公开(公告)号：US09711443B2

公开(公告)日：2017-07-18

申请号：US14941571

申请日：2015-11-14

Applicant: Intel Corporation

Inventor： Ankur Agrawal ,  Srinivas S. Moola ,  Sujit Sharan ,  Vijay Govindarajan

IPC: H01L23/498 ,  H01L23/00 ,  H01L21/48 ,  H01L23/02

CPC classification number: H01L23/49838 ,  H01L21/4846 ,  H01L23/02 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49866 ,  H01L23/544 ,  H01L23/564 ,  H01L24/16 ,  H01L24/81 ,  H01L2223/54426 ,  H01L2223/54473 ,  H01L2224/0401 ,  H01L2224/10135 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16237 ,  H01L2224/8113 ,  H01L2224/81132 ,  H01L2224/81141 ,  H01L2224/81143 ,  H01L2224/81191 ,  H01L2924/01028 ,  H01L2924/15311 ,  H01L2924/00014 ,  H01L2924/014

Abstract: Incorporating at least one magnetic alignment structure on a microelectronic device and incorporating at least one alignment coil within a microelectronic substrate, wherein the alignment coil may be powered to form a magnetic field to attract the magnetic alignment structure, thereby aligning the microelectronic device to the microelectronic substrate. After alignment, the microelectronic device may be electrically attached to the substrate. Embodiments may include additionally incorporating an alignment detection coil within the microelectronic substrate, wherein the alignment detection coil may be powered to form a magnetic field to detect variations in the magnetic field generated by the alignment coil in order verify the alignment of the microelectronic device to the microelectronic substrate.

公开(公告)号：US20170141021A1

公开(公告)日：2017-05-18

申请号：US14941571

申请日：2015-11-14

Applicant: Intel Corporation

Inventor： Ankur Agrawal ,  Srinivas Moola ,  Sujit Sharan ,  Vijay Govindarajan

IPC: H01L23/498 ,  H01L21/48 ,  H01L23/02 ,  H01L23/00

CPC classification number: H01L23/49838 ,  H01L21/4846 ,  H01L23/02 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49866 ,  H01L23/544 ,  H01L23/564 ,  H01L24/16 ,  H01L24/81 ,  H01L2223/54426 ,  H01L2223/54473 ,  H01L2224/0401 ,  H01L2224/10135 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16237 ,  H01L2224/8113 ,  H01L2224/81132 ,  H01L2224/81141 ,  H01L2224/81143 ,  H01L2224/81191 ,  H01L2924/01028 ,  H01L2924/15311 ,  H01L2924/00014 ,  H01L2924/014

Abstract: Incorporating at least one magnetic alignment structure on a microelectronic device and incorporating at least one alignment coil within a microelectronic substrate, wherein the alignment coil may be powered to form a magnetic field to attract the magnetic alignment structure, thereby aligning the microelectronic device to the microelectronic substrate. After alignment, the microelectronic device may be electrically attached to the substrate. Embodiments may include additionally incorporating an alignment detection coil within the microelectronic substrate, wherein the alignment detection coil may be powered to form a magnetic field to detect variations in the magnetic field generated by the alignment coil in order verify the alignment of the microelectronic device to the microelectronic substrate.

公开(公告)号：US10002824B2

公开(公告)日：2018-06-19

申请号：US15619463

申请日：2017-06-10

Applicant: INTEL CORPORATION

Inventor： Ankur Agrawal ,  Srinivas S. Moola ,  Sujit Sharan ,  Vijay Govindarajan

IPC: H01L21/48 ,  H01L23/498 ,  H01L23/00 ,  H01L23/02

CPC classification number: H01L23/49838 ,  H01L21/4846 ,  H01L23/02 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49866 ,  H01L23/544 ,  H01L23/564 ,  H01L24/16 ,  H01L24/81 ,  H01L2223/54426 ,  H01L2223/54473 ,  H01L2224/0401 ,  H01L2224/10135 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16237 ,  H01L2224/8113 ,  H01L2224/81132 ,  H01L2224/81141 ,  H01L2224/81143 ,  H01L2224/81191 ,  H01L2924/01028 ,  H01L2924/15311 ,  H01L2924/00014 ,  H01L2924/014

Abstract: Incorporating at least one magnetic alignment structure on a microelectronic device and incorporating at least one alignment coil within a microelectronic substrate, wherein the alignment coil may be powered to form a magnetic field to attract the magnetic alignment structure, thereby aligning the microelectronic device to the microelectronic substrate. After alignment, the microelectronic device may be electrically attached to the substrate. Embodiments may include additionally incorporating an alignment detection coil within the microelectronic substrate, wherein the alignment detection coil may be powered to form a magnetic field to detect variations in the magnetic field generated by the alignment coil in order verify the alignment of the microelectronic device to the microelectronic substrate.

公开(公告)号：US20170278783A1

公开(公告)日：2017-09-28

申请号：US15619463

申请日：2017-06-10

Applicant: INTEL CORPORATION

Inventor： Ankur Agrawal ,  Srinivas S. Moola ,  Sujit Sharan ,  Vijay Govindarajan

IPC: H01L23/498 ,  H01L23/02 ,  H01L21/48 ,  H01L23/00

CPC classification number: H01L23/49838 ,  H01L21/4846 ,  H01L23/02 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49866 ,  H01L23/544 ,  H01L23/564 ,  H01L24/16 ,  H01L24/81 ,  H01L2223/54426 ,  H01L2223/54473 ,  H01L2224/0401 ,  H01L2224/10135 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16237 ,  H01L2224/8113 ,  H01L2224/81132 ,  H01L2224/81141 ,  H01L2224/81143 ,  H01L2224/81191 ,  H01L2924/01028 ,  H01L2924/15311 ,  H01L2924/00014 ,  H01L2924/014

Abstract: Incorporating at least one magnetic alignment structure on a microelectronic device and incorporating at least one alignment coil within a microelectronic substrate, wherein the alignment coil may be powered to form a magnetic field to attract the magnetic alignment structure, thereby aligning the microelectronic device to the microelectronic substrate. After alignment, the microelectronic device may be electrically attached to the substrate. Embodiments may include additionally incorporating an alignment detection coil within the microelectronic substrate, wherein the alignment detection coil may be powered to form a magnetic field to detect variations in the magnetic field generated by the alignment coil in order verify the alignment of the microelectronic device to the microelectronic substrate.