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    OPTICAL TRANSCEIVER INTEGRATED CIRCUIT
    2.
    发明申请
    OPTICAL TRANSCEIVER INTEGRATED CIRCUIT 有权

    公开(公告)号：US20210058159A1

    公开(公告)日：2021-02-25

    申请号：US17075372

    申请日：2020-10-20

    Applicant: Intel Corporation

    Inventor： Alexander Krichevsky ,  Boping Xie

    IPC: H04B10/40 ,  H04B10/079 ,  H04B10/516

    Abstract: Embodiments of the present disclosure are directed to an optical transceiver within a single device. The optical transceiver incorporates an optical isolator, thus eliminating the need for an external isolator unit. In embodiments, transmitter channels and receiver channels share a single lens array and incorporate a compensator block to equalize the transmitter and receiver optical signals in the transceiver. Other embodiments may be described and/or claimed.

    Photonic package with a bridge between a photonic die and an optical coupling structure
    3.
    发明授权
    Photonic package with a bridge between a photonic die and an optical coupling structure 有权

    公开(公告)号：US10598875B2

    公开(公告)日：2020-03-24

    申请号：US16220355

    申请日：2018-12-14

    Applicant: Intel Corporation

    Inventor： Boping Xie

    IPC: G02B6/42 ,  H01L33/54 ,  G02B6/43 ,  G02B6/38 ,  H01L25/16

    Abstract: Disclosed herein are photonic package assemblies, packages, and devices that include photonic dies and optical coupling structures aligned with photonic dies to enable exchange of electromagnetic signals. In one aspect, a photonic package assembly includes a photonic integrated circuit (PIC) die having one or more PICs, and an optical coupling structure (OCS) positioned adjacent to the PIC die such that electromagnetic signals may be exchanged between at least one of the one or more PICs and the OCS. The assembly further includes a structure that forms a bridge, and, thereby, provides mechanical coupling, between the OCS and the PIC die. Providing a bridge structure that directly attaches an OCS to a PIC die may improve achieving and maintaining the desired alignment between the OCS and the PIC die, which may lead to an improved coupling performance over the lifetime of products.

    TECHNOLOGIES FOR COUPLING FROM PHOTONIC INTEGRATED CIRCUITS WITH AN OPTICAL ISOLATOR
    4.
    发明公开
    TECHNOLOGIES FOR COUPLING FROM PHOTONIC INTEGRATED CIRCUITS WITH AN OPTICAL ISOLATOR 审中-公开

    公开(公告)号：US20230204876A1

    公开(公告)日：2023-06-29

    申请号：US17561286

    申请日：2021-12-23

    Applicant: Intel Corporation

    Inventor： Alexander Krichevsky ,  Boping Xie

    IPC: G02B6/42

    CPC classification number: G02B6/4207 ,  G02B6/4214

    Abstract: Technologies for coupling to and from a photonic integrated circuit (PIC) with an optical isolator are disclosed. In one embodiment, light beams from waveguides on a PIC die are reflected towards flat mirrors on the bottom surface of the PIC die. The flat mirrors reflect the light towards curved mirrors defined in a top surface of the PIC die, which collimate the beam and direct the collimated beams out the bottom surface of the PIC die. An optical isolator below the PIC die can allow the beams to pass while blocking beams in the opposite direction.

    Optical receiver package with backside lens-integrated photodetector die
    5.
    发明授权
    Optical receiver package with backside lens-integrated photodetector die 有权

    公开(公告)号：US11251228B2

    公开(公告)日：2022-02-15

    申请号：US16225130

    申请日：2018-12-19

    Applicant: Intel Corporation

    Inventor： Boping Xie ,  Ansheng Liu ,  Olufemi Isiade Dosunmu ,  Alexander Krichevsky ,  Kelly Christopher Magruder ,  Harel Frish

    IPC: H01L27/30 ,  G02B6/42 ,  H05K1/02 ,  G02B27/09 ,  G02B7/04

    Abstract: Optical receiver packages and device assemblies that include photodetector (PD) chips having focus lenses monolithically integrated on PD die backsides are disclosed. An example receiver package includes a support structure, a PD die, and an optical input device. The PD die includes a PD, integrated proximate to a first face of the PD die, and further includes a lens, integrated on, or proximate to, an opposite second face. The first face of the PD die faces the support structure, while the second face (“backside”) faces the optical input device. The optical receiver architectures described herein may provide an improvement for the optical alignment tolerance issues, especially for high-speed operation in which the active aperture of the PD may have to be very small. Furthermore, architectures described herein advantageously enable integrating a focus lens in a PD die that may be coupled to the support structure in a flip-chip arrangement.

    OPTICAL RECEIVER PACKAGE WITH BACKSIDE LENS-INTEGRATED PHOTODETECTOR DIE
    7.
    发明申请
    OPTICAL RECEIVER PACKAGE WITH BACKSIDE LENS-INTEGRATED PHOTODETECTOR DIE 审中-公开

    公开(公告)号：US20190123109A1

    公开(公告)日：2019-04-25

    申请号：US16225130

    申请日：2018-12-19

    Applicant: Intel Corporation

    Inventor： Boping Xie ,  Ansheng Liu ,  Olufemi Isiade Dosunmu ,  Alexander Krichevsky ,  Kelly Christopher Magruder ,  Harel Frish

    IPC: H01L27/30 ,  G02B6/42 ,  G02B27/09 ,  G02B7/04 ,  H05K1/02

    Abstract: Optical receiver packages and device assemblies that include photodetector (PD) chips having focus lenses monolithically integrated on PD die backsides are disclosed. An example receiver package includes a support structure, a PD die, and an optical input device. The PD die includes a PD, integrated proximate to a first face of the PD die, and further includes a lens, integrated on, or proximate to, an opposite second face. The first face of the PD die faces the support structure, while the second face (“backside”) faces the optical input device. The optical receiver architectures described herein may provide an improvement for the optical alignment tolerance issues, especially for high-speed operation in which the active aperture of the PD may have to be very small. Furthermore, architectures described herein advantageously enable integrating a focus lens in a PD die that may be coupled to the support structure in a flip-chip arrangement.

    Optical transceiver integrated circuit
    9.
    发明授权
    Optical transceiver integrated circuit 有权

    公开(公告)号：US12052058B2

    公开(公告)日：2024-07-30

    申请号：US17075372

    申请日：2020-10-20

    Applicant: Intel Corporation

    Inventor： Alexander Krichevsky ,  Boping Xie

    IPC: H04B10/40 ,  H04B10/079 ,  H04B10/516

    CPC classification number: H04B10/40 ,  H04B10/0795 ,  H04B10/5161

    Abstract: Embodiments of the present disclosure are directed to an optical transceiver within a single device. The optical transceiver incorporates an optical isolator, thus eliminating the need for an external isolator unit. In embodiments, transmitter channels and receiver channels share a single lens array and incorporate a compensator block to equalize the transmitter and receiver optical signals in the transceiver. Other embodiments may be described and/or claimed.

    WIRE-BONDING METHODOLOGIES UTILIZING PREFORMED GLASS OPTICAL WIRES FOR MAKING CHIP-TO-CHIP OPTICAL INTERFACES
    10.
    发明申请
    WIRE-BONDING METHODOLOGIES UTILIZING PREFORMED GLASS OPTICAL WIRES FOR MAKING CHIP-TO-CHIP OPTICAL INTERFACES 有权

    公开(公告)号：US20220404546A1

    公开(公告)日：2022-12-22

    申请号：US17352098

    申请日：2021-06-18

    Applicant: Intel Corporation

    Inventor： Alexander Krichevsky ,  Boping Xie

    IPC: G02B6/12 ,  G02B6/13 ,  C03B37/025 ,  C03C27/10

    Abstract: A photonic integrated circuit (PIC) package comprising a first die, the first die comprising a first optical waveguide and a first trench extending from a first edge of the first die to the first optical waveguide. The first trench is aligned with the first optical waveguide. A second die comprises a second optical waveguide and a second trench extending from a second edge of the second die to the second optical waveguide. The second trench is aligned with the second optical waveguide. An optical wire comprising an uncladded glass fiber comprises a first terminal portion extending within the first trench and a second terminal portion extending within the second trench. The first terminal portion is aligned with the first optical waveguide and the second terminal portion is aligned with the second optical waveguide.

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