发明申请
- 专利标题: PRINTED CIRCUIT BOARD MOUNTING AND GROUNDING DEVICE
- 专利标题(中): 印刷电路板安装和接地装置
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申请号: US14333828申请日: 2014-07-17
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公开(公告)号: US20160020538A1公开(公告)日: 2016-01-21
- 发明人: Ralph W. Jensen , Wesley B. Morgan , James T. Goulding
- 申请人: Intel Corporation
- 主分类号: H01R12/71
- IPC分类号: H01R12/71 ; H01R4/64
摘要:
Embodiments of the present disclosure are directed toward techniques and configurations for a printed circuit board (PCB) assembly mountable to a computer chassis. In one instance, the PCB assembly may comprise a PCB having two through holes and a PCB mounting device that may include a U-shaped component having a non-linear portion and two rods extended from the non-linear portion and a housing having a base with protrusions extending from ends of the base. The rods may be extended through the protrusions such that the base and the non-linear portion of the U-shaped component form an opening to engage a mounting element of the chassis. The extended portions of the rods may be inserted into and soldered to the through holes of the PCB, to electrically couple the PCB to the PCB mounting device and the chassis to ground the PCB. Other embodiments may be described and/or claimed.
公开/授权文献
- US09832901B2 Printed circuit board mounting and grounding device 公开/授权日:2017-11-28
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