公开(公告)号：US20190104610A1

公开(公告)日：2019-04-04

申请号：US15720488

申请日：2017-09-29

Applicant: Intel Corporation

Inventor： Robert Nickerson ,  Nitin Deshpande ,  Omkar Karhade ,  Thomas De Bonis

IPC: H05K1/02 ,  H05K1/14 ,  H05K3/00

Abstract: Methods/structures of joining package structures are described. Those methods/structures may include a first substrate comprising a first die, wherein an underfill material is disposed on a first surface of the first substrate adjacent the first die; and a second substrate disposed on the first substrate, wherein the second substrate comprises at least one opening disposed over the first die, wherein the at least one opening is at least partially filled with the underfill material.