alternate material having a lower modulus of elasticity than the substrate.

Abstract translation: 一种包括通过基板的厚度形成贯通基板的方法，从基板的前侧到基板的背面测量基板的厚度，去除基板的第一部分以形成开口 衬底的背面，使得衬底的第二部分保持与贯穿衬底通孔的垂直侧壁直接接触，并用与衬底相比具有较低弹性模量的替代材料填充该开口。