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公开(公告)号：US11201420B2
公开(公告)日：2021-12-14
申请号：US16976380
申请日：2018-06-22
申请人： Intel Corporation
发明人： Jun Lu , Wei Liao , Guangying Zhang , Liguang Du , Guoliang Ying , Fangbo Zhu , Song Kok Hang , Juan A. Orozco Ramirez , Wesley B. Morgan
IPC分类号： H01R12/70 , G06F1/18 , H01R13/627
摘要： Herein described are apparatuses and systems for facilitating alignment of computer component connectors. A package protector may include a body to at least partially surround an integrated circuit package of a circuit card when the package protector is mounted to the circuit card. The package protector may further include a guide pin component that extends from a side of the body, wherein the guide pin component is to be located adjacent to a header of the circuit card when the package protector is mounted to the circuit card, wherein a connector uses the guide pin component to align with the header via a guide pin.
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公开(公告)号：US20160020538A1
公开(公告)日：2016-01-21
申请号：US14333828
申请日：2014-07-17
申请人： Intel Corporation
CPC分类号： H05K7/142 , H05K1/0215 , H05K9/0039
摘要： Embodiments of the present disclosure are directed toward techniques and configurations for a printed circuit board (PCB) assembly mountable to a computer chassis. In one instance, the PCB assembly may comprise a PCB having two through holes and a PCB mounting device that may include a U-shaped component having a non-linear portion and two rods extended from the non-linear portion and a housing having a base with protrusions extending from ends of the base. The rods may be extended through the protrusions such that the base and the non-linear portion of the U-shaped component form an opening to engage a mounting element of the chassis. The extended portions of the rods may be inserted into and soldered to the through holes of the PCB, to electrically couple the PCB to the PCB mounting device and the chassis to ground the PCB. Other embodiments may be described and/or claimed.
摘要翻译： 本公开的实施例涉及可安装到计算机机箱的印刷电路板（PCB）组件的技术和配置。 在一个实例中，PCB组件可以包括具有两个通孔的PCB和PCB安装装置，PCB安装装置可以包括具有非线性部分的U形部件和从非线性部分延伸的两个杆和具有基部的壳体 具有从基部的端部延伸的突起。 杆可以延伸穿过突起，使得U形部件的基部和非直线部分形成开口以接合底盘的安装元件。 杆的延伸部分可以插入并焊接到PCB的通孔，以将PCB电连接到PCB安装装置和底盘以将PCB接地。 可以描述和/或要求保护其他实施例。
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公开(公告)号：US20240027697A1
公开(公告)日：2024-01-25
申请号：US17871558
申请日：2022-07-22
申请人： Intel Corporation
发明人： Wesley B. Morgan , Mohanraj Prabhugoud , David Shia , Eric J. M. Moret , Pooya Tadayon , Tarek A. Ibrahim
IPC分类号： G02B6/38
CPC分类号： G02B6/3897 , G02B6/3885 , G02B6/3893
摘要： Optical connectors with alignment features, and methods of forming the same, are disclosed herein. In one example, an optical ferrule includes holes to couple a fiber array to the optical ferrule, a mating protrusion to mate with an optical receptacle, and alignment features to align the fiber array with optical waveguides in the optical receptacle. The optical receptacle includes the optical waveguides, a mating cavity to mate with the mating protrusion on the optical ferrule, and alignment features to mate with the alignment features on the optical ferrule.
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公开(公告)号：US20210242108A1
公开(公告)日：2021-08-05
申请号：US17213347
申请日：2021-03-26
申请人： Intel Corporation
IPC分类号： H01L23/433
摘要： Techniques for liquid cooling systems are disclosed. In one embodiment, jet holes in a water block create jets of liquid coolant to be applied to a surface to be cooled, such as a surface of an integrated circuit component. The jets of liquid coolant may disrupt surface boundary layers through turbulence and/or microcavitation, increasing the cooling effect of the liquid coolant. In the illustrative embodiment, negative pressure is applied to a coolant loop of the liquid coolant, which provides several advantages such as being resistant to leaks. In another embodiments, jet holes in a water block create jets of liquid coolant that are directed toward other jets of liquid coolant, which also increases the cooling effect of the liquid coolant.
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公开(公告)号：US09832901B2
公开(公告)日：2017-11-28
申请号：US14333828
申请日：2014-07-17
申请人： Intel Corporation
CPC分类号： H05K7/142 , H05K1/0215 , H05K9/0039
摘要： Embodiments of the present disclosure are directed toward techniques and configurations for a printed circuit board (PCB) assembly mountable to a computer chassis. In one instance, the PCB assembly may comprise a PCB having two through holes and a PCB mounting device that may include a U-shaped component having a non-linear portion and two rods extended from the non-linear portion and a housing having a base with protrusions extending from ends of the base. The rods may be extended through the protrusions such that the base and the non-linear portion of the U-shaped component form an opening to engage a mounting element of the chassis. The extended portions of the rods may be inserted into and soldered to the through holes of the PCB, to electrically couple the PCB to the PCB mounting device and the chassis to ground the PCB. Other embodiments may be described and/or claimed.
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公开(公告)号：US20240094476A1
公开(公告)日：2024-03-21
申请号：US17949417
申请日：2022-09-21
申请人： Intel Corporation
IPC分类号： G02B6/38
CPC分类号： G02B6/3871 , G02B6/3873 , G02B6/3887
摘要： Technologies for pluggable optical connectors are disclosed. In the illustrative embodiment, an optical plug includes a ferrule with one or more optical fibers. The optical plug also includes a ferrule holder that holds the ferrule and a housing that encloses the ferrule and ferrule holder. The ferrule holder can move relative to the house, and the ferrule can move relative to the ferrule holder and the housing. As the optical plug is plugged into a socket, alignment features in the housing coarsely align the ferrule. Intermediate alignment features in the ferrule holder then engage, aligning the ferrule more precisely. As the optical plug is fully plugged in, fine alignment features in the ferrule engage, precisely aligning the ferrule and the optical fibers with the optical socket.
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公开(公告)号：US20230417987A1
公开(公告)日：2023-12-28
申请号：US17849557
申请日：2022-06-24
申请人： Intel Corporation
发明人： Wesley B. Morgan , Stephen A. Smith , Stephanie J. Arouh , Fan Fan , Jianyong Mo , Henry V. Wladkowski
CPC分类号： G02B6/1225 , G02B6/3885 , G02B6/3853 , G02B6/3636 , G02B6/12004 , G02B2006/12102
摘要： Technologies for expanded beam optical connectors are disclosed. In an illustrative embodiment, a lens array attached to a substrate includes several lenses aligned to optical fibers positioned in grooves in the substrate. The lens array also includes optical fiducials, such as opaque optical fiducials. Auxiliary optical fibers are aligned to the optical fiducials. Light can be sent through the auxiliary optical fibers and onto the optical fiducials, and a pattern of light can be detected after the optical fiducials. The pattern of light can be used to determine a position and/or orientation error of the lens array. The error can be used as feedback in several possible ways, such as repositioning the lens array, positioning a guide pin to match the position and direction of beams through the lenses, or adjusting a parameter of a manufacturing process.
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8.发明公开公开(公告)号：US20230204878A1
公开(公告)日：2023-06-29
申请号：US17560847
申请日：2021-12-23
申请人： Intel Corporation
发明人： Wesley B. Morgan , Sufi R. Ahmed , Vineeth Abraham , Sivakumar Yagnamurthy , Xiaoqian Li , Srikant Nekkanty
IPC分类号： G02B6/42
CPC分类号： G02B6/4212 , G02B6/4239 , G02B6/4243
摘要： A receptacle of a photonics package, a receptacle assembly including the receptacle, the photonics package, and a method of making the receptacle assembly. The receptacle assembly comprises: a photonics integrated circuit (PIC) including waveguides thereon; a die side lens assembly; and a rigid receptacle body including: a plug portion to receive an optical plug that includes a plug side lens assembly; a lens portion supporting the die side lens assembly and configured such that the die side lens assembly and the plug side lens assembly are aligned to one another when the optical plug is received in the plug portion; and a PIC portion bonded to the PIC such that the waveguides of the PIC are aligned to: corresponding lenses of the die side lens assembly; and corresponding lenses of the plug side lens assembly when the optical plug is received in the plug portion.
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公开(公告)号：US20230095039A1
公开(公告)日：2023-03-30
申请号：US17478337
申请日：2021-09-17
申请人： Intel Corporation
发明人： Srikant Nekkanty , Pooya Tadayon , Xavier F. Brun , Wesley B. Morgan , John M. Heck , Joseph F. Walczyk , Paul J. Diglio
IPC分类号： G02B6/26
摘要： Technologies for optical coupling to photonic integrated circuit (PIC) dies are disclosed. In the illustrative embodiment, a lens assembly with one or more lenses is positioned to collimate light coming out of one or more waveguides in the PIC die. Part of the illustrative lens assembly extends above a top surface of the PIC die and is in contact with the PIC die. The top surface of the PIC die establishes the vertical positioning of the lens assembly. In the illustrative embodiment, the lens assembly is positioned at least partially inside a cavity defined within the PIC die, which allows the lens assembly to be integrated at the wafer level, before singulation into individual dies.
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