公开(公告)号：US20220404474A1

公开(公告)日：2022-12-22

申请号：US17558201

申请日：2021-12-21

申请人： Intel Corporation

发明人： Eleanor Patricia Paras Rabadam ,  Guiyun Bai ,  Israel Petronius ,  Sushrutha Gujjula ,  Ronald L. Spreitzer ,  Kenneth Brown ,  Konstantin Matyuch ,  Boping Xie ,  Stephen Keele ,  Qifeng Wu ,  Ankur Agrawal ,  Jonathan Doylend ,  Sanjeev Gupta ,  Sam Khalili ,  Daniel Grodensky ,  Nan Kong Ng ,  Ron Friedman ,  Gal Dvoretzki

IPC分类号： G01S7/481 ,  G01S17/931 ,  G02B6/42

摘要： Disclosed herein are light detection and ranging (LIDAR) systems and methods for manufacturing the same. The LIDAR systems may include microelectronics packages that may include a chassis, an insert, a photonic integrated circuit (PIC), and a lid. The chassis may define an opening. The insert is sized to be received in the opening. The insert is made of a thermally conductive material. The PIC is attached to the insert. The lid is connected to the chassis and defines a cavity that encases the PIC. Both the insert and the lid form thermally conductive pathways away from the PIC.

公开(公告)号：US20220397726A1

公开(公告)日：2022-12-15

申请号：US17344213

申请日：2021-06-10

申请人： Intel Corporation

发明人： Omkar Karhade ,  Tolga Acikalin ,  Sushrutha Gujjula ,  Kelly Lofgreen ,  Ravindranath Mahajan ,  Chia-pin Chiu

IPC分类号： G02B6/42 ,  F21V8/00

摘要： An electronic assembly, such as an integrated circuit package, may be formed comprising a package substrate and a photonic integrated circuit device attached thereto, wherein the package substrate includes a heat dissipation structure disposed therein. A back surface of the photonic integrated circuit device may thermally coupled to the heat dissipation structure within the package substrate for the removal of heat from the photonic integrated circuit device, which allows for access to an active surface of the photonic integrated circuit device for the attachment of fiber optic cables and eliminates the need for a heat dissipation device to be thermally attached to the active surface of the photonic integrated circuit device.

公开(公告)号：US11776821B2

公开(公告)日：2023-10-03

申请号：US17669288

申请日：2022-02-10

申请人： Intel Corporation

发明人： Ziyin Lin ,  Vipul Mehta ,  Edvin Cetegen ,  Yuying Wei ,  Sushrutha Gujjula ,  Nisha Ananthakrishnan ,  Shan Zhong

IPC分类号： H01L21/56 ,  H01L21/67 ,  H01L23/00 ,  H01L23/31 ,  H01L23/13

CPC分类号： H01L21/563 ,  H01L21/67126 ,  H01L23/13 ,  H01L23/3157 ,  H01L23/564 ,  H05K2201/09045

摘要： A substrate protrusion is described. The substrate protrusion includes a top portion that extends in a first direction toward a gap between the first die and the second die and in a second direction parallel to the gap between the first die and the second die. The substrate protrusion also includes a base portion that is coupled to a substrate that extends underneath the first die and the second die. An encapsulant is over the protrusion of the substrate, the encapsulant extending beneath the first die, and the encapsulant extending beneath the second die.

公开(公告)号：US11282717B2

公开(公告)日：2022-03-22

申请号：US15942109

申请日：2018-03-30

申请人： Intel Corporation

发明人： Ziyin Lin ,  Vipul Mehta ,  Edvin Cetegen ,  Yuying Wei ,  Sushrutha Gujjula ,  Nisha Ananthakrishnan ,  Shan Zhong

IPC分类号： H01L21/56 ,  H01L21/67 ,  H01L23/13 ,  H01L23/31 ,  H01L23/00

摘要： A substrate protrusion is described. The substrate protrusion includes a top portion that extends in a first direction toward a gap between the first die and the second die and in a second direction parallel to the gap between the first die and the second die. The substrate protrusion also includes a base portion that is coupled to a substrate that extends underneath the first die and the second die. The substrate protrusion can enable void-free underfill.